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1. 发明授权

US07197007B2 Method for generating 2D OVSF codes in multicarrier DS-CDMA systems 有权
标题翻译：用于在多载波DS-CDMA系统中生成2D OVSF码的方法
公开(公告)号：US07197007B2
公开(公告)日：2007-03-27
申请号：US10063771
申请日：2002-05-11
申请人： Guu-Chang Yang , Chia-Ming Yang , Pei-Hsuan Lin
发明人： Guu-Chang Yang , Chia-Ming Yang , Pei-Hsuan Lin
IPC分类号： H04J11/00
CPC分类号： H04J13/0044 , H04J13/12 , H04L5/026
摘要： A code tree of two-dimensional orthogonal variable spreading factor (2D-OVSF) code matrices for a multicarrier direct-sequence code-division multiple-access (MC-DS/CDMA) communications system is generated by providing two sets of 2×2 orthogonal matrices {A(1)(2×2), A(2)(2×2)} and {B(1)(2×2), B(2)(2×2)}. The first set of 2×2 matrices is used to generate a pair of sibling nodes in the code tree that respectively represent matrices A(1)(2×2α) and A(2)(2×2α) by iterating the relationship: A(1)(2×21+β)=[A(1)(2×2β)A(2)(2×2β)], The matrices A(1)(2×2α) and A(2)(2×2α) are A(2)(2×21+β)=[A(1)(2×2β)−A(2)(2×2β)]. used to generate a child node of one of the sibling nodes. The child node contains an M×N matrix, which is found by iterating the relationship: A(i−1)(O×P)=[B(1)(2×2){circle around (×)}A(i/2)(0/2×P/2)] where {circle around (×)} indicates a Kronecker product. A(i)(O×P)=[B(2)(2×2){circle around (×)}A(i/2)(0/2×P/2)],
摘要翻译：通过提供两组2x2正交矩阵来生成用于多载波直接序列码分多址（MC-DS / CDMA）通信系统的二维正交可变扩频因子（2D-OVSF）码矩阵的码树（2）/（2×2），（2×2），和（B）（1）（2x2），（2）（2x2）}。第一组2x2矩阵用于在代码树中产生一对分别表示矩阵A 1（2）和（2）的兄弟节点＆lt; / SUP2＆gt;＆lt; / SUB＆gt;＆lt; / SUP＆gt;＆lt; / SUP＆gt;（2） SUB> _）

2. 发明授权

US07346038B2 Method for generating 2D OVSF codes in multicarrier DS-CDMA systems 失效
公开(公告)号：US07346038B2
公开(公告)日：2008-03-18
申请号：US10406359
申请日：2003-04-04
申请人： Guu-Chang Yang , Chia-Ming Yang , Pei-Hsuan Lin
发明人： Guu-Chang Yang , Chia-Ming Yang , Pei-Hsuan Lin
IPC分类号： H04B7/216
CPC分类号： H04L5/026 , H04J13/0044 , H04J13/12
摘要： A multicarrier direct-sequence code-division multiple-access (MC-DS/CDMA) communications system is provided. A code tree of two-dimensional orthogonal variable spreading factor (2D-OVSF) codes is then generated for the system. To generate the code tree, a set of existing M1×N1 2D-OVSF matrices, in the form of A(i)(M1×N1) for i={1, 2, . . . , K1} is selected as seed matrices. M1 represents the number of available frequency carriers in the MC-DS/CDMA system, and N1 represents a spreading factor code length. Another set of existing M2×N2 2D-OVSF matrices, in the form of B2(i)(M2×N2) for i={1, 2, . . . , K2} is then selected as mapping matrices. The mapping matrices are used to generate corresponding children matrices. These second layer child matrices are M1M2×N1N2 matrices with cardinality K1K2, which are defined by reiterating the relationship: C ( M 1 ⁢ M 2 × N 1 ⁢ N 2 ) ( ( i - 1 ) ⁢ K 2 + 1 ) = B 2 ⁢ ( M 2 × N 2 ) ( 1 ) ⊕ A ( M 1 × N 1 ) ( i ) C ( M 1 ⁢ M 2 × N 1 ⁢ N 2 ) ( ( i - 1 ) ⁢ K 2 + 2 ) = B 2 ⁢ ( M 2 × N 2 ) ( 2 ) ⊕ A ( M 1 × N 1 ) ( i ) ⁢ ⋯ C ( M 1 ⁢ M 2 × N 1 ⁢ N 2 ) ( ( i - 1 ) ⁢ K 2 + K 2 ) = B 2 ⁢ ( M 2 × N 2 ) ( K 2 ) ⊕ A ( M 1 × N 1 ) ( i ) where ⊕ indicates a Kronecker product, and i=1, 2, 3, 4, . . . , K1.

3. 发明授权

US08410530B2 Sensitive field effect transistor apparatus 有权
标题翻译：敏感场效应晶体管装置
公开(公告)号：US08410530B2
公开(公告)日：2013-04-02
申请号：US12591466
申请日：2009-11-20
申请人： Chao-Sung Lai , Cheng-En Lue , Chia-Ming Yang , Szu-Chieh Wang
发明人： Chao-Sung Lai , Cheng-En Lue , Chia-Ming Yang , Szu-Chieh Wang
IPC分类号： H01L29/78
CPC分类号： G01N27/4148
摘要： The invention discloses a sensitive field effect transistor apparatus, which uses an inorganic membrane to sense hydrogen ions. The invention adopts the membrane with high deformation stress. The sensitivity of the sensitive membrane to hydrogen ions is adjusted through altering the membrane thickness and changing the substrate type and doped concentration. A differential amplifier is used to read a signal to form the inorganic Ion Sensitive Field Effect Transistor/Reference Field Effect Transistor apparatus.
摘要翻译：本发明公开了一种使用无机膜感测氢离子的敏感场效应晶体管装置。本发明采用具有高变形应力的膜。敏感膜对氢离子的敏感性通过改变膜厚度和改变衬底类型和掺杂浓度来调节。差分放大器用于读取信号以形成无机离子敏感场效应晶体管/参考场效应晶体管装置。

4. 发明申请

US20100291703A1 BIOSENSOR 审中-公开
标题翻译：生物传感器
公开(公告)号：US20100291703A1
公开(公告)日：2010-11-18
申请号：US12775924
申请日：2010-05-07
申请人： Hsin- Fei Meng , Sheng-Fu Hong , Yu-Chiang Chao , Yun-Ru Horng , Pei-Yu Tsai , Chia-Ming Yang
发明人： Hsin- Fei Meng , Sheng-Fu Hong , Yu-Chiang Chao , Yun-Ru Horng , Pei-Yu Tsai , Chia-Ming Yang
IPC分类号： G01N21/76 , G01J1/58 , G01N30/00
CPC分类号： G01N21/645 , G01N2021/7786 , G01N2201/062
摘要： A biosensor applicable to an environment suitable for biosensing is provided, which is a solid-state element for performing detections in an aqueous environment. The biosensor at least includes a biosensing layer, a light-emitting diode and a photodiode. The biosensing layer causes changes in the light-emitting property thereof after absorbing, adsorbing and/or bonding with a biological substance released during in vivo signal transduction in an organism, and the rays of light generated by excitation of the light-emitting diode causes the biosensing layer to emit fluorescence. After the fluorescence is absorbed by the photodiode, it can be converted into an interpretable photocurrent signal. Afterwards, the meaning of the in vivo signal transduction can be understood by interpretation of the photocurrent signal.
摘要翻译：提供适用于适合于生物传感的环境的生物传感器，其是用于在水性环境中进行检测的固态元件。生物传感器至少包括生物传感层，发光二极管和光电二极管。生物传感层在生物体内的体内信号转导中释放的生物物质吸收，吸附和/或粘合后引起其发光特性的变化，并且通过发光二极管的激发产生的光线导致生物传感层发射荧光。荧光被光电二极管吸收后，可将其转换为可解释的光电流信号。之后，通过解释光电流信号可以了解体内信号转导的意义。

5. 发明授权

US07544606B2 Method to implement stress free polishing 有权
标题翻译：实施无压力抛光的方法
公开(公告)号：US07544606B2
公开(公告)日：2009-06-09
申请号：US11142215
申请日：2005-06-01
申请人： Jean Wang , Chia-Ming Yang , Henry Lo , Joshua Tseng
发明人： Jean Wang , Chia-Ming Yang , Henry Lo , Joshua Tseng
IPC分类号： H01L21/4763
CPC分类号： H01L21/76843 , H01L21/02068 , H01L21/32115 , H01L21/7684 , H01L21/76877
摘要： A method of forming a metal feature in a low-k dielectric layer is provided. The method includes forming an opening in a low-k dielectric layer, forming a metal layer having a substantially planar surface over the low-k dielectric layer using spin-on method, and stress free polishing the metal layer. Preferably, the metal layer comprises copper or copper alloys. The metal layer preferably includes a first sub layer having a substantially non-planar surface and a second sub layer having a substantially planar surface on the first sub layer.
摘要翻译：提供了一种在低k电介质层中形成金属特征的方法。该方法包括在低k电介质层中形成开口，使用旋转方法在低k电介质层上形成具有基本平坦表面的金属层，并且对金属层进行无应力的研磨。优选地，金属层包括铜或铜合金。金属层优选地包括具有基本非平面表面的第一子层和在第一子层上具有基本平坦表面的第二子层。

6. 发明授权

US07106231B2 Video signal processing system including analog to digital converter and related method for calibrating analog to digital converter 有权
标题翻译：视频信号处理系统包括模数转换器和相关的校准模数转换器的方法
公开(公告)号：US07106231B2
公开(公告)日：2006-09-12
申请号：US10904159
申请日：2004-10-27
申请人： Sterling Smith , Chia-Ming Yang , Chao-Ping Huang , Horng-Der Chang , Henry Tin-Hang Yung
发明人： Sterling Smith , Chia-Ming Yang , Chao-Ping Huang , Horng-Der Chang , Henry Tin-Hang Yung
IPC分类号： H03M1/10 , H03M1/12 , H04N5/18
CPC分类号： H03M1/1028 , H03M1/12
摘要： A video signal processing system capable of adjusting errors and related methods are introduced. The video signal processing system and related calibration methods utilize the characteristic of periodic breaks of video signals to perform various kinds of calibrations including gain calibration of ADC, offset calibration of ADC, dc-level shifting of input signals, and quatization errors spreading by adding analog random signals to input video signals. The required high accuracy in video signal processing systems is achieved in the present invention with the claimed calibration methods.
摘要翻译：介绍了能够调整错误的视频信号处理系统和相关方法。视频信号处理系统和相关校准方法利用视频信号周期性中断的特点，执行各种校准，包括ADC的增益校准，ADC的偏移校准，输入信号的直流电平移位，以及通过添加模拟随机信号输入视频信号。在所要求的校准方法的本发明中，在视频信号处理系统中所需的高精度是实现的。

7. 发明授权

US07084795B2 Video signal processing system with a dynamic ADC calibration loop and related methods 有权
标题翻译：视频信号处理系统采用动态ADC校准循环及相关方法
公开(公告)号：US07084795B2
公开(公告)日：2006-08-01
申请号：US10908741
申请日：2005-05-24
申请人： Sterling Smith , Chia-Ming Yang
发明人： Sterling Smith , Chia-Ming Yang
IPC分类号： H03M1/10
CPC分类号： H03M1/1028 , H03M1/12
摘要： A video signal processing system with a dynamic calibration loop of an ADC comprises a calibration switch for transmitting signals according to a control signal; a reference switch module for transmitting reference voltages according to a plurality of control signals; a reference voltage generator coupled to the reference switch module for providing the reference voltages; a coarse tuner coupled to the calibration switch and the reference switch module for coarse-tuning received signals; an ADC coupled to the coarse tuner for converting analog signals to digital signals; a fine-tuner coupled to the ADC for fine-tuning received signals; and a calibration logic module for controlling the calibration switch, the reference switch module, the coarse tuner, the ADC, and the fine tuner according to signals outputted from the fine tuner, so as to compensate errors of the ADC.
摘要翻译：具有ADC的动态校准环路的视频信号处理系统包括用于根据控制信号发送信号的校准开关; 参考开关模块，用于根据多个控制信号传输参考电压; 耦合到参考开关模块的参考电压发生器，用于提供参考电压; 耦合到校准开关的粗调谐器和用于对接收信号进行粗调的参考开关模块; 耦合到粗调谐器的ADC，用于将模拟信号转换成数字信号; 耦合到ADC的微调器，用于微调接收信号; 以及校准逻辑模块，用于根据从精细调谐器输出的信号来控制校准开关，参考开关模块，粗调谐器，ADC和精细调谐器，以补偿ADC的误差。

8. 发明授权

US06897147B1 Solution for copper hillock induced by thermal strain with buffer zone for strain relaxation 有权
标题翻译：用于应变松弛的缓冲区的热应变诱导的铜小丘的解决方案
公开(公告)号：US06897147B1
公开(公告)日：2005-05-24
申请号：US10758315
申请日：2004-01-15
申请人： Shin-Yeu Tsai , Po-Hsiung Leu , Chia-Ming Yang , Tsang-Yu Liu , Yun-Da Fan , Chen-Peng Fan
发明人： Shin-Yeu Tsai , Po-Hsiung Leu , Chia-Ming Yang , Tsang-Yu Liu , Yun-Da Fan , Chen-Peng Fan
IPC分类号： H01L21/28 , H01L21/3205 , H01L21/44 , H01L21/768
CPC分类号： H01L21/76838
摘要： A method of reducing copper hillocks in copper metallization is described. An opening is made through a dielectric layer overlying a substrate on a wafer. A copper layer is formed overlying the dielectric layer and completely filling the opening. The copper layer is polished back to leave the copper layer only within the opening. Copper hillocks are reduced by applying F ions to the copper layer to form a buffer zone on a surface of the copper layer and in-situ depositing a capping layer overlying the copper layer. The F ions remove copper oxide naturally formed on the copper surface and the buffer zone transfers thermal vertical strain in the copper to horizontal strain thereby preventing formation of copper hillocks.
摘要翻译：描述了一种在铜金属化中减少铜小丘的方法。通过覆盖晶片上的衬底的电介质层形成开口。形成覆盖在电介质层上并完全填充开口的铜层。铜层被抛光回去，仅在开口内留下铜层。通过将铜离子施加到铜层以在铜层的表面上形成缓冲区并原位沉积覆盖铜层的覆盖层来减少铜小丘。 F离子去除在铜表面上自然形成的氧化铜，缓冲区将铜中的热垂直应变转移到水平应变，从而防止形成铜海丘。

9. 发明授权

US06847111B2 Semiconductor device with heat-dissipating capability 有权
标题翻译：具有散热能力的半导体器件
公开(公告)号：US06847111B2
公开(公告)日：2005-01-25
申请号：US10683911
申请日：2003-10-10
申请人： Chia-Ming Yang , Shu-Fen Liang , Shu-Min Chou
发明人： Chia-Ming Yang , Shu-Fen Liang , Shu-Min Chou
IPC分类号： H01L23/31 , H01L23/433 , H01L23/10 , H01L23/34
CPC分类号： H01L24/49 , H01L23/3128 , H01L23/4334 , H01L24/48 , H01L2224/0401 , H01L2224/05554 , H01L2224/05599 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/49171 , H01L2224/49433 , H01L2224/85399 , H01L2924/00014 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： In a semiconductor device, a semiconductor chip is mounted on an inner seat body of a heat-dissipating frame mounted on a top surface of a dielectric substrate. Each of multiple bonding wires interconnects electrically one of multiple contact pads on the semiconductor chip and a corresponding one of multiple first conductive contacts on the top surface of the substrate so as to establish electrical connection between the contact pads on the semiconductor chip and multiple second conductive contacts on a bottom surface of the substrate via the first conductive contacts and circuit traces of the substrate. An encapsulant encapsulates the bonding wires, the semiconductor chip, and the inner seat body, a portion of an outer frame body of the heat-dissipating frame, and multiple that interconnect portions interconnecting heat-conductively the inner seat body and the outer frame body.
摘要翻译：在半导体装置中，将半导体芯片安装在安装在电介质基板的上表面上的散热框架的内座体上。多个接合线中的每一个电连接半导体芯片上的多个接触焊盘之一和衬底的顶表面上的多个第一导电接触中的相应一个，以便在半导体芯片上的接触焊盘和多个第二导电之间建立电连接通过基板的第一导电触点和电路迹线在基板的底表面上接触。密封剂封装了接合线，半导体芯片和内座体，散热框架的外框体的一部分，以及将内座体和外框体相互热连接的多个互连部。

10. 发明授权

US06600216B1 Structure of a pin platform for integrated circuit 有权
标题翻译：集成电路引脚平台结构
公开(公告)号：US06600216B1
公开(公告)日：2003-07-29
申请号：US10138481
申请日：2002-05-06
申请人： Wen-Lo Shieh , Chia-Ming Yang , Chen-Fa Tsai , Shu-Fen Liang , Shu-Min Chou
发明人： Wen-Lo Shieh , Chia-Ming Yang , Chen-Fa Tsai , Shu-Fen Liang , Shu-Min Chou
IPC分类号： H01L23495
CPC分类号： H01L23/49541 , H01L23/49503 , H01L24/28 , H01L24/32 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/29007 , H01L2224/32014 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49109 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/078 , H01L2924/10161 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： An improved structure of a pin platform of an integrated circuit having a pin platform body including a chip seat and a plurality of leading plates having their end portions being concentrated on the chip seat and the chip seat being connected to the pin platform body via the connection plate, characterized in that the surrounding of the chip seat is provided with a framing side, and the framing side is connected to a connection plate, and the surface of the chip seat is smaller than the connection surface of the IC to be installed, and the size of the framing side is larger than the size of the connection face of the IC. Therefore, a high performance greenery package is obtained and the ground wire of the IC can be soldered to the framing side, which provides a smooth connection and a communication.
摘要翻译：一种集成电路的销平台的改进结构，其具有包括芯片座的销平台主体和多个前导板，其端部集中在芯片座上，并且芯片座通过连接件连接到销平台主体其特征在于，芯片座的周围设有框架侧，框架侧连接到连接板，并且芯片座的表面小于要安装的IC的连接表面，并且框架侧的尺寸大于IC的连接面的尺寸。因此，获得了高性能的绿色包装，并且IC的接地线可以焊接到框架侧，这提供了平滑的连接和通信。

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