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1. 发明授权

US5702872A Process for resist pattern formation using positive electrodeposition photoresist compositions 失效
标题翻译：使用正电沉积光致抗蚀剂组合物的抗蚀剂图案形成方法
公开(公告)号：US5702872A
公开(公告)日：1997-12-30
申请号：US610237
申请日：1996-03-04
申请人： Genji Imai , Naozumi Iwasawa , Tsuguo Yamaoka
发明人： Genji Imai , Naozumi Iwasawa , Tsuguo Yamaoka
IPC分类号： G03F7/004 , G03F7/039 , G03F7/16 , G03F7/027
CPC分类号： G03F7/0045 , G03F7/039 , G03F7/164 , G03F7/168 , Y10S430/12 , Y10S430/122
摘要： A positive type electrodeposition photoresist composition includes, as essential components: (A) 100 parts by weight of a polymer having carboxyl group(s) in an amount of 0.5 to 10 equivalents per kg of said polymer and optionally having hydroxyphenyl group(s) in an amount of at least 1 equivalent per kg of the polymer, or (A') a carboxyl group-containing polymer and (A") a hydroxy-phenyl group-containing polymer; (B) 5 to 150 parts by weight of a compound having at least 2 vinyl ether groups in the molecule; and (C) 0.1 to 40 parts by weight per 100 parts by weight of the total of polymer (A), or the polymer (A') and the polymer (A"), and the vinyl ether group-containing compound (B), which generates an acid when irradiated with an actinic ray. The composition is dissolved or dispersed in an aqueous medium by neutralizing the carboxyl group(s) in the polymer (A) or (A') with a basic compound. The positive type electrodeposition photoresist composition allows the forming of a fine image pattern at high resolution. A process for a resist pattern formation using such a composition is also disclosed.
摘要翻译：正型电沉积光致抗蚀剂组合物包括作为必要组分的（A）100重量份的具有羧基的聚合物，其量为每当所述聚合物为0.5至10当量，并且任选地具有羟基苯基至少1当量/ kg聚合物或（A'）含羧基聚合物和（A“）含羟基苯基的聚合物的量; （B）5〜150重量份的分子中具有至少2个乙烯基醚基的化合物; 和（C）每100重量份聚合物（A）或聚合物（A'）和聚合物（A“）和含乙烯基醚基化合物（B）的总量为0.1〜40重量份），当用光化射线照射时产生酸。通过用碱性化合物中和聚合物（A）或（A'）中的羧基，将组合物溶解或分散在水性介质中。正型电沉积光致抗蚀剂组合物允许以高分辨率形成精细图像图案。还公开了使用这种组合物的抗蚀剂图案形成方法。

2. 发明授权

US5527656A Positive type electrodeposition photoresist compositions 失效
标题翻译：正型电沉积光致抗蚀剂组合物
公开(公告)号：US5527656A
公开(公告)日：1996-06-18
申请号：US233443
申请日：1994-04-26
申请人： Genji Imai , Naozumi Iwasawa , Tsuguo Yamaoka
发明人： Genji Imai , Naozumi Iwasawa , Tsuguo Yamaoka
IPC分类号： G03F7/004 , G03F7/039 , G03F7/16 , G03C1/73
CPC分类号： G03F7/0045 , G03F7/039 , G03F7/164 , G03F7/168 , Y10S430/12 , Y10S430/122
摘要： A positive type electrodeposition photoresist composition includes, as essential components: (A) 100 parts by weight of a polymer having carboxyl group(s) in an amount of 0.5 to 10 equivalents per kg of said polymer and optionally having hydroxyphenyl group(s) in an amount of at least 1 equivalent per kg of the polymer, or (A') a carboxyl group-containing polymer and (A") a hydroxyphenyl group-containing polymer; (B) 5 to 150 parts by weight of a compound having at least 2 vinyl ether groups in the molecule; and (C) 0.1 to 40 parts by weight per 100 parts by weight of the total of polymer (A), or the polymer (A') and the polymer (A"), and the vinyl ether group-containing compound (B), which generates an acid when irradiated with an actinic ray. The composition is dissolved or dispersed in an aqueous medium by neutralizing the carboxyl group(s) in the polymer (A) or (A') with a basic compound. The positive type electrodeposition photoresist composition allows the forming of a fine image pattern at high resolution. A process for a resist pattern formation using such a composition is also disclosed.
摘要翻译：正型电沉积光致抗蚀剂组合物包括作为必要组分的（A）100重量份的具有羧基的聚合物，其量为每当所述聚合物为0.5至10当量，并且任选地具有羟基苯基或（A'）含有羧基的聚合物和（A“）含羟基苯基的聚合物的量为每千克聚合物至少1当量; （B）5〜150重量份的分子中具有至少2个乙烯基醚基的化合物; 和（C）每100重量份聚合物（A）或聚合物（A'）和聚合物（A“）和含乙烯基醚基化合物（B）的总量为0.1〜40重量份），当用光化射线照射时产生酸。通过用碱性化合物中和聚合物（A）或（A'）中的羧基，将组合物溶解或分散在水性介质中。正型电沉积光致抗蚀剂组合物允许以高分辨率形成精细图像图案。还公开了使用这种组合物的抗蚀剂图案形成方法。

3. 发明授权

US5650259A Processes for pattern formation using photosensitive compositions and liquid development 失效
标题翻译：使用光敏组合物和液体显影的图案形成方法
公开(公告)号：US5650259A
公开(公告)日：1997-07-22
申请号：US553978
申请日：1995-11-06
申请人： Genji Imai , Naozumi Iwasawa , Tsuguo Yamaoka
发明人： Genji Imai , Naozumi Iwasawa , Tsuguo Yamaoka
IPC分类号： G03F7/004 , G03F7/027 , G03F7/30 , G03F7/38 , G03F7/40
CPC分类号： G03F7/0045 , G03F7/027
摘要： A photosensitive composition which comprises, as essential components:(A) a polymer having carboxyl group(s) and hydroxyphenyl group(s), or (A') a polymer having carboxy group(s) and (A") a polymer having hydroxyphenyl group(s),(B) a compound having at least two vinyl ether groups in the molecule, and(C) a compound which generates an acid when irradiated with am actinic ray, and which is useful as a positive type photoresist having high resolution and excellent formability of fine image pattern, a material for printing, etc.; and a process for pattern formation using said composition.
摘要翻译：作为必要成分的感光性组合物：（A）具有羧基和羟基苯基的聚合物，或（A'）具有羧基的聚合物和（A“）具有羟基苯基，（B）分子中具有至少两个乙烯基醚基的化合物，（C）当用光激光照射时产生酸的化合物，并且可用作具有高分子量的正型光致抗蚀剂精细图像图案的分辨率和优异的成形性，印刷材料等; 以及使用所述组合物的图案形成方法。

4. 发明授权

US5496678A Photosensitive compositions containing a polymer with carboxyl and hydroxyphenyl groups, a compound with multiple ethylenic unsaturation and a photo-acid generator 失效
标题翻译：含有具有羧基和羟基苯基的聚合物的光敏组合物，具有多个烯属不饱和键的化合物和光酸发生剂
公开(公告)号：US5496678A
公开(公告)日：1996-03-05
申请号：US227346
申请日：1994-04-14
申请人： Genji Imai , Naozumi Iwasawa , Tsuguo Yamaoka
发明人： Genji Imai , Naozumi Iwasawa , Tsuguo Yamaoka
IPC分类号： G03F7/004 , G03F7/027 , G03F7/021 , G03F7/029 , G03F7/032
CPC分类号： G03F7/0045 , G03F7/027
摘要： A photosensitive composition which comprises, as essential components:(A) a polymer having carboxyl group(s) and hydroxyphenyl group(s), or (A') a polymer having carboxyl group(s) and (A") a polymer having hydroxyphenyl group(s),(B) a compound having at least two vinyl ether groups in the molecule, and(C) a compound which generates an acid when irradiated with an actinic ray, and which is useful as a positive type photoresist having high resolution and excellent formability of fine image pattern, a material for printing, etc.; and a process for pattern formation using said composition.
摘要翻译：作为必要成分的感光性组合物：（A）具有羧基和羟基苯基的聚合物，或（A'）具有羧基的聚合物和（A“）具有羟基苯基，（B）分子中具有至少两个乙烯基醚基的化合物，（C）当用光化射线照射时产生酸的化合物，其可用作具有高分子量的正型光致抗蚀剂精细图像图案的分辨率和优异的成形性，印刷材料等; 以及使用所述组合物的图案形成方法。

5. 发明授权

US5576148A Process for production of printed circuit board 失效
标题翻译：印刷电路板生产工艺
公开(公告)号：US5576148A
公开(公告)日：1996-11-19
申请号：US382155
申请日：1995-02-01
申请人： Genji Imai , Yukari Takeda , Hideo Kogure , Naozumi Iwasawa
发明人： Genji Imai , Yukari Takeda , Hideo Kogure , Naozumi Iwasawa
IPC分类号： H05K3/42 , H05K3/00 , H05K3/06 , H05K3/46 , G03F7/00
CPC分类号： H05K3/0094 , H05K2201/09581 , H05K2203/0582 , H05K2203/107 , H05K2203/135 , H05K3/0082 , H05K3/064
摘要： The present invention provides a process for producing a high-density printed wiring board with plated throughholes, at high productivity and reliability by a direct drawing method. The process comprises making throughholes in a substrate having an electro-conductive layer on each side; conducting plating on at least the walls of the substrate throughholes; forming a photosensitive resist film on each side of the substrate; applying an actinic radiation onto the resist film by a direct drawing method in the shape of a pattern to be obtained when the resist film is a negative type, or in the shape of a pattern reverse to a pattern to be obtained when the resist film is a positive type; forming, on the uncoated portion inside the throughholes by electrodeposition, an electrodeposition film which is insoluble in a developing solution used later and an etching solution used later but is removable with a peeling solution used later; conducting development with an appropriate developing solution to remove the resist film; removing the exposed plating layer portion and the electro-conductive layer portion present therebeneath, by etching; and then peeling the remaining resist film and the electrodeposition film inside the throughholes, with an appropriate peeling solution.
摘要翻译：本发明提供一种通过直接拉伸法以高生产率和可靠性制造具有电镀通孔的高密度印刷线路板的方法。该方法包括在每个侧面上具有导电层的基板中形成通孔; 至少在基板通孔的壁上进行电镀; 在基板的每一侧上形成光敏抗蚀剂膜; 通过直接拉伸法将光化辐射施加到抗蚀剂膜为负型时获得的图案的形状，或者与抗蚀剂膜为积极的类型通过电沉积在通孔内的未涂覆部分上形成不溶于稍后使用的显影液的电沉积膜和稍后使用的可用随后使用的剥离溶液除去的蚀刻溶液; 用合适的显影液进行显影以除去抗蚀剂膜; 通过蚀刻去除暴露的镀层部分和存在于其中的导电层部分; 然后用适当的剥离溶液将剩余的抗蚀剂膜和电沉积膜剥离到通孔内。

6. 发明授权

US5389727A Resin compositions and a method of curing the same 失效
标题翻译：树脂组合物及其固化方法
公开(公告)号：US5389727A
公开(公告)日：1995-02-14
申请号：US112311
申请日：1993-08-27
申请人： Noboru Nakai , Osamu Isozaki , Naozumi Iwasawa
发明人： Noboru Nakai , Osamu Isozaki , Naozumi Iwasawa
IPC分类号： C08G59/40 , C07F7/08 , C07F7/18 , C08G59/00 , C08G59/02 , C08G59/04 , C08G59/30 , C08G59/32 , C08G59/70 , C08K5/00 , C08K5/07 , C08K5/1515 , C08K5/5415 , C08L33/06 , C08L43/04 , C08L63/00 , C08L75/04 , C08L101/06 , C09D133/06 , C09D133/14 , C09D143/04 , C09D163/00 , C08F8/00
CPC分类号： C08L63/00 , C07F7/0836 , C07F7/0858 , C07F7/0859 , C07F7/182 , C07F7/1836 , C07F7/1844 , C07F7/1896 , C08G59/02 , C08G59/04 , C08G59/306 , C08G59/3254 , C08G59/70 , C08K5/00 , C08K5/0091 , C08K5/07 , C08K5/1515 , C08K5/5415 , C08L101/06 , C08L75/04 , C09D133/064 , C09D133/068 , C09D143/04 , C09D163/00 , C08L33/068 , C08L43/04
摘要： A resin composition comprising a high molecular weight compound containing an average of 2 or more hydroxyl groups and an average of 1 or more functional groups selected from the class consisting of alkoxysilane, silanol and acyloxysilane groups per molecule and having a number average molecular weight of 3,000 to 200,000; a low molecular weight compound containing an average of 2 or more epoxy groups per molecule and having a number average molecular weight of 240 to 5,000; and, as a curing catalyst, a metal chelate compound, is curable at a relatively low temperature to yield a film having excellent resistance to weathering.
摘要翻译：一种树脂组合物，其包含平均分子量为2以上且平均分子量为1以上的官能团的高分子量化合物，每分子含有烷氧基硅烷，硅烷醇和酰氧基硅烷基，数均分子量为3000 到20万; 每分子平均含有2个以上环氧基且数均分子量为240〜5000的低分子量化合物; 作为固化催化剂，作为固化催化剂，金属螯合物在相对较低的温度下可固化，得到耐候性优异的膜。

7. 发明授权

US5284919A Resin compositions and a method of curing the same 失效
标题翻译：树脂组合物及其固化方法
公开(公告)号：US5284919A
公开(公告)日：1994-02-08
申请号：US672792
申请日：1991-03-21
申请人： Noboru Nakai , Osamu Isozaki , Naozumi Iwasawa
发明人： Noboru Nakai , Osamu Isozaki , Naozumi Iwasawa
IPC分类号： C08G59/40 , C07F7/08 , C07F7/18 , C08G59/00 , C08G59/02 , C08G59/04 , C08G59/30 , C08G59/32 , C08G59/70 , C08K5/00 , C08K5/07 , C08K5/1515 , C08K5/5415 , C08L33/06 , C08L43/04 , C08L63/00 , C08L75/04 , C08L101/06 , C09D133/06 , C09D133/14 , C09D143/04 , C09D163/00 , C08G77/04
CPC分类号： C08L63/00 , C07F7/0836 , C07F7/0858 , C07F7/0859 , C07F7/182 , C07F7/1836 , C07F7/1844 , C07F7/1896 , C08G59/02 , C08G59/04 , C08G59/306 , C08G59/3254 , C08G59/70 , C08K5/00 , C08K5/0091 , C08K5/07 , C08K5/1515 , C08K5/5415 , C08L101/06 , C08L75/04 , C09D133/064 , C09D133/068 , C09D143/04 , C09D163/00 , C08L33/068 , C08L43/04
摘要： A resin composition comprising two different compounds, A and B, with a number average molecular weight of 3,000 to 200,000 and a chelate compound. Compound A has two or more hydroxyl groups. Compound B has two or more epoxy groups and one or more of the following silane groups silanol, alkoxy silane and acyloxy silane.
摘要翻译：包含数均分子量为3,000〜200,000的两种不同化合物A和B的树脂组合物和螯合物。化合物A具有两个或多个羟基。化合物B具有两个或更多个环氧基团和一个或多个以下硅烷基团硅烷醇，烷氧基硅烷和酰氧基硅烷。

8. 发明授权

US5281449A Method of forming pattern coatings based on a radiation curable composition which contains a resin having both thioether and carboxyl groups 失效
标题翻译：基于含有具有硫醚和羧基的树脂的可辐射固化组合物形成图案涂层的方法
公开(公告)号：US5281449A
公开(公告)日：1994-01-25
申请号：US742232
申请日：1991-08-08
申请人： Naozumi Iwasawa , Hideo Kogure , Heihachi Murase
发明人： Naozumi Iwasawa , Hideo Kogure , Heihachi Murase
IPC分类号： G03F7/027 , G03F7/028 , G03F7/031 , G03F7/038 , G03F7/075 , H01L21/027 , H05K3/00 , B05D3/06 , G03C1/705
CPC分类号： G03F7/038 , H05K3/0076
摘要： The invention provides a method for forming a pattern coating, the method including the steps of:applying to a substrate a radiation curable composition containing a resin (a) which contains, per kilogram of said resin (a) about 1.5 to about 4.5 moles of a polyermizable unsaturated group, about 0.4 to about 2.5 moles of a carboxyl group and 0.2 to about 3.5 moles of a thioether group, the resin having a number average molecular weight of about 500 to about 50,000; selectively irradiating a portion of the applied coating with actinic rays; and subjecting the coating to development with an alkali aqueous solution.
摘要翻译：本发明提供一种形成图案涂层的方法，该方法包括以下步骤：向基材施加含有树脂（a）的可辐射固化组合物，该树脂（a）每千克所述树脂（a）含有约1.5至约4.5摩尔约0.4至约2.5摩尔的羧基和0.2至约3.5摩尔的硫醚基团，所述树脂的数均分子量为约500至约50,000; 用光化射线选择性地照射所涂敷的涂层的一部分; 并用碱性水溶液对涂层进行显影。

9. 发明授权

US5236810A Process for preparing printed-circuit board 失效
标题翻译：制备印刷电路板的工艺
公开(公告)号：US5236810A
公开(公告)日：1993-08-17
申请号：US592245
申请日：1990-10-03
申请人： Toshio Kondo , Shinsuke Onishi , Naozumi Iwasawa , Sadaaki Hashimoto
发明人： Toshio Kondo , Shinsuke Onishi , Naozumi Iwasawa , Sadaaki Hashimoto
IPC分类号： G03F7/26 , H05K3/06
CPC分类号： G03F7/265 , H05K3/064 , H05K2203/0793 , H05K2203/135
摘要： An improved process for preparing a printed-circuit board, which successively comprises (I) a step of forming a positive photo-sensitive resist film onto a circuit board having a conductive film according to the electrodeposition coating process, (II) a step of irradiating a full dose of an actinic ray onto the positive photo-sensitive resist film through a photomask with which the actinic ray is cut off over a conductive circuit-forming area, (III) a step of developing the resulting resist film, (IV) a step of etching away a deposited copper-clad area, and (V) removing a remaining resist film on the conductive circuit-forming area, the improvement further comprising a step of imparting the resist film in the conductive circuit-forming area an increased alkali resistance prior to development so as to obtain the printed-circuit board having high resolution with good reproductivity without being affected by variations of the developing conditions.
摘要翻译：一种制备印刷电路板的改进方法，其依次包括（I）根据电沉积涂布工艺在具有导电膜的电路板上形成正光敏抗蚀剂膜的步骤，（II）照射步骤通过在导电电路形成区域上切割光化射线的光掩模，将正光敏抗蚀剂膜上的全剂量的光化射线，（III）显影所得抗蚀剂膜的步骤，（IV）蚀刻掉沉积的铜包层区域的步骤，以及（V）去除导电电路形成区域上的剩余抗蚀剂膜，该改进还包括将导电电路形成区域中的抗蚀剂膜赋予增加的耐碱性的步骤在开发之前，以获得具有高分辨率的印刷电路板，具有良好的再现性，而不受显影条件的变化的影响。

10. 发明授权

US5591562A Water and acid developable photoresist composition exhibiting improved adhesion 失效
标题翻译：水和酸显影的光致抗蚀剂组合物显示出改进的附着力
公开(公告)号：US5591562A
公开(公告)日：1997-01-07
申请号：US322415
申请日：1994-10-13
申请人： Nobuo Komatsu , Ikuyo Kai , Nami Konishi , Naozumi Iwasawa , Satoru Furusawa
发明人： Nobuo Komatsu , Ikuyo Kai , Nami Konishi , Naozumi Iwasawa , Satoru Furusawa
IPC分类号： G03F7/004 , C08F290/00 , C08F290/06 , G03F7/029 , G03F7/032 , G03F7/038 , H05K3/28 , G03C1/725
CPC分类号： G03F7/032 , G03F7/0388 , H05K3/287
摘要： A photopolymerizable composition suitable as a solder resist and capable of forming a resist film having characteristics in no way inferior to those of the conventional heat-curable type or organic solvent developed type solder resist, with the use of water or a dilute aqueous solution which is completely innocuous and higher in safety than the aqueous alkaline solution, and a method for producing a cured coated film pattern using the photopolymerizable composition.
摘要翻译：适合作为阻焊剂的光聚合性组合物，其能够形成抗蚀剂膜，该抗蚀剂膜的特性不比常规的可热固化型或有机溶剂显影型阻焊剂的性能差，使用水或稀水溶液与碱性水溶液完全无害且更高的安全性，以及使用该光聚合性组合物制造固化的涂膜图案的方法。

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