专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20130049044A1 LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM HAVING THE SAME 有权
标题翻译：具有发光装置的灯具和照明系统
公开(公告)号：US20130049044A1
公开(公告)日：2013-02-28
申请号：US13412667
申请日：2012-03-06
申请人： Gun Kyo Lee , Nak-Hun Kim , Sun Mi Moon
发明人： Gun Kyo Lee , Nak-Hun Kim , Sun Mi Moon
IPC分类号： H01L33/36 , H01L33/60 , H01L33/50 , H01L33/58
CPC分类号： H01L33/60 , H01L33/486 , H01L33/642 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/00014
摘要： Disclosed are a light emitting device package and a lighting system including the same. The light emitting device package includes a first lead frame and a second lead frame disposed on an insulating layer and electrically separated from each other by a separation part, and a light emitting device disposed on the second lead frame and electrically connected to the first lead frame, and the second lead frame includes a through part disposed opposite to the separation part such that the light emitting device is located therebetween.
摘要翻译：公开了一种发光器件封装和包括该发光器件封装的照明系统。发光器件封装包括：第一引线框架和第二引线框架，其设置在绝缘层上并通过分离部分彼此电分离;以及发光器件，其设置在第二引线框架上并电连接到第一引线框架并且第二引线框架包括与分离部分相对设置的通孔，使得发光器件位于它们之间。

2. 发明授权

US08853726B2 Light emitting device package and lighting system having the same 有权
标题翻译：具有相同的发光器件封装和照明系统
公开(公告)号：US08853726B2
公开(公告)日：2014-10-07
申请号：US13412667
申请日：2012-03-06
申请人： Gun Kyo Lee , Nak-Hun Kim , Sun Mi Moon
发明人： Gun Kyo Lee , Nak-Hun Kim , Sun Mi Moon
IPC分类号： H01L33/60
CPC分类号： H01L33/60 , H01L33/486 , H01L33/642 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/00014
摘要： Disclosed are a light emitting device package and a lighting system including the same. The light emitting device package includes a first lead frame and a second lead frame disposed on an insulating layer and electrically separated from each other by a separation part, and a light emitting device disposed on the second lead frame and electrically connected to the first lead frame, and the second lead frame includes a through part disposed opposite to the separation part such that the light emitting device is located therebetween.
摘要翻译：公开了一种发光器件封装和包括该发光器件封装的照明系统。发光器件封装包括：第一引线框架和第二引线框架，其设置在绝缘层上并通过分离部分彼此电分离;以及发光器件，其设置在第二引线框架上并电连接到第一引线框架并且第二引线框架包括与分离部分相对设置的通孔，使得发光器件位于它们之间。

3. 发明申请

US20130105847A1 LIGHT EMITTING DEVICE PACKAGE, LIGHTING DEVICE INCLUDING THE SAME, AND IMAGE DISPLAY DEVICE 有权
标题翻译：发光装置封装，包括其的照明装置和图像显示装置
公开(公告)号：US20130105847A1
公开(公告)日：2013-05-02
申请号：US13662853
申请日：2012-10-29
申请人： Sun Mi MOON , Gun Kyo LEE , Nak Hun KIM
发明人： Sun Mi MOON , Gun Kyo LEE , Nak Hun KIM
IPC分类号： H01L33/08 , H01L33/50
CPC分类号： H01L33/58 , G02F1/133603 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2224/45139 , H01L2224/48091 , H01L2924/1815 , H01L2933/0033 , H01L2924/00014 , H01L2924/00
摘要： Provided are a light emitting device package, a lighting device, and an image display device. The light emitting device package comprises an electrode layer comprising first and second electrode layers spaced from each other, a recess part in a portion of the first electrode layer, a light emitting device on the recess part of the first electrode layer, a reflective layer on the electrode layer, a resin layer on the light emitting device of the recess part of the first electrode layer, a lens on the resin layer and the reflective layer, an interface coupling layer at least partially contacting the lens, the interface coupling layer being disposed on one surface of the electrode layer, and an insulation layer pattern on the other surface of the electrode layer.
摘要翻译：提供了发光器件封装，照明器件和图像显示器件。发光器件封装包括电极层，其包括彼此间隔开的第一和第二电极层，第一电极层的一部分中的凹部，第一电极层的凹部上的发光器件，电极层，第一电极层的凹部的发光元件上的树脂层，树脂层上的透镜和反射层，与透镜至少部分接触的界面耦合层，配置界面结合层在电极层的一个表面上，在电极层的另一个表面上具有绝缘层图案。

4. 发明申请

US20130049045A1 LIGHT EMITTING DEVICE PACKAGE 有权
标题翻译：发光装置包装
公开(公告)号：US20130049045A1
公开(公告)日：2013-02-28
申请号：US13412813
申请日：2012-03-06
申请人： Gun Kyo LEE , Nak-Hun Kim , Sun Mi Moon
发明人： Gun Kyo LEE , Nak-Hun Kim , Sun Mi Moon
IPC分类号： H01L33/60
CPC分类号： H01L33/54 , H01L33/44 , H01L33/486 , H01L33/505 , H01L33/62 , H01L2224/48091 , H01L2224/49107 , H01L2924/00014
摘要： Embodiments disclose a light emitting device package including an insulating layer, a first lead frame and a second lead frame disposed on the insulating layer electrically separate from each other, a light emitting device disposed on the second lead frame electrically connected to the first lead frame and the second lead frame, the light emitting device includes a light emitting structure having a first conduction type semiconductor layer, an active layer, and a second conduction type semiconductor layer and a lens which encloses the light emitting device, wherein the insulating layer has an end portion projected beyond at least one of an end portion of the first lead frame and an end portion of the second lead frame, to form an opened region which exposes the insulating layer.
摘要翻译：实施例公开了一种发光器件封装，其包括绝缘层，第一引线框架和布置在彼此电分离的绝缘层上的第二引线框架，布置在电连接到第一引线框架的第二引线框架上的发光器件，第二引线框架，发光器件包括具有第一导电类型半导体层，有源层和第二导电类型半导体层的发光结构和封装发光器件的透镜，其中绝缘层具有端部突出到第一引线框架的端部和第二引线框架的端部中的至少一个上的部分，以形成暴露绝缘层的开放区域。

5. 发明授权

US09397274B2 Light emitting device package 有权
标题翻译：发光装置封装
公开(公告)号：US09397274B2
公开(公告)日：2016-07-19
申请号：US13412813
申请日：2012-03-06
申请人： Gun Kyo Lee , Nak-Hun Kim , Sun Mi Moon
发明人： Gun Kyo Lee , Nak-Hun Kim , Sun Mi Moon
IPC分类号： H01L33/60 , H01L33/54 , H01L33/48 , H01L33/50 , H01L33/44 , H01L33/62
CPC分类号： H01L33/54 , H01L33/44 , H01L33/486 , H01L33/505 , H01L33/62 , H01L2224/48091 , H01L2224/49107 , H01L2924/00014
摘要： Embodiments disclose a light emitting device package including an insulating layer, a first lead frame and a second lead frame disposed on the insulating layer electrically separate from each other, a light emitting device disposed on the second lead frame electrically connected to the first lead frame and the second lead frame, the light emitting device includes a light emitting structure having a first conduction type semiconductor layer, an active layer, and a second conduction type semiconductor layer and a lens which encloses the light emitting device, wherein the insulating layer has an end portion projected beyond at least one of an end portion of the first lead frame and an end portion of the second lead frame, to form an opened region which exposes the insulating layer.
摘要翻译：实施例公开了一种发光器件封装，其包括绝缘层，第一引线框架和布置在彼此电分离的绝缘层上的第二引线框架，布置在电连接到第一引线框架的第二引线框架上的发光器件，第二引线框架，发光器件包括具有第一导电类型半导体层，有源层和第二导电类型半导体层的发光结构和封装发光器件的透镜，其中绝缘层具有端部突出到第一引线框架的端部和第二引线框架的端部中的至少一个上的部分，以形成暴露绝缘层的开放区域。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式