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1. 发明授权

US08853726B2 Light emitting device package and lighting system having the same 有权
标题翻译：具有相同的发光器件封装和照明系统
公开(公告)号：US08853726B2
公开(公告)日：2014-10-07
申请号：US13412667
申请日：2012-03-06
申请人： Gun Kyo Lee , Nak-Hun Kim , Sun Mi Moon
发明人： Gun Kyo Lee , Nak-Hun Kim , Sun Mi Moon
IPC分类号： H01L33/60
CPC分类号： H01L33/60 , H01L33/486 , H01L33/642 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/00014
摘要： Disclosed are a light emitting device package and a lighting system including the same. The light emitting device package includes a first lead frame and a second lead frame disposed on an insulating layer and electrically separated from each other by a separation part, and a light emitting device disposed on the second lead frame and electrically connected to the first lead frame, and the second lead frame includes a through part disposed opposite to the separation part such that the light emitting device is located therebetween.
摘要翻译：公开了一种发光器件封装和包括该发光器件封装的照明系统。发光器件封装包括：第一引线框架和第二引线框架，其设置在绝缘层上并通过分离部分彼此电分离;以及发光器件，其设置在第二引线框架上并电连接到第一引线框架并且第二引线框架包括与分离部分相对设置的通孔，使得发光器件位于它们之间。

2. 发明申请

US20130049045A1 LIGHT EMITTING DEVICE PACKAGE 有权
标题翻译：发光装置包装
公开(公告)号：US20130049045A1
公开(公告)日：2013-02-28
申请号：US13412813
申请日：2012-03-06
申请人： Gun Kyo LEE , Nak-Hun Kim , Sun Mi Moon
发明人： Gun Kyo LEE , Nak-Hun Kim , Sun Mi Moon
IPC分类号： H01L33/60
CPC分类号： H01L33/54 , H01L33/44 , H01L33/486 , H01L33/505 , H01L33/62 , H01L2224/48091 , H01L2224/49107 , H01L2924/00014
摘要： Embodiments disclose a light emitting device package including an insulating layer, a first lead frame and a second lead frame disposed on the insulating layer electrically separate from each other, a light emitting device disposed on the second lead frame electrically connected to the first lead frame and the second lead frame, the light emitting device includes a light emitting structure having a first conduction type semiconductor layer, an active layer, and a second conduction type semiconductor layer and a lens which encloses the light emitting device, wherein the insulating layer has an end portion projected beyond at least one of an end portion of the first lead frame and an end portion of the second lead frame, to form an opened region which exposes the insulating layer.
摘要翻译：实施例公开了一种发光器件封装，其包括绝缘层，第一引线框架和布置在彼此电分离的绝缘层上的第二引线框架，布置在电连接到第一引线框架的第二引线框架上的发光器件，第二引线框架，发光器件包括具有第一导电类型半导体层，有源层和第二导电类型半导体层的发光结构和封装发光器件的透镜，其中绝缘层具有端部突出到第一引线框架的端部和第二引线框架的端部中的至少一个上的部分，以形成暴露绝缘层的开放区域。

3. 发明申请

US20130049044A1 LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM HAVING THE SAME 有权
标题翻译：具有发光装置的灯具和照明系统
公开(公告)号：US20130049044A1
公开(公告)日：2013-02-28
申请号：US13412667
申请日：2012-03-06
申请人： Gun Kyo Lee , Nak-Hun Kim , Sun Mi Moon
发明人： Gun Kyo Lee , Nak-Hun Kim , Sun Mi Moon
IPC分类号： H01L33/36 , H01L33/60 , H01L33/50 , H01L33/58
CPC分类号： H01L33/60 , H01L33/486 , H01L33/642 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/00014
摘要： Disclosed are a light emitting device package and a lighting system including the same. The light emitting device package includes a first lead frame and a second lead frame disposed on an insulating layer and electrically separated from each other by a separation part, and a light emitting device disposed on the second lead frame and electrically connected to the first lead frame, and the second lead frame includes a through part disposed opposite to the separation part such that the light emitting device is located therebetween.
摘要翻译：公开了一种发光器件封装和包括该发光器件封装的照明系统。发光器件封装包括：第一引线框架和第二引线框架，其设置在绝缘层上并通过分离部分彼此电分离;以及发光器件，其设置在第二引线框架上并电连接到第一引线框架并且第二引线框架包括与分离部分相对设置的通孔，使得发光器件位于它们之间。

4. 发明授权

US09397274B2 Light emitting device package 有权
标题翻译：发光装置封装
公开(公告)号：US09397274B2
公开(公告)日：2016-07-19
申请号：US13412813
申请日：2012-03-06
申请人： Gun Kyo Lee , Nak-Hun Kim , Sun Mi Moon
发明人： Gun Kyo Lee , Nak-Hun Kim , Sun Mi Moon
IPC分类号： H01L33/60 , H01L33/54 , H01L33/48 , H01L33/50 , H01L33/44 , H01L33/62
CPC分类号： H01L33/54 , H01L33/44 , H01L33/486 , H01L33/505 , H01L33/62 , H01L2224/48091 , H01L2224/49107 , H01L2924/00014
摘要： Embodiments disclose a light emitting device package including an insulating layer, a first lead frame and a second lead frame disposed on the insulating layer electrically separate from each other, a light emitting device disposed on the second lead frame electrically connected to the first lead frame and the second lead frame, the light emitting device includes a light emitting structure having a first conduction type semiconductor layer, an active layer, and a second conduction type semiconductor layer and a lens which encloses the light emitting device, wherein the insulating layer has an end portion projected beyond at least one of an end portion of the first lead frame and an end portion of the second lead frame, to form an opened region which exposes the insulating layer.
摘要翻译：实施例公开了一种发光器件封装，其包括绝缘层，第一引线框架和布置在彼此电分离的绝缘层上的第二引线框架，布置在电连接到第一引线框架的第二引线框架上的发光器件，第二引线框架，发光器件包括具有第一导电类型半导体层，有源层和第二导电类型半导体层的发光结构和封装发光器件的透镜，其中绝缘层具有端部突出到第一引线框架的端部和第二引线框架的端部中的至少一个上的部分，以形成暴露绝缘层的开放区域。

5. 发明授权

US09171998B2 Light emitting lamp 有权
标题翻译：发光灯
公开(公告)号：US09171998B2
公开(公告)日：2015-10-27
申请号：US13738800
申请日：2013-01-10
申请人： Nam Seok Oh , Young Jun Cho , Kwang Kyu Choi , Young Min Moon , Sun Mi Moon
发明人： Nam Seok Oh , Young Jun Cho , Kwang Kyu Choi , Young Min Moon , Sun Mi Moon
IPC分类号： H01L33/48 , H01L33/38 , H01L33/08 , F21S8/10 , F21V8/00 , G09G3/34
CPC分类号： H01L33/08 , F21S43/14 , F21S43/15 , F21S43/19 , F21S43/195 , F21S43/237 , F21S43/245 , F21S43/249 , G02B6/0021 , G02B6/0041 , G02B6/005 , G02B6/0051 , G02B6/0055 , G02B6/0061 , G02B6/0073 , G02B6/0078 , G02B6/0083 , G02B6/0085 , G09G3/3413 , H01L33/38 , H01L33/387 , H01L33/48 , H01L33/62 , H01L2224/45139 , H01L2224/48091 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a light emitting lamp including a light source module including at least one light source and a light guide layer disposed on a substrate burying the at least one light source, and a housing accommodating the light source module, and the at least one light source includes a body having a cavity, a first lead frame including one end exposed to the cavity and the other end passing through the body and exposed to one surface of the body, a second lead frame including one end exposed to one portion of the surface of the body, the other end exposed to the another portion of the surface of the body, and an intermediate part exposed to the cavity, and at least one light emitting chip including a first semiconductor layer, an active layer and a second semiconductor layer, and disposed on the first lead frame.
摘要翻译：公开了一种发光灯，其包括光源模块，该光源模块包括至少一个光源和设置在埋入至少一个光源的基板上的导光层，以及容纳光源模块的壳体，以及至少一个光源包括具有空腔的主体，包括一端暴露于空腔的第一引线框架和穿过主体并暴露于主体的一个表面的另一端;第二引线框架，其包括一端暴露于表面的一部分主体，另一端暴露于主体的表面的另一部分，以及暴露于空腔的中间部分，以及包括第一半导体层，有源层和第二半导体层的至少一个发光芯片，以及设置在第一引线框架上。

6. 发明申请

US20130264590A1 LIGHT EMITTING LAMP 有权
公开(公告)号：US20130264590A1
公开(公告)日：2013-10-10
申请号：US13738800
申请日：2013-01-10
申请人： Nam Seok OH , Young Jun Cho , Kwang Kyu Choi , Young Min Moon , Sun Mi Moon
发明人： Nam Seok OH , Young Jun Cho , Kwang Kyu Choi , Young Min Moon , Sun Mi Moon
IPC分类号： H01L33/08
CPC分类号： H01L33/08 , F21S43/14 , F21S43/15 , F21S43/19 , F21S43/195 , F21S43/237 , F21S43/245 , F21S43/249 , G02B6/0021 , G02B6/0041 , G02B6/005 , G02B6/0051 , G02B6/0055 , G02B6/0061 , G02B6/0073 , G02B6/0078 , G02B6/0083 , G02B6/0085 , G09G3/3413 , H01L33/38 , H01L33/387 , H01L33/48 , H01L33/62 , H01L2224/45139 , H01L2224/48091 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a light emitting lamp including a light source module including at least one light source and a light guide layer disposed on a substrate burying the at least one light source, and a housing accommodating the light source module, and the at least one light source includes a body having a cavity, a first lead frame including one end exposed to the cavity and the other end passing through the body and exposed to one surface of the body, a second lead frame including one end exposed to one portion of the surface of the body, the other end exposed to the another portion of the surface of the body, and an intermediate part exposed to the cavity, and at least one light emitting chip including a first semiconductor layer, an active layer and a second semiconductor layer, and disposed on the first lead frame.

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