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1. 发明授权

US06676823B1 High speed acid copper plating 失效
标题翻译：高速酸性镀铜
公开(公告)号：US06676823B1
公开(公告)日：2004-01-13
申请号：US10100708
申请日：2002-03-18
申请人： George Bokisa
发明人： George Bokisa
IPC分类号： C25D338
CPC分类号： C25D3/38
摘要： One aspect of the invention relates to an aqueous copper plating bath containing sulfuric acid with a specific ratio to at least one supplemental acid selected from the group consisting of fluoboric acid, alkane sulfonic acids, and alkanol sulfonic acids; a copper salt; chloride ions; and at least one sulfate bath brightener. Another aspect of the invention relates to aqueous copper plating bath containing fluoboric acid and/or an alkane sulfonic acid but no sulfuric acid, copper sulfate, chloride ions, and at least one sulfate bath brightener. Yet another aspect of the invention relates to methods of plating copper from the aforementioned copper plating baths. Still yet another aspect of the invention relates to methods of plating copper at high speed using relatively high current densities.
摘要翻译：本发明的一个方面涉及含有与至少一种选自氟硼酸，链烷磺酸和链烷醇磺酸的至少一种补充酸的硫酸的含水铜电镀液; 铜盐; 氯离子; 和至少一种硫酸盐浴增白剂。本发明的另一方面涉及含有氟硼酸和/或烷烃磺酸但不含硫酸，硫酸铜，氯离子和至少一种硫酸盐浴增白剂的含水铜电镀浴。本发明的另一方面涉及从上述镀铜浴镀铜的方法。本发明的另一方面涉及使用相对高的电流密度高速镀铜的方法。

2. 发明申请

US20060096867A1 Tin alloy electroplating system 审中-公开
标题翻译：锡合金电镀系统
公开(公告)号：US20060096867A1
公开(公告)日：2006-05-11
申请号：US10985194
申请日：2004-11-10
申请人： George Bokisa , William Eckles
发明人： George Bokisa , William Eckles
IPC分类号： C25D3/58 , C25D3/60
CPC分类号： C25D3/56 , C25D3/60
摘要： Disclosed are systems and methods of plating a tin alloy in an efficient, economical, and environmentally friendly manner. The system for plating a tin alloy contains an electrochemical cell containing an anode, the cathode, and an electroplating bath. The electroplating bath contains water, an acid, at least one nitrogen-containing heterocyclic complexing agent, an ionic alloy metal, and ionic tin. The methods involve applying a current to the electroplating bath whereby a tin alloy forms on the cathode.
摘要翻译：公开了以高效，经济和环保的方式电镀锡合金的系统和方法。用于电镀锡合金的系统包含含有阳极，阴极和电镀浴的电化学电池。电镀浴含有水，酸，至少一种含氮杂环络合剂，离子合金金属和离子锡。所述方法包括向电镀浴施加电流，由此在阴极上形成锡合金。

3. 发明申请

US20050173255A1 Electroplated quaternary alloys 审中-公开
标题翻译：电镀四元合金
公开(公告)号：US20050173255A1
公开(公告)日：2005-08-11
申请号：US10772595
申请日：2004-02-05
申请人： George Bokisa , William Eckles , Robert Frischauf
发明人： George Bokisa , William Eckles , Robert Frischauf
IPC分类号： C25D3/56
CPC分类号： C25D3/562
摘要： Disclosed are methods of electroplating a quaternary alloy containing nickel, cobalt, and at least two metal alloys involving providing an electroplating bath comprising ionic nickel, ionic cobalt, at least two ionic alloy metals, and at least one brightener; and applying a current to the electroplating bath whereby a quaternary alloy forms.
摘要翻译：公开了电镀含有镍，钴和至少两种金属合金的四价合金的方法，其涉及提供包括离子镍，离子钴，至少两种离子合金金属和至少一种增白剂的电镀浴; 并将电流施加到电镀浴，由此形成四元合金。

4. 发明申请

US20050173254A1 Nickel cobalt boron ternary alloys 审中-公开
标题翻译：镍钴硼三元合金
公开(公告)号：US20050173254A1
公开(公告)日：2005-08-11
申请号：US10772473
申请日：2004-02-05
申请人： George Bokisa , William Eckles , Robert Frischauf
发明人： George Bokisa , William Eckles , Robert Frischauf
IPC分类号： C25D3/56 , C25D5/18
CPC分类号： C25D3/562 , C25D5/18
摘要： Disclosed are methods of electroplating a nickel cobalt boron alloy involving providing an electroplating bath comprising ionic nickel, ionic cobalt, ionic boron, and at least one brightener; and applying a current to the electroplating bath whereby a nickel cobalt boron alloy forms.
摘要翻译：公开了一种电镀镍钴硼合金的方法，其涉及提供包括离子镍，离子钴，离子硼和至少一种增白剂的电镀浴; 并向电镀浴施加电流，由此形成镍钴硼合金。

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