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1. 发明授权

US5370178A Convertible cooling module for air or water cooling of electronic circuit components 失效
标题翻译：可转换冷却模块，用于电子电路部件的空气或水冷
公开(公告)号：US5370178A
公开(公告)日：1994-12-06
申请号：US111675
申请日：1993-08-25
申请人： Dereje Agonafer , Timothy M. Anderson , Gregory M. Chrysler , Richard Chao-fan Chu , Robert E. Simons , David T. Vader
发明人： Dereje Agonafer , Timothy M. Anderson , Gregory M. Chrysler , Richard Chao-fan Chu , Robert E. Simons , David T. Vader
IPC分类号： F28F7/00 , H01L23/467 , H01L23/473
CPC分类号： H01L23/473 , H01L23/467 , H01L2924/0002
摘要： A convertible cooling module, especially for use in conjunction with a wide range of computer systems ranging from workstations to massively parallel processors is employable with both air and water cooling systems. In particular, a cooling module is convertible from a heat sink modality to an air cooling modality, and finally to a liquid cooling modality in response to either increased performance demands or an increase in the number of processors or circuit components employed. The conversion may be carried out in the field and provides a flexible and less costly upgradeability path for computer customers.
摘要翻译：一个可转换冷却模块，特别适用于从工作站到大规模并行处理器的各种计算机系统，可与空气和水冷却系统一起使用。特别地，冷却模块可以从散热器模式转换成空气冷却模式，最后可以响应于增加的性能要求或使用的处理器或电路组件的数量的增加而变为液体冷却模式。该转换可以在现场进行，并为计算机客户提供灵活且成本较低的可升级路径。

2. 发明授权

US5097385A Super-position cooling 失效
标题翻译：超级定位冷却
公开(公告)号：US5097385A
公开(公告)日：1992-03-17
申请号：US510756
申请日：1990-04-18
申请人： Richard Chao-Fan Chu , Robert E. Simons , David T. Vader
发明人： Richard Chao-Fan Chu , Robert E. Simons , David T. Vader
IPC分类号： F25D3/10 , H01L23/433 , H01L23/44 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4336 , H01L23/4338 , H01L23/445 , H01L2224/16
摘要： A system and method of cooling which uses both jet impingement and conduction cooling. Conduction cooling is accomplished by placing a cluster of pistons in contact with each chip. The pistons have a rectangular foot at the bottom which contacts the chip. A dielectric coolant, such as liquid nitrogen or fluorocarbon is delivered at the center of each cluster, the fluid flows over the top of the feet, and in the channels between the feet, providing jet enhanced convective cooling at the lower portion of the pistons. Advantageously, the pistons serve as extended surfaces which increase the area over which the forced convection cooling occurs. In a preferred embodiment, microfins protruding from the header sections of each piston further increase the area for heat transfer. In addition, for non-boiling applications, grooves are added to the piston foot surface that contact the chip to insure wetting of the chip-piston interface. The upper portion of the pistons are also immersed in and therefore cooled by the dielectric coolant.

3. 发明授权

US5394299A Topology matched conduction cooling module 失效
标题翻译：拓扑匹配传导冷却模块
公开(公告)号：US5394299A
公开(公告)日：1995-02-28
申请号：US242658
申请日：1994-05-13
申请人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons , David T. Vader
发明人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons , David T. Vader
IPC分类号： H01L23/36 , H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4735 , H01L23/4338 , H01L2224/16
摘要： The pistons of a cold plate frame orient themselves as a result of being free to move along one axis and about two other axes by the reflowing of solder tinning on the external surfaces of the pistons and the walls of the recesses within which the pistons reside. As the pistons are permitted to move freely under a biasing force during the solder reflow the face of the piston will engage with the top surface of an electronic chip against which the piston is engaged. The cooling of the solder after reflow will freeze the position and orientation of the piston to that of the electronic chip and will permit enhanced cooling. The cold plate may be disassembled from and reassembled with the components of the cooling system and the electronic chips while maintaining significantly enhanced cooling capabilities.
摘要翻译：冷板框架的活塞由于通过在活塞的外表面和活塞所在的凹槽的壁上的焊锡镀层的回流而沿着一个轴线和约两个其它轴线自由移动。当在回流焊接期间允许活塞在偏压力下自由移动时，活塞的表面将与活塞接合的电子芯片的顶表面接合。在回流焊后冷却焊料将使活塞的位置和方向冻结到电子芯片的位置和方位，并且将允许增强冷却。冷却板可以与冷却系统和电子芯片的组件分离并重新组装，同时保持显着增强的冷却能力。

4. 发明授权

US5456081A Thermoelectric cooling assembly with optimized fin structure for improved thermal performance and manufacturability 失效
标题翻译：具有优化翅片结构的热电冷却组件，用于改善热性能和可制造性
公开(公告)号：US5456081A
公开(公告)日：1995-10-10
申请号：US222150
申请日：1994-04-01
申请人： Gregory M. Chrysler , Richard C. Chu , Robert E. Simons , David T. Vader
发明人： Gregory M. Chrysler , Richard C. Chu , Robert E. Simons , David T. Vader
IPC分类号： H01L23/38 , H01L35/30 , H01L35/28
CPC分类号： H01L35/30 , H01L23/38 , H01L2924/0002
摘要： A configuration of solid state thermoelectric heat transfer or removal elements is provided to enhance the rate and amount of heat removal from electrical and electronic circuit devices. By rotating the thermoelectric heat transfer modules ninety degrees and by disposing them between the interdigitated fingers of a cold plate and a heat transfer plate possessing fins, improved thermal transfer is produced without the necessity of liquid coolants or moving part cooling devices. Accordingly, a method and apparatus is provided for enhancing heat transfer using thermoelectric modules. One embodiment of the present invention is particularly seen to be easy to manufacture. Additionally, this embodiment also possesses desirable heat transfer characteristics in terms of the cross sections of thermally conductive components.
摘要翻译：提供了固态热电传热或去除元件的结构，以增强从电气和电子电路器件的散热速率和散热量。通过将热电传热模块旋转90度并且将它们设置在冷板的交叉指状物和具有翅片的传热板之间，不需要液体冷却剂或移动部件冷却装置就可以产生改进的热转印。因此，提供了一种用于增强使用热电模块的传热的方法和装置。特别地看到本发明的一个实施例易于制造。此外，该实施例还具有关于导热部件的横截面的期望的热传递特性。

5. 发明授权

US5482113A Convertible heat exchanger for air or water cooling of electronic circuit components and the like 失效
标题翻译：用于电子电路部件等的空气或水冷却的可换热换热器
公开(公告)号：US5482113A
公开(公告)日：1996-01-09
申请号：US111755
申请日：1993-08-25
申请人： Dereje Agonafer , Timothy M. Anderson , Gregory M. Chrysler , Richard C. Chu , Robert E. Simons , David T. Vader
发明人： Dereje Agonafer , Timothy M. Anderson , Gregory M. Chrysler , Richard C. Chu , Robert E. Simons , David T. Vader
IPC分类号： F28D7/16 , F28D1/02 , F28D1/053 , F28F1/32 , F28F9/00 , F28F9/22 , G06F1/20 , H05K7/20
CPC分类号： H05K7/20254 , F28B1/06 , F28D1/024 , F28D1/053 , F28F1/32 , F28F9/001 , F28F9/22 , H05K7/206 , H05K7/20609 , F28F2280/02
摘要： A heat exchanger, especially for use in conjunction with a wide range of computer systems ranging from work stations to massively parallel processors is employable with both air and water cooling systems. In particular, a heat exchanger is provided which is convertible from a heat sink modality to an air cooling modality and finally to a liquid cooling modality in response to either increased performance demands or an increase in the number of processors or circuit components employed. The conversion may be carried out in the field and provides a flexible and less costly upgradeability path for data processing customers.
摘要翻译：特别是与从工作站到大规模并行处理器的广泛的计算机系统结合使用的热交换器可以与空气和水冷却系统一起使用。特别地，提供了一种热交换器，其可以响应于增加的性能要求或使用的处理器或电路部件的数量的增加而从散热器模式转换为空气冷却模式，最后转换为液体冷却模式。该转换可以在现场进行，并为数据处理客户提供灵活且成本较低的可升级路径。

6. 发明授权

US5269372A Intersecting flow network for a cold plate cooling system 失效
标题翻译：冷轧冷却系统的相互流动网络
公开(公告)号：US5269372A
公开(公告)日：1993-12-14
申请号：US047763
申请日：1993-04-15
申请人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons , David T. Vader
发明人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons , David T. Vader
IPC分类号： F28F3/12 , H01L23/473 , F28F7/00
CPC分类号： F28F3/12 , H01L23/473 , H01L2924/0002
摘要： A cold plate for cooling electronic modules and devices is disclosed which incorporates an intersecting flow network. The flow network is designed and devised such that flow paths are arranged in a rectilinear fashion surrounding blocks of material which act as heat sinks. Supply conduits and return conduits for supplying and returning cooling fluid are disposed orthogonally to the flow directions within the flow paths and such that each supply channel is circumscribed by a plurality of return channels, and each return channel is circumscribed by a plurality of supply channels. The arrangement of the supply and return channels insures the shortest possible flow path for the cooling fluid thereby insuring maximum cooling efficiency and minimizing and localizing the temperature rise in the cooling fluid during passage from the supply conduit to the return conduit. With a minimum temperature rise of the cooling fluid over a short flow path, conduction in the cold plate insures optimum uniformity of cooling to the electronic components. The components of the cold plate either may be assembled and clamped or may be rigidly affixed to one another by means of either soldering or braising to form the structure defining the flow channels, conduits and manifold connections necessary for the consistent and uniform circulation of the cooling fluid.
摘要翻译：公开了一种用于冷却电子模块和装置的冷板，其包括相交流网络。设计和设计流动网络，使得流动路径以围绕作为散热器的材料块的直线方式布置。用于供应和返回冷却流体的供应管道和返回管道设置成与流动路径内的流动方向正交，并且使得每个供应通道被多个返回通道限定，并且每个返回通道被多个供应通道限定。供应和返回通道的布置确保了用于冷却流体的最短可能的流动路径，从而确保最大的冷却效率，并且在从供应导管到返回导管的通道期间最小化和定位冷却流体中的温度升高。随着冷却流体在短流路上的最小温升，冷板中的传导确保对电子部件的最佳冷却均匀性。冷板的组件可以被组装和夹紧，或者可以通过焊接或炖制将它们彼此刚性地固定，以形成限定流体通道，管道和歧管连接的结构，以使冷却器的一致和均匀循环流体。

7. 发明授权

US5168348A Impingment cooled compliant heat sink 失效
标题翻译：冲击冷却顺应散热器
公开(公告)号：US5168348A
公开(公告)日：1992-12-01
申请号：US729655
申请日：1991-07-15
申请人： Richard C. Chu , Michael J. Ellsworth, Jr. , David T. Vader
发明人： Richard C. Chu , Michael J. Ellsworth, Jr. , David T. Vader
IPC分类号： H01L23/367 , H01L23/433
CPC分类号： H01L23/4338 , H01L23/367 , H01L23/3672 , H01L23/3677 , H01L23/4336 , H01L2224/16225 , H01L2224/73253
摘要： An impingement cooled compliant heat sink (CHS) is employed to extract heat from an array of computer chips in an electric module. A variety of embodiments and variations are provided. The most basic implementation is a metal sheet that is brought into contact with chips on a multi-chip module, and acts as a spreader plate for jet impingement immersion cooling with fluorocarbon, liquid nitrogen, or other dielectric liquids. This can increase cooling at a given flow rate by increasing the area for heat transfer. Slots and/or holes in teh sheet located between the chip sites serve to: (1) create flexible joints in the sheet between the chips to permit conformity to neighboring chip sites, (2) allow for clearance of decoupling capacitors and other structures on the substrate between the chips, and (3) permit the dielectric coolant to flow through the plate so that there will be no pressure difference across the CHS. The absence of pressure difference across the CHS is designed to render this cooling scheme relatively insensitive to pressure variations in the module.
摘要翻译：使用冲击冷却的顺应性散热器（CHS）从电气模块中的计算机芯片阵列提取热量。提供了各种实施例和变型。最基本的实现是与多芯片模块上的芯片接触的金属片，并且用作用于氟碳化合物，液氮或其它电介质液体的喷射冲击浸没冷却的扩散板。这可以通过增加热传递的面积来增加给定流速下的冷却。位于芯片位置之间的板中的槽和/或孔用于：（1）在芯片之间的片材中创建柔性接头以允许与相邻芯片位置一致，（2）允许去耦电容器和其他结构的间隙芯片之间的基板，和（3）允许电介质冷却剂流过板，使得在CHS之间不存在压差。设计了在CHS之间没有压力差，使得该冷却方案对模块中的压力变化相对不敏感。

8. 发明授权

US5463872A High performance thermal interface for low temperature electronic modules 失效
标题翻译：用于低温电子模块的高性能热接口
公开(公告)号：US5463872A
公开(公告)日：1995-11-07
申请号：US303254
申请日：1994-09-08
申请人： David T. Vader , Vincent C. Vasile
发明人： David T. Vader , Vincent C. Vasile
IPC分类号： H01L23/44 , F25B19/00
CPC分类号： H01L23/445 , H01L2924/0002
摘要： A device and method for cryogenic cooling of electronic components. A mixture of a first non-condensible gas and a second condensible gas is provided within an insulative housing. The non-condensible gas mixture has a partial pressure equal to the desired saturation pressure of the condensible gas. The insulative housing also includes an immersion chamber for housing electronic components. The immersion chamber preferably comprises two retainer parts and provides an module retainer top and a lower coldplate retainer bottom. The module retainer top allows gas to pass through the module retainer portion freely. The condensible gas is then turned into liquid form by a provided condensing means. The condensed liquid thus forms and collects inside the immersion chamber against the coldplate retainer bottom to cool the electronic components placed within. The non-condensible gas permits the condensed liquid to be subcooled.
摘要翻译：电子部件低温冷却的装置和方法。第一不可冷凝气体和第二可冷凝气体的混合物设置在绝缘壳体内。不可冷凝气体混合物具有等于可冷凝气体的期望饱和压力的分压。绝缘壳体还包括用于容纳电子部件的浸没室。浸没室优选地包括两个保持器部件并且提供模块固定器顶部和下部冷板保持器底部。模块固定器顶部允许气体自由地通过模块固定器部分。然后，可冷凝气体通过提供的冷凝装置变成液体形式。因此，冷凝的液体在浸入室内部形成并收集在冷板固定器底部，以冷却放置在其内的电子部件。不可冷凝的气体允许冷凝的液体被过冷。

9. 发明授权

US5303555A Electronics package with improved thermal management by thermoacoustic heat pumping 失效
标题翻译：电子封装，通过热声热泵加热管理
公开(公告)号：US5303555A
公开(公告)日：1994-04-19
申请号：US969709
申请日：1992-10-29
申请人： Gregory M. Chrysler , David T. Vader
发明人： Gregory M. Chrysler , David T. Vader
IPC分类号： F25B9/14 , H01L23/433 , H01L23/467 , F25B9/00
CPC分类号： F25B9/145 , H01L23/4338 , H01L23/467 , F02G2243/54 , F25B2309/1406 , F25B2309/1417 , F25B2309/1421 , F25B2309/1424 , H01L2924/0002 , H01L2924/3011
摘要： Electronic chips are cooled to an efficient operating temperature by engaging their exposed planar surfaces with a heat sink assembly. The heat sink assembly is a part of the cold end heat sink of a thermoacoustic heat pump that utilizes either traveling wave or standing wave heat pumping to transport heat from the cold end heat exchanger to the warm end heat exchanger, utilizing a coaxial pulse tube refrigerator to pump or transport the heat from the electronic chips and the cold end heat exchanger.
摘要翻译：电子芯片通过将其暴露的平坦表面与散热器组件接合而被冷却到有效的工作温度。散热器组件是热声热泵的冷端散热器的一部分，其利用行波或驻波热泵将热量从冷端热交换器传送到热端热交换器，利用同轴脉冲管冰箱从电子芯片和冷端热交换器泵送或输送热量。

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