专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5825620A Enhanced air cooling system with attached cooling unit 失效
公开(公告)号：US5825620A
公开(公告)日：1998-10-20
申请号：US769607
申请日：1996-12-18
申请人： Gregory Martin Chrysler , Richard Chao-Fan Chu
发明人： Gregory Martin Chrysler , Richard Chao-Fan Chu
IPC分类号： H05K7/20
CPC分类号： H05K7/206
摘要： A method and apparatus which provide field upgradability of an electrical system's air cooling capacity is provided. In particular, air-moving devices are disposed in an external enclosure which is mated with a base unit in such a way as to convert one of the base unit's exhaust ports to an added inlet port. Accordingly, thermal upgradability in the field is easily provided by removing lower capacity interior blowers, by providing and using an access port into the middle of the old air flow path and by attaching an exterior unit having increased air-moving capacity.

2. 发明授权

US5758418A Method of making an ultra high-density, high-performance heat sink 失效
标题翻译：制造超高密度，高性能散热片的方法
公开(公告)号：US5758418A
公开(公告)日：1998-06-02
申请号：US587865
申请日：1996-01-11
申请人： Gregory Martin Chrysler , Richard Chao-Fan Chu
发明人： Gregory Martin Chrysler , Richard Chao-Fan Chu
IPC分类号： B23P15/26 , F28F3/02 , H01L21/48 , H01L23/367 , B23P15/00
CPC分类号： H01L21/4882 , B23P15/26 , F28F3/02 , H01L21/4878 , H01L23/3677 , B23P2700/10 , H01L2924/0002 , Y10T29/4935 , Y10T29/49393
摘要： An efficient heat sink having a high density of fins and a large effective surface area is formed by coiling a flat strip of thermally conductive material in which teeth or millifins have been formed by a stamping operation, for example. A spacer may be employed to insure fin separation. In an alternate embodiment, the strips are stacked. The resulting heat sink is particularly effective in impingement flow cooling of electronic devices, chips, circuits or modules.
摘要翻译：具有高密度翅片和大的有效表面积的高效散热器例如通过卷绕通过冲压操作形成齿或毫米的导热材料的扁平带而形成。可以使用间隔物来确保翅片分离。在替代实施例中，条被堆叠。所得的散热器在电子设备，芯片，电路或模块的冲击流冷却中特别有效。

3. 发明授权

US5761037A Orientation independent evaporator 失效
标题翻译：取向独立蒸发器
公开(公告)号：US5761037A
公开(公告)日：1998-06-02
申请号：US598593
申请日：1996-02-12
申请人： Timothy Merrill Anderson , Gregory Martin Chrysler , Richard Chao-Fan Chu
发明人： Timothy Merrill Anderson , Gregory Martin Chrysler , Richard Chao-Fan Chu
IPC分类号： F28D15/02 , F28D15/04 , H01L23/427 , H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/04 , H01L2224/16
摘要： In accordance with a preferred embodiment of the present invention, an orientation independent evaporator includes a wicking member which also operates as a manifold which possesses a number of surface accessible channels preferably via grooves cut in either side of a slab of wicking material at right angles to one another. The evaporator is, because of the structure of this wicking member, able to be operated in any orientation with respect to a gravitational field. The invention provides an improved evaporator for use in thermosyphons, and in particular, provides an improved mechanism for cooling electronic components.
摘要翻译：根据本发明的优选实施例，独立于取向的蒸发器包括芯吸构件，其还可以作为歧管进行操作，所述歧管具有多个表面可接近的通道，优选地通过在芯片板的任一侧切割的凹槽，另一个。由于该芯吸构件的结构，蒸发器能够相对于重力场以任何方向操作。本发明提供了一种用于热虹吸管的改进的蒸发器，并且特别地，提供了用于冷却电子部件的改进的机构。

4. 发明授权

US5743794A Method for field upgrading of air cooling capacity 失效
标题翻译：空气冷却能力现场升级方法
公开(公告)号：US5743794A
公开(公告)日：1998-04-28
申请号：US769082
申请日：1996-12-18
申请人： Gregory Martin Chrysler , Richard Chao-Fan Chu
发明人： Gregory Martin Chrysler , Richard Chao-Fan Chu
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： H05K7/20572 , G06F1/20
摘要： A method and apparatus which provide field upgradability of an electrical system's air cooling capacity. In particular, air-moving devices are disposed in an external enclosure which is mated with a base unit in such a way as to convert one of the base unit's exhaust ports to an added inlet port. Accordingly, thermal upgradability in the field is easily provided by removing lower capacity interior blowers, by providing and using an access port into the middle of the old air flow path and by attaching an exterior unit having increased air moving capacity.
摘要翻译：提供电气系统空气冷却能力的现场可升级性的方法和装置。特别地，空气移动装置设置在与基座装置配合的外部外壳中，以便将基座单元的排气口中的一个转换成加入的入口。因此，通过在旧的空气流路的中间设置和使用进入口，并且附接具有增加的空气移动能力的外部单元，能够容易地通过移除较低容量的内部鼓风机来提供现场的热可升级性。

5. 发明授权

US06223813B1 Ultra high-density, high-performance heat sink 失效
标题翻译：超高密度，高性能散热器
公开(公告)号：US06223813B1
公开(公告)日：2001-05-01
申请号：US08587866
申请日：1996-01-11
申请人： Gregory Martin Chrysler , Richard Chao-Fan Chu
发明人： Gregory Martin Chrysler , Richard Chao-Fan Chu
IPC分类号： F28F700
CPC分类号： H01L23/3677 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： An efficient heat sink having a high density of fins and a large effective surface area is formed by coiling a flat strip of thermally conductive material in which teeth or millifins have been formed by a stamping operation, for example. A spacer may be employed to insure fin separation. In an alternate embodiment, the strips are stacked. The resulting heat sink is particularly effective in impingement flow cooling of electronic devices, chips, circuits or modules.
摘要翻译：具有高密度翅片和大的有效表面积的高效散热器例如通过卷绕通过冲压操作形成齿或毫米的导热材料的扁平带而形成。可以使用间隔物来确保翅片分离。在替代实施例中，条被堆叠。所得的散热器在电子设备，芯片，电路或模块的冲击流冷却中特别有效。

6. 发明授权

US5926368A Enhanced air cooling system with attached cooling unit 失效
标题翻译：增强型空气冷却系统，带有冷却装置
公开(公告)号：US5926368A
公开(公告)日：1999-07-20
申请号：US47808
申请日：1998-03-25
申请人： Gregory Martin Chrysler , Richard Chao-Fan Chu
发明人： Gregory Martin Chrysler , Richard Chao-Fan Chu
IPC分类号： H05K7/20
CPC分类号： H05K7/206
摘要： A method and apparatus which provide field upgradability of an electrical system's air cooling capacity is provided. In particular, air-moving devices are disposed in an external enclosure which is mated with a base unit in such a way as to convert one of the base unit's exhaust ports to an added inlet port. Accordingly, thermal upgradability in the field is easily provided by removing lower capacity interior blowers, by providing and using an access port into the middle of the old air flow path and by attaching an exterior unit having increased air-moving capacity.
摘要翻译：提供了提供电气系统的空气冷却能力的现场可升级性的方法和装置。特别地，空气移动装置设置在与基座装置配合的外部外壳中，以便将基座单元的排气口中的一个转换成加入的入口。因此，通过在旧的空气流动路径的中间设置和使用进入口并且附接具有增加的空气移动能力的外部单元，通过移除较低容量的内部鼓风机容易地提供现场的热可升级性。

7. 发明授权

US5719745A Extended surface cooling for chip stack applications 失效
标题翻译：用于芯片堆栈应用的扩展表面冷却
公开(公告)号：US5719745A
公开(公告)日：1998-02-17
申请号：US716801
申请日：1996-09-16
申请人： Dereje Agonafer , Timothy Merrill Anderson , Gregory Martin Chrysler , Richard Chao-Fan Chu
发明人： Dereje Agonafer , Timothy Merrill Anderson , Gregory Martin Chrysler , Richard Chao-Fan Chu
IPC分类号： H01L25/065 , H01L25/18 , H05K7/20
CPC分类号： H01L25/18 , H01L25/0657 , H01L2225/06513 , H01L2225/06551 , H01L2225/06582 , H01L2225/06589 , H01L2924/0002
摘要： A heat sink is provided for use with stacks of integrated circuit chips. The heat sink comprises a thermally conductive body having a recess in which the chip stack is disposed. The heat sink also includes fins which extend away from the recess. In one embodiment, fins are provided inside the recess for improved cooling of higher power chips such as a microprocessor which is surrounded by less thermally demanding memory chips.
摘要翻译：提供散热器用于堆叠的集成电路芯片。散热器包括导热体，其具有设置芯片堆叠的凹部。散热器还包括远离凹部延伸的翅片。在一个实施例中，散热片设置在凹槽内部，以改善诸如微处理器之类的较高功率芯片的冷却，所述微处理器由较热要求高的存储器芯片包围。

8. 发明授权

US5097385A Super-position cooling 失效
标题翻译：超级定位冷却
公开(公告)号：US5097385A
公开(公告)日：1992-03-17
申请号：US510756
申请日：1990-04-18
申请人： Richard Chao-Fan Chu , Robert E. Simons , David T. Vader
发明人： Richard Chao-Fan Chu , Robert E. Simons , David T. Vader
IPC分类号： F25D3/10 , H01L23/433 , H01L23/44 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4336 , H01L23/4338 , H01L23/445 , H01L2224/16
摘要： A system and method of cooling which uses both jet impingement and conduction cooling. Conduction cooling is accomplished by placing a cluster of pistons in contact with each chip. The pistons have a rectangular foot at the bottom which contacts the chip. A dielectric coolant, such as liquid nitrogen or fluorocarbon is delivered at the center of each cluster, the fluid flows over the top of the feet, and in the channels between the feet, providing jet enhanced convective cooling at the lower portion of the pistons. Advantageously, the pistons serve as extended surfaces which increase the area over which the forced convection cooling occurs. In a preferred embodiment, microfins protruding from the header sections of each piston further increase the area for heat transfer. In addition, for non-boiling applications, grooves are added to the piston foot surface that contact the chip to insure wetting of the chip-piston interface. The upper portion of the pistons are also immersed in and therefore cooled by the dielectric coolant.

9. 发明授权

US4765397A Immersion cooled circuit module with improved fins 失效
标题翻译：具有改进散热片的浸入式冷却电路模块
公开(公告)号：US4765397A
公开(公告)日：1988-08-23
申请号：US935680
申请日：1986-11-28
申请人： Gregory M. Chrysler , Richard Chao-Fan Chu , Robert E. Simmons
发明人： Gregory M. Chrysler , Richard Chao-Fan Chu , Robert E. Simmons
IPC分类号： H05K7/20 , H01L23/44 , H01L23/473 , H01L23/46
CPC分类号： H01L23/473 , H01L2924/0002 , Y10S165/903
摘要： A circuit module that contains a planar array of chips has an improved fin assembly that transfers heat to a liquid coolant that is circulated through the fins in a single pass so that there is a tendency for the upstream edge of the fins to run cold and the downstream edge to run hot. The module can be immersed in the coolant. A shroud on the fins confines the coolant flow to channels defined by the fins, the shroud, and the base of the fins. The fin assembly is constructed so that the coolant channels are narrowed as a function of the temperature of the liquid coolant. The narrowing channels increase the coolant velocity and thereby improves the heat transfer at what would otherwise become the hot end of the module. The coolant velocity is increased at the appropriate rate to maintain equal cooling along the direction of coolant flow. The narrowing channels can be combined with other techniques for improving heat transfer, and in one embodiment the fin assembly has sets of fins spaced that increase in density along the direction of coolant flow. The increased fin density constricts the channels and thereby increases the coolant velocity. Modules with this fin assembly can be stacked closely together in an enclosure for a processing component. The processing component can hold other heat producing circuit devices either downstream of the finned modules or in a parallel coolant path.
摘要翻译：包含平面芯片阵列的电路模块具有改进的翅片组件，其将热量传递到液体冷却剂，该液体冷却剂在单次通过中通过翅片循环，使得翅片的上游边缘趋于冷，并且下游边缘跑热。模块可以浸在冷却液中。翅片上的护罩将冷却剂流动限制在由翅片，护罩和翅片基部限定的通道中。翅片组件被构造成使得冷却剂通道作为液体冷却剂的温度的函数变窄。变窄的通道增加了冷却剂速度，从而改善了热量传递，否则其将成为模块的热端。冷却剂速度以适当的速率增加，以保持沿冷却剂流动的方向相等的冷却。狭窄的通道可以与用于改善热传递的其它技术相结合，并且在一个实施例中，翅片组件具有沿着冷却剂流动方向间隔开的密度增加的翅片组。增加的翅片密度限制通道，从而增加冷却剂速度。具有该翅片组件的模块可以紧密堆叠在用于处理部件的外壳中。处理部件可以在翅片模块的下游或平行的冷却剂路径中容纳其它制热电路装置。

10. 发明授权

US5170319A Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels 失效
标题翻译：增强的多芯片模块冷却，具有热优化的活塞和紧密耦合的对流冷却通道
公开(公告)号：US5170319A
公开(公告)日：1992-12-08
申请号：US780688
申请日：1991-10-18
申请人： Richard Chao-Fan Chu , Michael J. Ellsworth, Jr. , Gary F. Goth , Robert E. Simons , Michael L. Zumbrunnen
发明人： Richard Chao-Fan Chu , Michael J. Ellsworth, Jr. , Gary F. Goth , Robert E. Simons , Michael L. Zumbrunnen
IPC分类号： H01L23/433 , H01L23/473
CPC分类号： H01L23/4338 , H01L23/473 , H01L2924/0002
摘要： A thermally optimized piston for use in a liquid cooled module. The thermally optimized piston has three distinctive sections, an upper tapered section, a central cylindrical section, and a lower diverging section. In a preferred embodiment, the thermally optimized piston is provided as part of an improved electronic module. The improved electronic module includes enhanced convective cooling channels disposed between the pistons.
摘要翻译：用于液体冷却模块的热优化活塞。热优化的活塞具有三个不同的部分，上部锥形部分，中心圆柱形部分和下部发散部分。在优选实施例中，热优化的活塞被提供为改进的电子模块的一部分。改进的电子模块包括设置在活塞之间的增强的对流冷却通道。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式