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    • 9. 发明申请
    • Method for measuring ion-implanted semiconductors with improved repeatability
    • 用于测量具有改善的重复性的离子注入半导体的方法
    • US20050195399A1
    • 2005-09-08
    • US11067961
    • 2005-02-28
    • Lena NicolaidesMira BakshiAlex SalnikJon Opsal
    • Lena NicolaidesMira BakshiAlex SalnikJon Opsal
    • G01N21/55
    • G01N21/171H01L22/12
    • The repeatability of wafer uniformity measurements can be increased by taking spatially averaged measurements of wafer response. By increasing the time over which measurements are obtained, the amount of noise can be significantly reduced, thereby improving the repeatability of the measurements. These measurements can be taken at several locations on the wafer to ensure wafer uniformity. In order to get a stable and repeatable assessment of the wafer process, addressing uncertainties related to damage relaxation or incomplete anneal, an anneal decay factor (ADF) characterization can be performed at a distance away from the TW measurement boxes. From the ADF measurement and the spatially averaged measurements of wafer response, a repeatable assessment of the wafer process can be obtained.
    • 通过采用晶圆响应的空间平均测量可以提高晶片均匀性测量的重复性。 通过增加获得测量的时间,可以显着降低噪声量,从而提高测量的重复性。 这些测量可以在晶片上的几个位置进行,以确保晶片的均匀性。 为了获得对晶圆工艺的稳定和可重复的评估,解决与损伤弛豫或不完全退火有关的不确定性,可以在远离TW测量箱的距离处执行退火衰减因子(ADF)表征。 从ADF测量和晶片响应的空间平均测量,可以获得晶片工艺的可重复评估。
    • 10. 发明授权
    • Measuring characteristics of ultra-shallow junctions
    • 超浅结点的测量特性
    • US08120776B1
    • 2012-02-21
    • US12545015
    • 2009-08-20
    • Alex SalnikLena Nicolaides
    • Alex SalnikLena Nicolaides
    • G01N21/55
    • G01N21/1717G01N2021/1725
    • Carrier activation and end-of-range defect density of ultra-shallow junctions in integrated circuits are determined using modulated optical reflectance signals, DC reflectances of pump or probe laser beams, and in-phase and quadrature signal processing. A method for determining characteristics of an ultra-shallow junction includes periodically exciting a region of the substrate using a pump laser beam, and reflecting a probe laser beam from the excited region. A modulated optical reflectance signal is measured along with DC reflectance of the probe laser beam. The modulated optical reflectance signal and DC reflectance are compared with reference signals generated from calibration substrates to determine carrier activation and end-of-range defect density in the junction.
    • 使用调制的光反射信号,泵浦或探针激光束的直流反射以及同相和正交信号处理来确定集成电路中超浅结的载流子激活和终端缺陷密度。 用于确定超浅结的特性的方法包括使用泵浦激光束周期性地激励基板的区域,并且反射来自激发区域的探测激光束。 测量调制的光反射信号与探测激光束的直流反射率一起测量。 将调制的光反射信号和DC反射率与从校准基板产生的参考信号进行比较,以确定接合处的载流子激活和端部范围缺陷密度。