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1. 发明授权

US07211451B2 Process for producing a component module 有权
标题翻译：用于生产组件模块的过程
公开(公告)号：US07211451B2
公开(公告)日：2007-05-01
申请号：US10298772
申请日：2002-11-18
申请人： Thorsten Meyer , Gerd Frankowsky , Harry Hedler , Barbara Vasquez , Roland Irsigler
发明人： Thorsten Meyer , Gerd Frankowsky , Harry Hedler , Barbara Vasquez , Roland Irsigler
IPC分类号： H01L21/66 , H01L21/00 , H01L23/28 , H01L23/498
CPC分类号： H01L21/568 , H01L21/67121 , H01L21/67132 , H01L21/6835 , H01L22/20 , H01L23/3128 , H01L24/96 , H01L24/97 , H01L2224/12105 , H01L2224/92 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2224/96 , H01L2224/82
摘要： A process for producing a component module comprising a module carrier and a plurality of components with which contact is made on the latter, comprising the following steps: arranging separated components on a surface-adhesive film at a predefined contact-specific spacing from one another, embedding the components in a flexible material in order to form a flexible holding frame which holds the components, pulling off the film, producing contact-making elements on the exposed side of the components, performing a functional test of the components and, if necessary, repair and/or replacement of components, and fixing and making contact with the components held in the holding frame on the module carrier.
摘要翻译：一种用于制造组件模块的方法，所述组件模块包括模块载体和在其上形成接触的多个部件，包括以下步骤：以预定的接触特定间隔将表面粘合膜上的分离的组分布置在彼此之间，将部件嵌入柔性材料中以形成保持部件的柔性保持框架，拉出膜，在部件的暴露侧上产生接触形成元件，执行部件的功能测试，并且如果需要，修理和/或更换部件，以及固定和保持在模块架上的保持框架中保持的部件。

2. 发明授权

US06707746B2 Fuse programmable I/O organization 有权
标题翻译：保险丝可编程I / O组织
公开(公告)号：US06707746B2
公开(公告)日：2004-03-16
申请号：US10210628
申请日：2002-07-31
申请人： Gerd Frankowsky , Barbara Vasquez
发明人： Gerd Frankowsky , Barbara Vasquez
IPC分类号： G11C700
CPC分类号： G11C7/1045 , G11C2207/105 , G11C2207/2254
摘要： Circuitry using fuse and anti-fuse latches (62) for selecting the number of input/output channels (98, 109) after encapsulation is disclosed. The various embodiments allow conventional bond pads (14, 16, 18) to be used for initial selection of the number of input/output channels prior to encapsulation. However, by providing different selection signals (52, 54), the number of input/output channels may be changed by the user at any time after encapsulation. Other embodiments employ “enable” latch circuits (133,135) allow the initial selection by the users at any time after encapsulation, and then at least one more subsequent selection.
摘要翻译：公开了使用熔断器和反熔丝锁存器（62）进行封装后选择输入/输出通道数（98,109）的电路。各种实施例允许传统的接合焊盘（14,16,18）用于在封装之前的输入/输出通道的数量的初始选择。然而，通过提供不同的选择信号（52,54），输入/输出通道的数量可以由用户在封装之后的任何时间改变。其他实施例使用“使能”锁存电路（133,135）允许用户在封装之后的任何时间进行初始选择，然后进行至少一个以后的选择。

3. 发明授权

US06845554B2 Method for connection of circuit units 有权
标题翻译：电路单元连接方法
公开(公告)号：US06845554B2
公开(公告)日：2005-01-25
申请号：US10298837
申请日：2002-11-18
申请人： Gerd Frankowsky , Harry Hedler , Roland Irsigler , Thorsten Meyer , Barbara Vasquez
发明人： Gerd Frankowsky , Harry Hedler , Roland Irsigler , Thorsten Meyer , Barbara Vasquez
IPC分类号： H01L21/00 , H01L21/60 , H01L21/78 , H05K3/30
CPC分类号： H01L24/96 , H01L21/67144 , H01L21/78 , H01L24/81 , H01L2224/0401 , H01L2224/04105 , H01L2224/16 , H01L2224/20 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , Y10T29/49126 , Y10T29/4913 , Y10T29/49133 , Y10T29/49135 , Y10T29/49155 , Y10T29/53178
摘要： The invention creates a method for connection of circuit units (101a-10n) which are arranged on a wafer (100), in which the wafer (100) is fitted to a first film (102a), the wafer (100) is sawn such that the circuit units (101a-101n) which are arranged on the wafer (100) are separated, the functional circuit units (101d) are picked up by means of a handling device (101) and are placed down on a second film (102b) by means of the handling device (103), so as to produce a separation distance which can be predetermined between connection contacts of the circuit units (101d).
摘要翻译：本发明创造了一种用于连接电路单元（101a-10n）的方法，它们布置在晶片（100）上，其中晶片（100）装配到第一薄膜（102a）上，晶片（100）被锯切布置在晶片（100）上的电路单元（101a-101n）被分离，功能电路单元（101d）通过处理装置（101）拾取并放置在第二薄膜（102b）上），以便产生可以在电路单元（101d）的连接触点之间预定的间隔距离。

4. 发明授权

US06714418B2 Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one another 有权
标题翻译：一种电子部件的制造方法，所述电子部件具有多个堆叠在一起并且彼此接触连接的芯片
公开(公告)号：US06714418B2
公开(公告)日：2004-03-30
申请号：US10285924
申请日：2002-11-01
申请人： Gerd Frankowsky , Harry Hedler , Roland Irsigler , Thorsten Meyer , Barbara Vasquez
发明人： Gerd Frankowsky , Harry Hedler , Roland Irsigler , Thorsten Meyer , Barbara Vasquez
IPC分类号： H05K702
CPC分类号： H01L25/50 , H01L21/568 , H01L24/24 , H01L24/82 , H01L24/96 , H01L25/0657 , H01L2224/04105 , H01L2224/05548 , H01L2224/05573 , H01L2224/12105 , H01L2224/16145 , H01L2224/16237 , H01L2224/17181 , H01L2224/32225 , H01L2224/73267 , H01L2225/1035 , H01L2225/1064 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01068 , H01L2924/01078 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/15331 , H01L2924/00
摘要： An electronic component has a plurality of chips which are stacked one above the other and contact-connected to one another. To form this component, a first planar chip arrangement is provided with the functional chips spaced apart from one another in a grid and with a filling material in the spaces between the chips to form an insulating holding frame that fixes the chips, the frame has chip-dedicated contact-connecting elements that serve for the electrical contact-connection to another chip of another chip arrangement and each chip has dedicated electrically conductive strips. At least one additional planar chip arrangement is formed by the same method as the first planar chip arrangement and is then stacked on the first planar chip arrangement so that the two chip arrangements lie one above the other and the respective contact-connecting elements of the two chip arrangements are connected to one another for electrical chip-to-chip contact-connection. Subsequently, each of the components, which comprise a stack of chips, is separated from the assembled stack of chip arrangements.
摘要翻译：电子部件具有多个彼此叠置并彼此接触连接的芯片。为了形成该部件，第一平面芯片布置设置有功能芯片，其格栅彼此间隔开，并且在芯片之间的空间中具有填充材料，以形成固定芯片的绝缘保持框架，框架具有芯片用于与另一个芯片布置的另一芯片的电接触连接的每个芯片具有专用的导电条。通过与第一平面芯片布置相同的方法形成至少一个附加的平面芯片布置，然后将其堆叠在第一平面芯片布置上，使得两个芯片布置在另一个之上并且两个相应的触点连接元件芯片布置彼此连接以进行电芯片到芯片的接触连接。随后，包括一堆芯片的每个部件与组装的芯片布置堆叠分离。

5. 发明授权

US07074696B1 Semiconductor circuit module and method for fabricating semiconductor circuit modules 失效
标题翻译：半导体电路模块及半导体电路模块的制造方法
公开(公告)号：US07074696B1
公开(公告)日：2006-07-11
申请号：US10630632
申请日：2003-07-29
申请人： Gerd Frankowsky , Harry Hedler , Barbara Vasquez
发明人： Gerd Frankowsky , Harry Hedler , Barbara Vasquez
IPC分类号： H01L21/00 , H01L21/44 , H01L21/46
CPC分类号： H01L25/50 , H01L21/568 , H01L21/6835 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L24/96 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/24137 , H01L2224/24195 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12044 , H01L2924/15311 , H01L2924/19041 , H01L2924/19043 , H01L2924/00 , H01L2224/05599
摘要： The present invention provides a method for fabricating semiconductor circuit modules having the following steps: application of a patterned connection layer to a transfer substrate, application of active circuit devices and/or passive circuit devices with contact areas pointing toward the patterned connection layer, connection of the circuit devices to one another by means of a filler at least between the circuit devices, removal of the transfer substrate, and application of electrical connection devices for selective contact connection of the contact area of the circuit devices to one another.
摘要翻译：本发明提供了一种制造半导体电路模块的方法，其具有以下步骤：将图案化连接层应用于转移衬底，施加有接触区域指向图案化连接层的有源电路器件和/或无源电路器件，至少在电路装置之间通过填料相互连接的电路装置，去除转移基板以及施加用于使电路装置的接触区域彼此选择性接触连接的电连接装置。

6. 发明申请

US20060262614A1 Integrated circuit, test system and method for reading out an error datum from the integrated circuit 失效
标题翻译：集成电路，测试系统和从集成电路读出误差基准的方法
公开(公告)号：US20060262614A1
公开(公告)日：2006-11-23
申请号：US11415443
申请日：2006-05-01
申请人： Gerd Frankowsky
发明人： Gerd Frankowsky
IPC分类号： G11C29/00
CPC分类号： G11C29/26 , G11C2029/2602
摘要： An integrated circuit is provided, the integrated circuit having a test circuit for reading out an error datum from the integrated circuit in accordance with a test mode, wherein the error datum is output via a first and a second data output, and wherein an address and a read command are applied to the integrated circuit to read out the error datum associated with the address via one of the data outputs. The test circuit is configured in such a manner that, when a first read command is applied, the test circuit outputs the error datum at the first data output and switches the second data output to high impedance and, when a second read command is applied, the test circuit outputs the error datum at the second data output and switches the first data output to high impedance.
摘要翻译：提供了一种集成电路，该集成电路具有用于根据测试模式从集成电路读出错误数据的测试电路，其中该误差数据经由第一和第二数据输出被输出，并且其中一个地址和读取命令被应用于集成电路，以通过数据输出之一读出与地址相关联的错误数据。测试电路被配置成使得当应用第一读取命令时，测试电路在第一数据输出处输出误差数据并将第二数据输出切换为高阻抗，并且当应用第二读取命令时，测试电路在第二个数据输出端输出误差数据，并将第一个数据输出切换到高阻抗。

7. 发明申请

US20050017748A1 Test system for testing integrated chips and an adapter element for a test system 有权
标题翻译：用于测试集成芯片的测试系统和用于测试系统的适配器元件
公开(公告)号：US20050017748A1
公开(公告)日：2005-01-27
申请号：US10865050
申请日：2004-06-10
申请人： Frank Weber , Gerd Frankowsky
发明人： Frank Weber , Gerd Frankowsky
IPC分类号： G01R31/28 , G01R31/26
CPC分类号： G01R31/2863 , G01R31/2889
摘要： Test system for testing integrated chips and an adapter element for a test system. One embodiment provides a test system for testing integrated chips in a burn-in test operation, the integrated chips to be tested being arranged in groups on a burn-in board, the burn-in board having a first connecting device in order to connect the burn-in board to a tester device, the tester device comprising a test module with a test circuit in order to test chips on the burn-in board in accordance with the burn-in test operation, the test module having a second connecting device in order to connect the burn-in board to the test module via the second connecting device, a plurality of test modules being provided, the second connecting devices of which can be contact-connected to a plurality of third connecting devices of an adapter element, the adapter element having a fourth connecting device for contact-connection of the first connecting device of the burn-in board, the third connecting devices of the adapter element being connected to the fourth connecting device in such a way that, in the contact-connected state, it is possible to test each integrated circuit of a group with one of the test modules.
摘要翻译：用于测试集成芯片的测试系统和用于测试系统的适配器元件。一个实施例提供了一种用于在老化测试操作中测试集成芯片的测试系统，待测试的集成芯片分组放置在老化板上，该老化板具有第一连接设备，以便连接所述测试装置包括具有测试电路的测试模块，以便根据所述老化测试操作在所述老化板上测试芯片，所述测试模块具有第二连接装置，为了通过第二连接装置将老化板连接到测试模块，提供了多个测试模块，其中第二连接装置可以与适配器元件的多个第三连接装置接触连接，适配器元件具有用于接合连接老化板的第一连接装置的第四连接装置，适配器元件的第三连接装置以这样的方式连接到第四连接装置在接触连接状态下，可以用一个测试模块来测试组中的每个集成电路。

8. 发明授权

US06651203B1 On chip programmable data pattern generator for semiconductor memories 有权
标题翻译：用于半导体存储器的片上可编程数据模式发生器
公开(公告)号：US06651203B1
公开(公告)日：2003-11-18
申请号：US09312974
申请日：1999-05-17
申请人： Gerd Frankowsky
发明人： Gerd Frankowsky
IPC分类号： G01R3128
CPC分类号： G11C29/36 , G06F11/2635
摘要： A semiconductor memory chip in accordance with the present invention includes a first memory array to be tested including a plurality of memory cells arranged in rows and columns, the memory cells being accessed to read and write data thereto by employing bitlines and wordlines, the data provided on input/output pins, and a pattern generator formed on the memory chip. The pattern generator further includes a programmable memory array including a plurality of memory banks, the memory banks having memory cells arranged in rows and columns, each bank being capable of storing data for a pattern to be generated for each of the input/output pins of the first memory array. An addressing circuit for accessing the data stored in the programmable memory array to address individual data to be transmitted to and from the first memory array is included.
摘要翻译：根据本发明的半导体存储器芯片包括待测试的第一存储器阵列，其包括以行和列排列的多个存储单元，存储单元通过采用位线和字线被访问以读取和写入数据，所提供的数据在输入/输出引脚上，以及形成在存储芯片上的图形发生器。图案生成器还包括包括多个存储体的可编程存储器阵列，存储体具有以行和列排列的存储单元，每个存储体能够存储要为每个输入/输出引脚产生的模式的数据第一个存储器阵列。包括用于访问存储在可编程存储器阵列中的数据以寻址要发送到第一存储器阵列和从第一存储器阵列传送的各个数据的寻址电路。

9. 发明授权

US06603694B1 Dynamic memory refresh circuitry 有权
标题翻译：动态内存刷新电路
公开(公告)号：US06603694B1
公开(公告)日：2003-08-05
申请号：US10068789
申请日：2002-02-05
申请人： Gerd Frankowsky , Gunther Lehmann
发明人： Gerd Frankowsky , Gunther Lehmann
IPC分类号： G11C700
CPC分类号： G11C11/406
摘要： A circuit for refreshing data stored in an array of dynamic memory cells is provided. The circuit includes an integrated circuit chip. The chip has the array of memory cells formed thereon. The circuit also includes a refresh rate analysis circuit for determining data retention times in each one of the memory cells and from such determination refresh address modification signals. Also provided is a refresh address generator formed on the chip and fed by refresh command signals generated externally of the chip and by the address modification signals. The refresh address generator supplies an internal refresh commands along with refresh addresses to the array of memory cells. The cells have data stored therein refreshed in response to such internal refresh commands. The refresh rate analysis circuit determines cells in the array having data retention times less than a predetermined value.
摘要翻译：提供了用于刷新存储在动态存储单元阵列中的数据的电路。该电路包括集成电路芯片。芯片具有形成在其上的存储单元阵列。该电路还包括用于确定每个存储器单元中的数据保持时间的刷新率分析电路，以及这些确定刷新地址修改信号。还提供了一种刷新地址生成器，其形成在芯片上并由芯片外部产生的刷新命令信号和地址修改信号馈送。刷新地址生成器向内存单元阵列提供内部刷新命令以及刷新地址。小区具有响应于这种内部刷新命令刷新的数据。刷新率分析电路确定具有小于预定值的数据保留时间的阵列中的单元。

10. 发明申请

US20090039910A1 TEST APPARATUS FOR SEMICONDUCTOR MODULES 审中-公开
标题翻译：半导体模块测试装置
公开(公告)号：US20090039910A1
公开(公告)日：2009-02-12
申请号：US12174302
申请日：2008-07-16
申请人： Gerd Frankowsky , Roman Mayr
发明人： Gerd Frankowsky , Roman Mayr
IPC分类号： G01R1/073
CPC分类号： G01R31/2893 , G01R31/2889
摘要： A test apparatus for semiconductor modules. One embodiment provides a test system. The test system includes a handler configured to receive at least one semiconductor module. The test system is equipped with a plurality of different pin cards. The handler has at least two independent groups of test receptacles.
摘要翻译：一种用于半导体模块的测试装置。一个实施例提供一种测试系统。测试系统包括配置成接收至少一个半导体模块的处理器。测试系统配备有多个不同的针卡。处理器至少有两组独立的测试插座。

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