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1. 发明授权

US5801449A Process and substrate for connecting an integrated circuit to another substrate by means of balls 失效
标题翻译：用于通过球将集成电路连接到另一基板的工艺和基板
公开(公告)号：US5801449A
公开(公告)日：1998-09-01
申请号：US666389
申请日：1996-06-19
申请人： Gerard Dehaine , Yves Stricot
发明人： Gerard Dehaine , Yves Stricot
IPC分类号： H01L21/60 , H01L23/498 , H01L23/50 , H05K3/32 , H05K3/34 , H05K3/36 , H01L23/48 , H01L23/52
CPC分类号： H01L24/81 , H01L23/49816 , H01L23/4985 , H05K3/3436 , H05K3/3478 , H05K3/363 , H01L2224/81801 , H01L2924/01033 , H01L2924/0105 , H01L2924/01058 , H01L2924/01061 , H01L2924/01075 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H05K2201/0394 , H05K2201/09036 , H05K2201/09472 , H05K2201/10568 , H05K2201/10681 , H05K2201/10992 , H05K2203/041 , H05K3/321 , H05K3/3457 , Y02P70/613
摘要： An integrated circuit (IC) package (10), having an integrated circuit (11) and a connecting substrate (12) comprising an insulating film (13), one side of which carries conductors (14) and the other side of which carries balls (15) connected to the respective conductors by means of via holes (16) in the film. The balls (15) are fixed directly to said via holes, the base of which is formed by the respective conductors. The balls are preferably made of a remeltable material such as tin lead and the fixation can be made initially by an adhesive substance. The process for connecting two connecting substrates (12, 22) by means of balls (15), one of which substrates comprises a film (13), one side of which is provided with conductors (14) and the other side of which is provided with via holes (16), consists of fixing the balls directly to the conductors in the via holes by remelting the balls. The balls can be soldered or prefixed by an adhesive substance to connecting pads (23) of a board (22).
摘要翻译： PCT No.PCT / FR95 / 01670 Sec。 371日期1996年6月19日 102（e）日期1996年6月19日PCT提交1995年12月14日PCT公布。第WO96 / 19013 PCT公开日期：1996年6月20日具有集成电路（11）的集成电路（IC）封装（10）和包括绝缘膜（13）的连接基板（12），其一侧承载导体（14）和另一侧其侧面通过薄膜中的通孔（16）承载连接到各个导体的球（15）。球（15）直接固定在所述通孔上，其通孔由相应的导体形成。球优选由诸如锡铅的重熔材料制成，并且固定可以由粘合剂物质最初制成。用于通过滚珠（15）连接两个连接基板（12,22）的工艺，其中一个基板包括薄膜（13），其一侧设置有导体（14），另一侧设置有通孔（16）包括通过重新熔化球将滚珠直接固定在通孔中的导体上。球可以被粘合剂物质焊接或者前缀到板（22）的连接垫（23）。

2. 发明授权

US5901039A Mounting device for electronic components 失效
标题翻译：电子元件安装装置
公开(公告)号：US5901039A
公开(公告)日：1999-05-04
申请号：US895475
申请日：1997-07-16
申请人： Gerard Dehaine , Yves Stricot
发明人： Gerard Dehaine , Yves Stricot
IPC分类号： F16B5/02 , H01L23/40 , H05K7/20
CPC分类号： H01L23/4006 , H01L2023/4043 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002
摘要： A device for mounting a first element onto a second element to sandwich an electrical or electronic component therebetween, wherein the device is operable to cause the first element to exert a contact force on the component when the first element is mounted onto the second element and to couple the device to the first element in a manner which exerts a mounting force on the first element which is independent of whether the first element is mounted onto the second element. The first element may be a heat sink and the second element may be a printed circuit board.
摘要翻译：一种用于将第一元件安装到第二元件上以夹住其间的电气或电子部件的装置，其中，当所述第一元件安装到所述第二元件上时，所述装置可操作以使所述第一元件对所述元件施加接触力，并且将装置以对第一元件施加安装力的方式耦合到第一元件，该安装力独立于第一元件是否安装在第二元件上。第一元件可以是散热器，第二元件可以是印刷电路板。

3. 发明授权

US5925925A Three-dimensional integrated circuit package having conductors at different fixed potentials 失效
标题翻译：具有不同固定电位导体的三维集成电路封装
公开(公告)号：US5925925A
公开(公告)日：1999-07-20
申请号：US833060
申请日：1997-04-03
申请人： Gerard Dehaine , Roland Marbot , Michel Moreau , Yves Stricot
发明人： Gerard Dehaine , Roland Marbot , Michel Moreau , Yves Stricot
IPC分类号： H01L23/50 , H01L23/66 , H01L23/552 , H01L23/04 , H01L23/52
CPC分类号： H01L24/48 , H01L23/66 , H01L24/49 , H01L2224/05599 , H01L2224/48091 , H01L2224/48472 , H01L2224/49109 , H01L2224/49175 , H01L2224/4943 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01014 , H01L2924/01019 , H01L2924/01033 , H01L2924/01058 , H01L2924/01061 , H01L2924/01078 , H01L2924/01082 , H01L2924/01094 , H01L2924/014 , H01L2924/14 , H01L2924/15173 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025
摘要： The invention applies to packages for transmitting signals at very high frequencies. A package (10) for the integrated circuit (11) comprises conductors disposed on at least two levels (N1-N6) and distributed so that two pairs of conductors of two fixed potentials (18d, 18g; 19d, 19g), along with a conductor (18s) for single-pole transmission of a signal, form a three-dimensional structure which is approximately coaxial having a characteristic impedance which is substantially constant and predetermined.
摘要翻译：本发明适用于以非常高的频率传输信号的封装。用于集成电路（11）的封装（10）包括设置在至少两个级（N1-N6）上的导体，并分布成使得两对固定电位的导体（18d，18g，19d，19g）连同一个导体（18s）用于信号的单极传输，形成近似同轴的具有基本恒定和预定的特性阻抗的三维结构。

4. 发明申请

US20140147084A1 ALIGNMENT PIN AND OPTICAL COMMUNICATION SYSTEM 有权
标题翻译：对准PIN和光通信系统
公开(公告)号：US20140147084A1
公开(公告)日：2014-05-29
申请号：US13881527
申请日：2011-10-25
申请人： Gnitaboure Yabre , Nicolas Hermeline , Yves Stricot , Gert Droesbeke
发明人： Gnitaboure Yabre , Nicolas Hermeline , Yves Stricot , Gert Droesbeke
IPC分类号： G02B6/42
CPC分类号： G02B6/4219 , G02B6/30 , G02B6/3885 , G02B6/4214 , G02B6/423 , G02B6/4249 , G02B6/4292
摘要： An alignment pin for an optical communication system comprises: a first portion (31) extending along a direction in a receiving hole of a printed circuit board, a second portion (32) extending along this direction in a receiving through hole of an optical coupling device, a third portion (33) extending along this direction in a receiving hole of an external optical component. The pin comprises an abutting surface (35) placed in contact with a parallel complementary surface (36) of the optical coupling device.
摘要翻译：一种用于光通信系统的对准销包括：沿着印刷电路板的接收孔中的方向延伸的第一部分（31），沿着该方向在光耦合装置的接收通孔中延伸的第二部分，在外部光学部件的接收孔中沿该方向延伸的第三部分（33）。销包括与光耦合装置的平行互补表面（36）接触放置的邻接表面（35）。

5. 发明授权

US06565384B2 Electro-optical connector with flexible circuit 有权
标题翻译：电光连接器具有柔性电路
公开(公告)号：US06565384B2
公开(公告)日：2003-05-20
申请号：US10027962
申请日：2001-10-25
申请人： Yves Stricot , Abdelkrim Belhora , Jan Van Koetsem , Niranjan Kumar Mitra
发明人： Yves Stricot , Abdelkrim Belhora , Jan Van Koetsem , Niranjan Kumar Mitra
IPC分类号： H01R33945
CPC分类号： H05K1/118 , G02B6/4201 , G02B6/43 , H05K1/189
摘要： An electro-optical connection module (1) comprises a first end (30) designed to receive optical fibers (11), and comprises means (6) to convert a signal conveyed by these optical fibers into an electrical signal. These means are preferably placed on a rigid portion (4) of a printed circuit (2) contained in this module. Furthermore, this printed circuit portion is connected by means of a flexible printed circuit portion (13) to a printed circuit end (17). This printed circuit end has contacts (100) in the form of an electrical plug at one end (34) of this module. This second end is opposite to the first end of the module. Thus, the optical module is used for an electrical connection and comprises every means to convert the optical signal received into an electrical signal.
摘要翻译：电光连接模块（1）包括设计成接收光纤（11）的第一端（30），并且包括将由这些光纤传送的信号转换为电信号的装置（6）。这些装置优选地放置在包含在该模块中的印刷电路（2）的刚性部分（4）上。此外，该印刷电路部分通过柔性印刷电路部分（13）连接到印刷电路端（17）。该印刷电路端在该模块的一端（34）处具有电插塞形式的触点（100）。该第二端与模块的第一端相对。因此，光学模块用于电连接，并且包括将所接收的光信号转换成电信号的各种装置。

6. 发明授权

US06384471B1 Pbga package with integrated ball grid 有权
标题翻译： Pbga封装，集成球栅
公开(公告)号：US06384471B1
公开(公告)日：2002-05-07
申请号：US09743061
申请日：2001-01-04
申请人： Claude Petit , Yves Stricot
发明人： Claude Petit , Yves Stricot
IPC分类号： H01L2302
CPC分类号： H01L23/49816 , H01L23/49822 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2924/01012 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/00014 , H01L2924/00
摘要： The present invention concerns a package for an integrated circuit (3) of the type comprising a cavity (2) in which the integrated circuit (3) is mounted, the active surface (10) of the integrated circuit (3) being electrically connected to the package on the level of connection (Nc) of an array of balls (13i) to the package, providing a mechanical and electrical link between the integrated circuit (3) and a printed circuit card to which the package must be assembled. It is characterized in that it comprises an additional layer (14) that is rigid and electrically neutral, mounted on the level of connection (Nc) of the integrated circuit (3) and the balls (13i) and containing the balls (13i). It particularly applies to the connections of BGA and PBGA packages.
摘要翻译：本发明涉及一种用于集成电路（3）的封装，其包括其中安装有集成电路（3）的空腔（2），集成电路（3）的有源表面（10）电连接到所述包装在所述包装球（13i）阵列的连接水平（Nc）上，在所述集成电路（3）和所述包装必须组装到的印刷电路卡之间提供机械和电连接。其特征在于，其包括刚性和电中性的附加层（14），其安装在集成电路（3）和球（13i）的连接级（Nc）上并且容纳球（13i）。它特别适用于BGA和PBGA封装的连接。

7. 发明授权

US08905651B2 Dismountable optical coupling device 有权
标题翻译：可拆卸光耦合装置
公开(公告)号：US08905651B2
公开(公告)日：2014-12-09
申请号：US13751379
申请日：2013-01-28
申请人： Nicolas Hermeline , Alain Flers , Stephane Barlerin , Yves Stricot
发明人： Nicolas Hermeline , Alain Flers , Stephane Barlerin , Yves Stricot
IPC分类号： G02B6/36 , G02B6/42
CPC分类号： G02B6/3628 , G02B6/4206 , G02B6/4214 , G02B6/4239 , G02B6/4249 , G02B6/4292 , Y10T29/4913
摘要： An optical communication system comprising: an optical circuit board comprising an optical interface having a transmission region, an optical coupling device comprising: a first optical interface having a first transmission region optically coupled to a corresponding transmission region of the optical interface of the optical circuit board, a second optical interface having a second transmission region adapted to be optically coupled to a corresponding transmission region of an optical interface of a mating optical device, a fixation part, wherein the optical communication system comprises a support element glued to the fixation part of the optical coupling device and removably mounted on the optical circuit board.
摘要翻译：一种光通信系统，包括：光电路板，包括具有透射区域的光接口，光耦合装置，包括：第一光接口，具有光耦合到所述光电路板的光接口的对应传输区域的第一透射区域具有第二透射区域的第二光学接口，所述第二透射区域适于光耦合到配合光学器件的光学界面的相应透射区域，固定部分，其中所述光学通信系统包括胶合到所述固定部分的固定部分的支撑元件光耦合装置，可拆卸地安装在光电路板上。

8. 发明申请

US20130195408A1 DISMOUNTABLE OPTICAL COUPLING DEVICE 有权
标题翻译：不可配置的光耦合器件
公开(公告)号：US20130195408A1
公开(公告)日：2013-08-01
申请号：US13751379
申请日：2013-01-28
申请人： Nicolas Hermeline , Alain Flers , Stephane Barlerin , Yves Stricot
发明人： Nicolas Hermeline , Alain Flers , Stephane Barlerin , Yves Stricot
IPC分类号： G02B6/36
CPC分类号： G02B6/3628 , G02B6/4206 , G02B6/4214 , G02B6/4239 , G02B6/4249 , G02B6/4292 , Y10T29/4913
摘要： An optical communication system comprising: an optical circuit board comprising an optical interface having a transmission region, an optical coupling device comprising: a first optical interface having a first transmission region optically coupled to a corresponding transmission region of the optical interface of the optical circuit board, a second optical interface having a second transmission region adapted to be optically coupled to a corresponding transmission region of an optical interface of a mating optical device, a fixation part, wherein the optical communication system comprises a support element glued to the fixation part of the optical coupling device and removably mounted on the optical circuit board.
摘要翻译：一种光通信系统，包括：光电路板，包括具有透射区域的光接口，光耦合装置，包括：第一光接口，具有光耦合到所述光电路板的光接口的对应传输区域的第一透射区域具有第二透射区域的第二光学接口，所述第二透射区域适于光耦合到配合光学器件的光学界面的相应透射区域，固定部分，其中所述光学通信系统包括胶合到所述固定部分的固定部分的支撑元件光耦合装置，可拆卸地安装在光电路板上。

9. 发明申请

US20120040546A1 Very High Frequency Electrical Connector 审中-公开
标题翻译：超高频电连接器
公开(公告)号：US20120040546A1
公开(公告)日：2012-02-16
申请号：US11630216
申请日：2005-06-30
申请人： Gert Droesbeke , Stéphane Barlerin , Antoine Fares-Karam , David Lemarechal , Yves Stricot
发明人： Gert Droesbeke , Stéphane Barlerin , Antoine Fares-Karam , David Lemarechal , Yves Stricot
IPC分类号： H01R13/52
CPC分类号： H01R13/035 , H01R4/2404 , H01R13/112 , H01R13/6599 , H01R13/6658
摘要： The invention concerns an electrical connector including a box, at least one electrically conductive track and a plurality of first electrical contacts, the first contacts being designed to come into contact with complementary second electrical contacts of a complementary connection device. In order to reduce the manufacturing cost of such an electrical connector and increase the electronic data transfer capacity through this electrical connector, the invention provides that the first electrical contacts are connected to electrically conductive tracks by joining, and that the box is formed by at least one molded plastic that is at least partially metal-coated to form the electrically conductive tracks.
摘要翻译：本发明涉及一种电连接器，其包括盒，至少一个导电轨道和多个第一电触点，第一触点设计成与互补连接装置的互补的第二电触点接触。为了降低这种电连接器的制造成本并且通过该电连接器增加电子数据传输能力，本发明提供了第一电触点通过接合连接到导电轨道，并且该盒至少形成一个模制塑料，其至少部分金属涂覆以形成导电轨道。

10. 发明授权

US09063307B2 Printed circuit board assembly and a method for manufacturing the printed circuit board assembly 有权
标题翻译：印刷电路板组件和印刷电路板组件的制造方法
公开(公告)号：US09063307B2
公开(公告)日：2015-06-23
申请号：US13991742
申请日：2011-12-07
申请人： Gnitaboure Yabre , Yves Stricot
发明人： Gnitaboure Yabre , Yves Stricot
IPC分类号： G02B6/42 , H05K1/02 , H05K1/18 , H05K1/14 , H05K3/30
CPC分类号： G02B6/4269 , G02B6/4206 , G02B6/4214 , G02B6/428 , H05K1/021 , H05K1/0274 , H05K1/141 , H05K1/183 , H05K3/306 , H05K2201/09845 , H05K2201/10121 , H05K2201/10416 , H05K2201/10674 , Y10T29/49139
摘要： Printed circuit board assembly including an optical subassembly having a carrying face for carrying at least one optoelectronic component in a such way that light emitted from/directed to is transmitted through the optical subassembly; a printed circuit board having a supporting area for supporting the optical subassembly; wherein the printed circuit board supporting area includes a hole lodging at least one part of the optoelectronic component and wherein at least one part of the carrying face is fixed by flip-chip bonding to at least one part of the supporting area.
摘要翻译：印刷电路板组件，其包括具有用于承载至少一个光电子部件的承载面的光学子组件，使得从其发射/发射的光通过光学子组件传输; 印刷电路板，具有用于支撑所述光学子组件的支撑区域; 其中所述印刷电路板支撑区域包括覆盖所述光电子部件的至少一部分的孔，并且其中所述承载面的至少一部分通过倒装芯片接合固定到所述支撑区域的至少一部分。

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