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1. 发明专利

JP2006294550A Conductive ink for printed board wiring and wiring method of printed board 审中-公开
标题翻译：印刷电路板导线导线和印刷板接线方法
公开(公告)号：JP2006294550A
公开(公告)日：2006-10-26
申请号：JP2005117040
申请日：2005-04-14
申请人： Osaka Prefecture Univ , 公立大学法人大阪府立大学
发明人： NAGAOKA TSUTOMU , SHIIKI HIROSHI
IPC分类号： H01B1/22 , B82Y30/00 , B82Y99/00 , C09D11/00 , C09D11/38 , H01B13/00 , H05K1/09
摘要： PROBLEM TO BE SOLVED: To provide a method of forming a wiring pattern with very fine wire width of 100 nm or less on various kind of printed boards by an ink jet printing process.
SOLUTION: The wiring pattern with very fine wire width of 100 nm or less is drawn on various kind of printed boards by an ink jet printer, by using the ink for the ink jet printer containing conductive gold-colloid particles as main component.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过喷墨印刷方法在各种印刷板上形成具有100nm或更小的细线宽度的布线图案的方法。解决方案：通过喷墨打印机将具有100nm或更小的细线宽度的布线图案通过使用用于含有导电金胶体颗粒的喷墨打印机的墨水作为主要成分通过喷墨打印机吸取在各种印刷电路板上。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2013170293A Metal plating method and metal-plated article made by using the same 有权
标题翻译：金属镀层方法和金属制品使用相同
公开(公告)号：JP2013170293A
公开(公告)日：2013-09-02
申请号：JP2012034465
申请日：2012-02-20
申请人： Greenchem Inc , グリーンケム株式会社 , Osaka Prefecture Univ , 公立大学法人大阪府立大学
发明人： YAMAMOTO YOJIRO , NAGAOKA TSUTOMU , SHIIKI HIROSHI
IPC分类号： C23C18/52 , C23C18/44
摘要： PROBLEM TO BE SOLVED: To provide a metal plating method capable of producing a metal-plated article with a good coated state even when the metal plated layer is reduced in thickness.SOLUTION: A metal plating method comprises: a preparation step of preparing a first plating solution obtained by adding an inorganic reducing agent to an aqueous solution containing a metal compound; a primary plating step of making a primary plated article by immersing a workpiece in a first plating solution to which an organic binder is added to plate the surface of the workpiece by an electroless plating method; and a secondary plating step of making a metal-plated article by immersing the primary plated article in a second plating bath to re-plate the surface of the primary plated article by an electroless plating method, wherein the organic binder has a moiety capable of bonding to the workpiece and a thiol group or a disulfide group.
摘要翻译：要解决的问题：提供即使当金属镀层的厚度减小时也能够制造具有良好涂布状态的金属镀覆制品的金属镀覆方法。溶液：金属镀覆方法包括：制备第一通过将无机还原剂添加到含有金属化合物的水溶液中而获得的电镀液; 一次电镀步骤，通过将工件浸入添加了有机粘合剂的第一电镀溶液中以通过无电镀方法对工件的表面进行平板化来制造主电镀制品; 以及二次电镀步骤，通过将第一电镀制品浸入第二镀浴中来制造金属镀层制品，以通过化学镀方法重新平版一次电镀制品的表面，其中有机粘合剂具有能够键合的部分工件和硫醇基或二硫基。

3. 发明专利

JP2011242387A Composite fine particle for capturing or separating biological substance 审中-公开
标题翻译：用于捕获或分离生物物质的复合微粒
公开(公告)号：JP2011242387A
公开(公告)日：2011-12-01
申请号：JP2011095014
申请日：2011-04-21
申请人： Osaka Prefecture Univ , 公立大学法人大阪府立大学
发明人： NAGAOKA TSUTOMU , TOKONAMI SHIHO , SHIIKI HIROSHI , YAMAMOTO YOJIRO
IPC分类号： G01N33/553 , G01N27/48 , G01N33/483 , G01N33/53 , G01N33/543
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive microbead for capture which is improved in mechanical resistance to centrifugal separation and the like and can be used for analyzing/separating.SOLUTION: A composite fine particle for capturing or separating a biological substance includes: a gold-layer-coated fine particle in which a gold layer is adhered on a resin-coated fine particle directly or via a layer of an organic binder; and a ligand which is connected to the gold layer and can be specifically coupled to the biological substance.
摘要翻译：要解决的问题：提供一种用于捕获的廉价的微珠，其提高了离心分离等的机械阻力，并且可以用于分析/分离。解决方案：用于捕获或分离生物物质的复合微粒包括：金层包覆的微粒，其中金层直接或经由有机粘合剂层附着在树脂涂覆的微粒上; 以及与金层连接并可以特异性结合生物物质的配体。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2011184760A Conductive fiber and method for producing the same 有权
标题翻译：导电纤维及其制造方法
公开(公告)号：JP2011184760A
公开(公告)日：2011-09-22
申请号：JP2010052609
申请日：2010-03-10
申请人： Osaka Prefecture Univ , Teijin Fibers Ltd , 公立大学法人大阪府立大学 , 帝人ファイバー株式会社
发明人： MAYAMA TAKATOSHI , SENDA MIYUKI , NAGAOKA TSUTOMU , SHIIKI HIROSHI
IPC分类号： C23C18/31 , C23C18/42
摘要： PROBLEM TO BE SOLVED: To provide a conductive fiber with superior conductivity by using a metal plating method of fiber capable of simplifying treating processes and facilitating supplementary treatment such as waste liquid treatment. SOLUTION: The conductive fiber is provided by: a solution including an organic binder which has a part capable of combining with an organic fiber according to chemical bonding and a part capable of combining with metal fine particle according to adsorption, and a metal colloid is prepared as a plating bath; a precursor conductive fiber obtained by metal-plating the organic fiber according to nonelectrolytic plating method using the plating bath is subjected to thermal treatment at a temperature less than the melting point of a fiber body constituting the precursor conductive fiber; and, thereafter, the precursor conductive fiber is replated according to nonelectrolytic plating method using a liquid including the metal colloid to provide the conductive fiber. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：通过使用能够简化处理工艺的纤维的金属镀覆方法并且促进诸如废液处理的辅助处理来提供具有优异导电性的导电纤维。导电纤维是通过以下方式提供的：包含有机粘合剂的溶液，其具有能够根据化学键合与有机纤维组合的部分，以及能够根据吸附与金属微粒结合的部分，以及金属胶体制备为电镀浴; 通过使用电镀液的非电解电镀法对有机纤维进行金属电镀而得到的前体导电性纤维，在低于构成前体导电性纤维的纤维体的熔点的温度下进行热处理，然后，使用包含金属胶体的液体，根据非电解电镀方法来重复前体导电纤维，以提供导电纤维。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2008101260A Electroconductive fine particle and production method therefor 审中-公开
标题翻译：电极细颗粒及其生产方法
公开(公告)号：JP2008101260A
公开(公告)日：2008-05-01
申请号：JP2006286592
申请日：2006-10-20
申请人： Osaka Prefecture Univ , 公立大学法人大阪府立大学
发明人： NAGAOKA TSUTOMU , SHIIKI HIROSHI
IPC分类号： C23C26/00 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide an electroconductive fine particle which has a nano-structure and superior electroconductivity.
SOLUTION: The electroconductive fine particle can be obtained by the steps of: preparing a precursor of the electroconductive fine particle, which is a plastic fine particle plated with a metal through an electroless method; and re-plating the precursor of the electroconductive fine particle with an electroless method by using a solution containing a metal colloid. Thus produced electroconductive fine particle has an electric resistance of 0.01 to 100 ohm.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供具有纳米结构和优异导电性的导电细颗粒。导电微粒可以通过以下步骤获得：通过无电解方法制备电镀金属的塑料细颗粒的导电细颗粒的前体; 并通过使用含有金属胶体的溶液，通过化学镀方法将导电性微粒的前体再镀覆。这样制得的导电细颗粒的电阻为0.01至100欧姆。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2015042958A 被検出微生物を検出する検出方法审中-公开
标题翻译：检测待检测微生物的方法
公开(公告)号：JP2015042958A
公开(公告)日：2015-03-05
申请号：JP2013174694
申请日：2013-08-26
申请人：公立大学法人大阪府立大学 , Osaka Prefecture Univ
发明人： SHIIKI HIROSHI , NAGAOKA TSUTOMU
IPC分类号： G01N33/569 , G01N21/41 , G01N21/64 , G01N33/536
摘要：【課題】迅速かつ簡便で、高感度に微生物を検出できる新規な微生物の検出方法を提供することを目的とする。【解決手段】試料に含まれる被検出微生物を検出する検出方法であって、試料に含まれる被検出微生物に金属ナノ粒子を付着させる付着工程と、試料に光を照射して、被検出微生物への金属ナノ粒子の付着状態に対応する光の散乱特性を評価する評価工程と、評価工程における評価結果に基づいて、被検出微生物を検出する検出工程と、を備える。【選択図】図1
摘要翻译：要解决的问题：提供一种以高灵敏度快速且容易地检测微生物的新方法。解决方案：一种用于检测样品中包含的待检测微生物的方法，包括：用于使金属纳米颗粒粘附到待检测的微生物包含在样品中; 评估步骤，用于用光照射样品并评估与金属纳米颗粒的粘合条件对应的待测微生物的光的散射特性; 以及检测步骤，用于根据评价步骤的评价结果检测待检测微生物。

7. 发明专利

JP2012137485A Pressure detecting device, temperature detecting device, pressure detecting method and temperature detecting method utilizing metal nanoparticle integrated structure 有权
标题翻译：压力检测装置，温度检测装置，压力检测方法和采用金属纳米复合结构的温度检测方法
公开(公告)号：JP2012137485A
公开(公告)日：2012-07-19
申请号：JP2011268900
申请日：2011-12-08
申请人： Osaka Prefecture Univ , 公立大学法人大阪府立大学
发明人： IIDA TAKUYA , TOKONAMI SHIHO , YAMAMOTO YOJIRO , SHIIKI HIROSHI , NAGAOKA TSUTOMU
IPC分类号： G01N21/27
摘要： PROBLEM TO BE SOLVED: To provide a device and a method by which a pressure or a temperature in a local region may be measured.SOLUTION: A pressure detecting device 100 comprises: a light source 101; a metal nanoparticle integrated structure 10 fixed on a substrate 20; a spectroscope 105; and an operation part 106. The metal nanoparticle integrated structure 10 includes beads with a size of micro order and metal nanoparticles immobilized on surfaces of the beads. Deformation of the beads caused due to a pressure changes a peak wavelength of an extinction spectrum of localized surface plasmon resonance caused in the metal nanoparticles. The pressure may be detected by utilizing this change of the peak wavelength. Similarly, deformation of the beads caused due to a temperature changes a peak wavelength of the extinction spectrum of the localized surface plasmon resonance, and hence, the temperature may be detected by utilizing this change of the peak wavelength.
摘要翻译：要解决的问题：提供可以测量局部区域中的压力或温度的装置和方法。解决方案：压力检测装置100包括：光源101; 固定在基板20上的金属纳米颗粒集成结构10; 分光镜105; 和操作部分106.金属纳米颗粒整体结构10包括尺寸为微顺序的珠和固定在珠的表面上的金属纳米颗粒。由于压力引起的珠的变形改变了金属纳米颗粒中引起的局部表面等离子体共振的消光光谱的峰值波长。可以通过利用峰值波长的这种变化来检测压力。类似地，由于温度引起的珠的变形改变局部表面等离子体共振的消光谱的峰值波长，因此可以通过利用峰值波长的这种变化来检测温度。版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2010196137A Electroless plating method of polyimide resin base material, polyimide resin base material electrolessly plated by the method, dispersion liquid, and method of manufacturing the dispersion liquid 审中-公开
标题翻译：聚酰亚胺树脂基材料的电解沉积方法，聚酰亚胺树脂基材料通过方法电镀，分散液体和制造分散液体的方法
公开(公告)号：JP2010196137A
公开(公告)日：2010-09-09
申请号：JP2009044894
申请日：2009-02-26
申请人： Osaka Prefecture Univ , 公立大学法人大阪府立大学
发明人： NAGAOKA TSUTOMU , SHIIKI HIROSHI , YAMAMOTO YOJIRO
IPC分类号： C23C18/30 , B22F1/00 , B22F1/02 , B22F3/10 , B22F9/24 , C23C18/16 , H05K3/18 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To form a conductive film excellent in adhesiveness, easily at a low cost, on a polyimide resin base.
SOLUTION: By bringing a part of a polyimide resin base, which is to be plated, into contact with an alkaline solution, a treatment to open the imide ring of the polyimide resin base material of the part to be plated is performed. Thereafter, the polyimide resin base material is immersed in an acidic dispersion liquid in which metal fine particles provided with coated film made of a polymer having polypyrrole main chain are dispersed. By the immersion, the metal fine particles having the coated film are attached to the part to be plated of the polyimide resin base material. Subsequently, the polyimide resin base material in which the metal fine particles having the coated film are attached to the part to be plated is heated at such a temperature that at least the coated film and the metal fine particle are fused. Then, an electroless plating film is deposited on the part to be plated of the heated polyimide resin base.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了在聚酰亚胺树脂基体上容易地以低成本形成粘合性优异的导电膜。解决方案：通过使被电镀的聚酰亚胺树脂基体的一部分与碱性溶液接触，进行打开被镀部件的聚酰亚胺树脂基材的酰亚胺环的处理。此后，将聚酰亚胺树脂基材浸渍在其中分散有由具有聚吡咯主链的聚合物制成的涂膜的金属微粒分散的酸性分散液中。通过浸渍，将具有涂膜的金属微粒附着到聚酰亚胺树脂基材的被镀部上。随后，将具有涂膜的金属微粒附着到被镀部分的聚酰亚胺树脂基材在至少涂膜和金属微粒熔融的温度下加热。然后，在被加热的聚酰亚胺树脂基体的被镀部分上沉积化学镀膜。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2014041107A Electrode substrate for sensor, and sensor using the same 审中-公开
标题翻译：用于传感器的电极基板和使用该传感器的传感器
公开(公告)号：JP2014041107A
公开(公告)日：2014-03-06
申请号：JP2012184730
申请日：2012-08-24
申请人： Greenchem Inc , グリーンケム株式会社 , Osaka Prefecture Univ , 公立大学法人大阪府立大学 , Japan Control Engineering Co Ltd , 日本制禦機器株式会社
发明人： YAMAMOTO YOJIRO , NAGAOKA TSUTOMU , SHIIKI HIROSHI , TAKAHASHI YASUNORI , TAKAGI YASUHIRO
IPC分类号： G01N27/327 , G01N27/30 , G01N27/416 , G01N27/48
摘要： PROBLEM TO BE SOLVED: To provide an electrode substrate for sensors including an electrode layer in which arithmetic-average-roughness Ra of the surface is 20 nm or less.SOLUTION: An electrode substrate for sensors includes a substrate 10 made of resin or glass and an electrode layer 20 made of gold or platinum and formed on an upper surface of the substrate 10. After producing a primary plating board using a first plating bath containing a gold grain or platinum particles, an organic binder, water and alcohol, the electrode layer 20 is formed using a second plating bath containing a gold compound or a platinum compound, a reducing agent and water. Arithmetic average roughness Ra of a surface of the electrode layer 20 is 20 nm or less.
摘要翻译：要解决的问题：提供一种传感器用电极基板，其包括表面的算术平均粗糙度Ra为20nm以下的电极层。传感器用电极基板包括由树脂或玻璃制成的基板10，由金或铂制成并形成在基板10的上表面上的电极层20.在使用含有金颗粒或铂颗粒，有机粘合剂，水和醇的第一电镀浴制备初级电镀板之后，电极层 20是使用包含金化合物或铂化合物，还原剂和水的第二镀浴形成的。电极层20的表面的算术平均粗糙度Ra为20nm以下。

10. 发明专利

JP2011179838A Quartz oscillator sensor and qcm device using the same 审中-公开
标题翻译： QUARTZ振荡器传感器和使用相同的QCM器件
公开(公告)号：JP2011179838A
公开(公告)日：2011-09-15
申请号：JP2010041619
申请日：2010-02-26
申请人： Osaka Prefecture Univ , Sumitomo Electric Ind Ltd , 住友電気工業株式会社 , 公立大学法人大阪府立大学
发明人： MIZUNO FUMIAKI , HOSOYA TOSHIFUMI , OKUBO SOICHIRO , NAGAOKA TSUTOMU , SHIIKI HIROSHI
IPC分类号： G01N5/02
摘要： PROBLEM TO BE SOLVED: To provide a durable quartz oscillator sensor having high selectivity and specificity to a specimen and having high detection sensitivity.
SOLUTION: The quartz oscillator sensor includes: a quartz crystal plate vibrating at a natural frequency by application of voltage; electrodes provided on both surfaces of the quartz crystal plate to apply voltage to the quartz crystal plate; a surface-roughened part provided at one portion of a surface of at least one of the electrodes; and an organic selection film formed on the surface-roughened part, where a mold for capturing the specimen or a part of structure is recessedly provided. Thus, the quartz oscillator sensor is preferably used for a sensor for quartz crystal microbalance (QCM).
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种耐久的石英振荡器传感器，其对样品具有高选择性和特异性，并具有高检测灵敏度。解决方案：石英振荡器传感器包括：通过施加电压以固有频率振动的石英晶体板; 设置在石英晶片的两面的电极，对石英晶体板施加电压; 表面粗糙部分，设置在至少一个电极的表面的一部分处; 以及形成在表面粗糙化部分上的有机选择膜，其中凹陷地提供用于捕获样品或结构的一部分的模具。因此，石英振荡器传感器优选用于石英晶体微量天平传感器（QCM）。版权所有（C）2011，JPO＆INPIT

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