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    • 5. 发明授权
    • Curable epoxy resin compositions with brominated triazine flame retardants
    • 具有溴化三嗪阻燃剂的可固化环氧树脂组合物
    • US06387990B1
    • 2002-05-14
    • US09393772
    • 1999-09-10
    • Gary W. Yeager
    • Gary W. Yeager
    • C08K529
    • H05K1/0326C08G59/38C08K5/0066C08L63/00Y10T428/31518C08L2666/02
    • A curable composition is formulated from an epoxy resin; a flame-retardant additive essentially free of phenolic groups and of epoxy groups; and a thermoplastic resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferable is triazine. The preferred thermoplastic resin is a poly(phenylene ether). The inventive curable compositions advantageously can be combined with reinforcement in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics.
    • 可固化组合物由环氧树脂配制; 基本上不含酚基和环氧基的阻燃添加剂; 和热塑性树脂。 优选的环氧树脂是每分子具有小于2个缩水甘油醚基团的环氧树脂和每分子具有大于2个缩水甘油醚基团的环氧树脂的混合物。 优选的阻燃添加剂是优选三嗪的溴化杂环化合物。 优选的热塑性树脂是聚(苯醚)。 本发明的可固化组合物有利地可以与制造具有优异的电性能,良好的耐溶剂性和良好的热膨胀特性的电路板的增强结合。
    • 8. 发明授权
    • Cured epoxy resin compositions with brominated triazine flame retardants, and laminates comprising them
    • 具有溴化三嗪阻燃剂的固化环氧树脂组合物和包含它们的层合物
    • US06767639B2
    • 2004-07-27
    • US09683883
    • 2002-02-27
    • Gary W. Yeager
    • Gary W. Yeager
    • B32B1508
    • H05K1/0326C08G59/38C08K5/0066C08L63/00Y10T428/31518C08L2666/02
    • A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixture of brominated phenols with (ii) a cyanuric halide; and (c) a thermoplastic resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferably is a triazine. The preferred thermoplastic resin is a poly(phenylene ether). The cured composition further including a reinforcement may be used in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics. Laminates including the cured compositions and a metal foil are also described.
    • 固化组合物是可固化组合物的固化残余物,其包含(a)基本上不含溴原子的环氧树脂,环氧树脂的固化剂,(b)阻燃添加剂,其是(i)溴化物 苯酚或溴化酚与(ⅱ)氰尿酰卤的混合物; 和(c)热塑性树脂。 优选的环氧树脂是每分子具有小于2个缩水甘油醚基团的环氧树脂和每分子具有大于2个缩水甘油醚基团的环氧树脂的混合物。 优选的阻燃添加剂是优选为三嗪的溴化杂环化合物。 优选的热塑性树脂是聚(苯醚)。 进一步包含增强剂的固化组合物可以用于具有优异的电性能,良好的耐溶剂性和良好的热膨胀特性的电路板的制造中。 还描述了包括固化的组合物和金属箔的层压体。