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    • 2. 发明申请
    • NONVOLATILE MEMORY DEVICE AND FABRICATING METHOD THEREOF
    • 非易失性存储器件及其制造方法
    • US20130228849A1
    • 2013-09-05
    • US13775833
    • 2013-02-25
    • Ju-Hyung KimChang-Seok KangWoon-Kyung Lee
    • Ju-Hyung KimChang-Seok KangWoon-Kyung Lee
    • H01L29/792H01L29/66
    • H01L29/792H01L27/11582H01L29/4234H01L29/513H01L29/66833H01L29/7926
    • A nonvolatile memory device comprises a channel pattern, a first interlayer dielectric film and a second interlayer dielectric film spaced apart from each other and stacked over each other, a gate pattern disposed between the first interlayer dielectric film and the second interlayer dielectric film, a trap layer disposed between the gate pattern and the channel pattern and a charge spreading inhibition layer disposed between the channel pattern and the first interlayer dielectric film and between the channel pattern and the second interlayer dielectric film. The charge spreading inhibition layer may include charges inside or on its surface. The charge spreading inhibition layer includes at least one of a metal oxide film or a metal nitride film or a metal oxynitride film having a greater dielectric constant than a silicon oxide film.
    • 非易失性存储器件包括彼此间隔开并且彼此堆叠的沟道图案,第一层间电介质膜和第二层间电介质膜,布置在第一层间电介质膜和第二层间电介质膜之间的栅极图案,阱 设置在栅极图案和沟道图案之间的层,以及设置在沟道图案和第一层间电介质膜之间以及沟道图案和第二层间电介质膜之间的电荷扩展抑制层。 电荷扩散抑制层可以包括其表面内部或其表面上的电荷。 电荷扩散抑制层包括金属氧化物膜或金属氮化物膜或具有比氧化硅膜更大的介电常数的金属氧氮化物膜中的至少一种。
    • 7. 发明授权
    • Nonvolatile memory device and fabricating method thereof
    • 非易失存储器件及其制造方法
    • US09112045B2
    • 2015-08-18
    • US13775833
    • 2013-02-25
    • Ju-Hyung KimChang-Seok KangWoon-Kyung Lee
    • Ju-Hyung KimChang-Seok KangWoon-Kyung Lee
    • H01L29/792H01L29/66H01L29/423H01L29/51H01L27/115
    • H01L29/792H01L27/11582H01L29/4234H01L29/513H01L29/66833H01L29/7926
    • A nonvolatile memory device comprises a channel pattern, a first interlayer dielectric film and a second interlayer dielectric film spaced apart from each other and stacked over each other, a gate pattern disposed between the first interlayer dielectric film and the second interlayer dielectric film, a trap layer disposed between the gate pattern and the channel pattern and a charge spreading inhibition layer disposed between the channel pattern and the first interlayer dielectric film and between the channel pattern and the second interlayer dielectric film. The charge spreading inhibition layer may include charges inside or on its surface. The charge spreading inhibition layer includes at least one of a metal oxide film or a metal nitride film or a metal oxynitride film having a greater dielectric constant than a silicon oxide film.
    • 非易失性存储器件包括彼此间隔开并且彼此堆叠的沟道图案,第一层间电介质膜和第二层间电介质膜,布置在第一层间电介质膜和第二层间电介质膜之间的栅极图案,阱 设置在栅极图案和沟道图案之间的层,以及设置在沟道图案和第一层间电介质膜之间以及沟道图案和第二层间电介质膜之间的电荷扩展抑制层。 电荷扩散抑制层可以包括其表面内部或其表面上的电荷。 电荷扩散抑制层包括金属氧化物膜或金属氮化物膜或具有比氧化硅膜更大的介电常数的金属氧氮化物膜中的至少一种。