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    • 2. 发明专利
    • Metal plating method and metal-plated article made by using the same
    • 金属镀层方法和金属制品使用相同
    • JP2013170293A
    • 2013-09-02
    • JP2012034465
    • 2012-02-20
    • Greenchem Incグリーンケム株式会社Osaka Prefecture Univ公立大学法人大阪府立大学
    • YAMAMOTO YOJIRONAGAOKA TSUTOMUSHIIKI HIROSHI
    • C23C18/52C23C18/44
    • PROBLEM TO BE SOLVED: To provide a metal plating method capable of producing a metal-plated article with a good coated state even when the metal plated layer is reduced in thickness.SOLUTION: A metal plating method comprises: a preparation step of preparing a first plating solution obtained by adding an inorganic reducing agent to an aqueous solution containing a metal compound; a primary plating step of making a primary plated article by immersing a workpiece in a first plating solution to which an organic binder is added to plate the surface of the workpiece by an electroless plating method; and a secondary plating step of making a metal-plated article by immersing the primary plated article in a second plating bath to re-plate the surface of the primary plated article by an electroless plating method, wherein the organic binder has a moiety capable of bonding to the workpiece and a thiol group or a disulfide group.
    • 要解决的问题:提供即使当金属镀层的厚度减小时也能够制造具有良好涂布状态的金属镀覆制品的金属镀覆方法。溶液:金属镀覆方法包括:制备第一 通过将无机还原剂添加到含有金属化合物的水溶液中而获得的电镀液; 一次电镀步骤,通过将工件浸入添加了有机粘合剂的第一电镀溶液中以通过无电镀方法对工件的表面进行平板化来制造主电镀制品; 以及二次电镀步骤,通过将第一电镀制品浸入第二镀浴中来制造金属镀层制品,以通过化学镀方法重新平版一次电镀制品的表面,其中有机粘合剂具有能够键合的部分 工件和硫醇基或二硫基。
    • 5. 发明专利
    • Conductive fiber and method for producing the same
    • 导电纤维及其制造方法
    • JP2011184760A
    • 2011-09-22
    • JP2010052609
    • 2010-03-10
    • Osaka Prefecture UnivTeijin Fibers Ltd公立大学法人大阪府立大学帝人ファイバー株式会社
    • MAYAMA TAKATOSHISENDA MIYUKINAGAOKA TSUTOMUSHIIKI HIROSHI
    • C23C18/31C23C18/42
    • PROBLEM TO BE SOLVED: To provide a conductive fiber with superior conductivity by using a metal plating method of fiber capable of simplifying treating processes and facilitating supplementary treatment such as waste liquid treatment. SOLUTION: The conductive fiber is provided by: a solution including an organic binder which has a part capable of combining with an organic fiber according to chemical bonding and a part capable of combining with metal fine particle according to adsorption, and a metal colloid is prepared as a plating bath; a precursor conductive fiber obtained by metal-plating the organic fiber according to nonelectrolytic plating method using the plating bath is subjected to thermal treatment at a temperature less than the melting point of a fiber body constituting the precursor conductive fiber; and, thereafter, the precursor conductive fiber is replated according to nonelectrolytic plating method using a liquid including the metal colloid to provide the conductive fiber. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:通过使用能够简化处理工艺的纤维的金属镀覆方法并且促进诸如废液处理的辅助处理来提供具有优异导电性的导电纤维。 导电纤维是通过以下方式提供的:包含有机粘合剂的溶液,其具有能够根据化学键合与有机纤维组合的部分,以及能够根据吸附与金属微粒结合的部分,以及金属 胶体制备为电镀浴; 通过使用电镀液的非电解电镀法对有机纤维进行金属电镀而得到的前体导电性纤维,在低于构成前体导电性纤维的纤维体的熔点的温度下进行热处理, 然后,使用包含金属胶体的液体,根据非电解电镀方法来重复前体导电纤维,以提供导电纤维。 版权所有(C)2011,JPO&INPIT
    • 8. 发明专利
    • Pressure detecting device, temperature detecting device, pressure detecting method and temperature detecting method utilizing metal nanoparticle integrated structure
    • 压力检测装置,温度检测装置,压力检测方法和采用金属纳米复合结构的温度检测方法
    • JP2012137485A
    • 2012-07-19
    • JP2011268900
    • 2011-12-08
    • Osaka Prefecture Univ公立大学法人大阪府立大学
    • IIDA TAKUYATOKONAMI SHIHOYAMAMOTO YOJIROSHIIKI HIROSHINAGAOKA TSUTOMU
    • G01N21/27
    • PROBLEM TO BE SOLVED: To provide a device and a method by which a pressure or a temperature in a local region may be measured.SOLUTION: A pressure detecting device 100 comprises: a light source 101; a metal nanoparticle integrated structure 10 fixed on a substrate 20; a spectroscope 105; and an operation part 106. The metal nanoparticle integrated structure 10 includes beads with a size of micro order and metal nanoparticles immobilized on surfaces of the beads. Deformation of the beads caused due to a pressure changes a peak wavelength of an extinction spectrum of localized surface plasmon resonance caused in the metal nanoparticles. The pressure may be detected by utilizing this change of the peak wavelength. Similarly, deformation of the beads caused due to a temperature changes a peak wavelength of the extinction spectrum of the localized surface plasmon resonance, and hence, the temperature may be detected by utilizing this change of the peak wavelength.
    • 要解决的问题:提供可以测量局部区域中的压力或温度的装置和方法。 解决方案:压力检测装置100包括:光源101; 固定在基板20上的金属纳米颗粒集成结构10; 分光镜105; 和操作部分106.金属纳米颗粒整体结构10包括尺寸为微顺序的珠和固定在珠的表面上的金属纳米颗粒。 由于压力引起的珠的变形改变了金属纳米颗粒中引起的局部表面等离子体共振的消光光谱的峰值波长。 可以通过利用峰值波长的这种变化来检测压力。 类似地,由于温度引起的珠的变形改变局部表面等离子体共振的消光谱的峰值波长,因此可以通过利用峰值波长的这种变化来检测温度。 版权所有(C)2012,JPO&INPIT
    • 9. 发明专利
    • Electroless plating method of polyimide resin base material, polyimide resin base material electrolessly plated by the method, dispersion liquid, and method of manufacturing the dispersion liquid
    • 聚酰亚胺树脂基材料的电解沉积方法,聚酰亚胺树脂基材料通过方法电镀,分散液体和制造分散液体的方法
    • JP2010196137A
    • 2010-09-09
    • JP2009044894
    • 2009-02-26
    • Osaka Prefecture Univ公立大学法人大阪府立大学
    • NAGAOKA TSUTOMUSHIIKI HIROSHIYAMAMOTO YOJIRO
    • C23C18/30B22F1/00B22F1/02B22F3/10B22F9/24C23C18/16H05K3/18H05K3/38
    • PROBLEM TO BE SOLVED: To form a conductive film excellent in adhesiveness, easily at a low cost, on a polyimide resin base.
      SOLUTION: By bringing a part of a polyimide resin base, which is to be plated, into contact with an alkaline solution, a treatment to open the imide ring of the polyimide resin base material of the part to be plated is performed. Thereafter, the polyimide resin base material is immersed in an acidic dispersion liquid in which metal fine particles provided with coated film made of a polymer having polypyrrole main chain are dispersed. By the immersion, the metal fine particles having the coated film are attached to the part to be plated of the polyimide resin base material. Subsequently, the polyimide resin base material in which the metal fine particles having the coated film are attached to the part to be plated is heated at such a temperature that at least the coated film and the metal fine particle are fused. Then, an electroless plating film is deposited on the part to be plated of the heated polyimide resin base.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:为了在聚酰亚胺树脂基体上容易地以低成本形成粘合性优异的导电膜。 解决方案:通过使被电镀的聚酰亚胺树脂基体的一部分与碱性溶液接触,进行打开被镀部件的聚酰亚胺树脂基材的酰亚胺环的处理。 此后,将聚酰亚胺树脂基材浸渍在其中分散有由具有聚吡咯主链的聚合物制成的涂膜的金属微粒分散的酸性分散液中。 通过浸渍,将具有涂膜的金属微粒附着到聚酰亚胺树脂基材的被镀部上。 随后,将具有涂膜的金属微粒附着到被镀部分的聚酰亚胺树脂基材在至少涂膜和金属微粒熔融的温度下加热。 然后,在被加热的聚酰亚胺树脂基体的被镀部分上沉积化学镀膜。 版权所有(C)2010,JPO&INPIT