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1. 发明申请

WO0147659A8 ENERGY-EFFICIENT, LASER-BASED METHOD AND SYSTEM FOR PROCESSING TARGET MATERIAL 审中-公开
标题翻译：能源效率，基于激光的方法和处理目标材料的系统
公开(公告)号：WO0147659A8
公开(公告)日：2001-08-09
申请号：PCT/US0034470
申请日：2000-12-19
申请人： GSI LUMONICS INC , SMART DONALD V
发明人： SMART DONALD V
IPC分类号： B23K26/00 , B23K26/06 , B23K26/073 , B23K26/40 , B23K101/36 , H01L21/302 , H01L21/768 , H01L23/525 , H01S3/00
CPC分类号： B23K26/0736 , B23K26/0622 , B23K26/0624 , B23K26/361 , B23K26/40 , B23K2203/50 , H01L21/76894 , H01L23/5258 , H01L2924/0002 , Y10S438/94 , Y10T29/49156 , H01L2924/00
摘要： An method and system for processing target material such as microstructures in a microscopic region without causing undesirable changes in electrical and/or physical characteristics of material surrounding the target material is provided. The system includes a controller for generating a processing control signal and a signal generator for generating a modulated drive waveform based on the processing control signal. The system also includes a gain-switched, pulsed semiconductor seed laser for generating a laser pulse trains at a repetition rate. The drive waveform pumps the laser so that each pluse of the pulse train has a predetermined shape. Further, the system includes a laser amplifier for optically amplifying the pulse train to obtain an amplified pulse train without significantly changing the predetermined shape of the pulse. Each of the amplified pulses has a substantially square temporal power density distribution, a sharp rise time, a pulse duration and a fall time. The system further includes a beam delivery and focusing subsystem for delivering and focusing at least a portion of the amplified pulse train onto the target material.
摘要翻译：提供了用于在微观区域中处理诸如微结构的目标材料而不引起围绕靶材料的材料的电气和/或物理特性的不期望的变化的方法和系统。该系统包括用于产生处理控制信号的控制器和用于基于处理控制信号产生调制的驱动波形的信号发生器。该系统还包括用于以重复率产生激光脉冲串的增益切换的脉冲半导体种子激光器。驱动波形泵浦激光器，使得脉冲串的每个脉冲具有预定的形状。此外，该系统包括用于光学放大脉冲串以获得放大脉冲串而不显着改变脉冲的预定形状的激光放大器。每个放大的脉冲具有基本上正方形的时间功率密度分布，急剧上升时间，脉冲持续时间和下降时间。该系统还包括用于将放大的脉冲序列的至少一部分传送和聚焦到目标材料上的束传递和聚焦子系统。

2. 发明申请

WO2005038994A3 LASER-BASED SYSTEM FOR MEMORY LINK PROCESSING WITH PICOSECOND LASERS 审中-公开
标题翻译：基于激光的系统，用于使用PICOSECOND激光进行存储器链接处理
公开(公告)号：WO2005038994A3
公开(公告)日：2006-01-26
申请号：PCT/US2004032661
申请日：2004-10-05
申请人： GSI LUMONICS CORP , GU BO , SMART DONALD V , CORDINGLEY JAMES J , LEE JOOHAN , SVETKOFF DONALD J , JOHNSON SHEPARD D , EHRMANN JONATHAN S
发明人： GU BO , SMART DONALD V , CORDINGLEY JAMES J , LEE JOOHAN , SVETKOFF DONALD J , JOHNSON SHEPARD D , EHRMANN JONATHAN S
IPC分类号： B23K26/00 , B23K26/04 , B23K26/06 , B23K26/073 , B23K26/36 , B23K26/38 , B23K26/40 , H01L21/48 , H01L21/66 , H01L21/768 , H01L23/525 , H01S20060101 , H01S3/067 , H01S3/16 , H01S3/23 , H05K3/00
CPC分类号： H01S3/2383 , B23K26/04 , B23K26/0624 , B23K26/0626 , B23K26/0736 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2201/38 , B23K2201/40 , B23K2203/10 , B23K2203/12 , B23K2203/172 , H01L21/485 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H01S3/0085 , H01S3/06758 , H01S3/1618 , H01S3/23 , H05K3/0026 , H01L2924/00
摘要： A laser-based system for processing target material within a microscopic region without causing undesirable changes in electrical or physical characteristics of at least one material surrounding the target material, the system includes a seed laser, an optical amplifier, and a beam delivery system. The seed laser for generating a sequence of laser pulses having a first pre-determined wavelength. The optical amplifier for amplifying at least a portion of the sequence of pulses to obtain an amplified sequence of output pulses. The beam delivery system for delivering and focusing at least one pulse of the amplified sequence of pulses onto the target material. The at least one output pulse having a pulse duration in the range of about (10) picoseconds to less than (1) nanosecond. The pulse duration being within a thermal processing range. The at least one focused output pulse having sufficient power density at a location within the target material to reduce the reflectivity of the target material and efficiently couple the focused output into the target material to remove the target material.
摘要翻译：一种用于在微观区域内处理目标材料而不引起围绕靶材料的至少一种材料的电学或物理特性的不希望的变化的基于激光的系统，该系统包括种子激光器，光学放大器和光束传递系统。用于产生具有第一预定波长的激光脉冲序列的种子激光器。用于放大脉冲序列的至少一部分以获得放大的输出脉冲序列的光放大器。用于将放大的脉冲序列的至少一个脉冲传送和聚焦到目标材料上的光束传送系统。所述至少一个输出脉冲具有在约（10）皮秒至小于（1）纳秒范围内的脉冲持续时间。脉冲持续时间在热处理范围内。所述至少一个聚焦输出脉冲在目标材料内的位置处具有足够的功率密度，以减少目标材料的反射率并有效地将聚焦的输出耦合到目标材料中以去除目标材料。

3. 发明申请

WO2007044798A2 OPTICAL METROLOGICAL SCALE AND LASER-BASED MANUFACTURING METHOD THEREFOR 审中-公开
标题翻译：光学尺度和激光制造方法
公开(公告)号：WO2007044798A2
公开(公告)日：2007-04-19
申请号：PCT/US2006039704
申请日：2006-10-11
申请人： GSI GROUP CORP , PELSUE KURT , DODSON II STUART A , HUNTER BRADLEY L , SMART DONALD V , MABBOUX PIERRE-YVES , EHRMANN JONATHAN S
发明人： PELSUE KURT , DODSON II STUART A , HUNTER BRADLEY L , SMART DONALD V , MABBOUX PIERRE-YVES , EHRMANN JONATHAN S
IPC分类号： C08K3/32
CPC分类号： B41M5/24 , B23K26/364 , G01D5/34707
摘要： A reflective metrological scale has a scale pattern of elongated side-by-side marks surrounded by reflective surface areas of a substrate, which may be a nickel-based metal alloy such as Invar® or Inconel® and may be a thin and elongated flexible tape. Each mark has a furrowed cross section and may have a depth in the range of 0.5 to 2 microns. The central region of each mark may be rippled or ridged and may be darkened to provide an enhanced optical reflection ratio with respect to surrounding reflective surface areas. A manufacturing method includes the repeated steps of (1) creating a scale mark by irradiating a surface of the substrate at a mark location with a series of overlapped pulses from a laser, each pulse having an energy density of less than about 1 joule per cm 2 , and (2) changing the relative position of the laser and the substrate by a displacement amount defining a next mark location on the substrate at which a next mark of the scale is to be created.
摘要翻译：反射计量标尺具有由基底的反射表面区域包围的细长的并排标记的刻度图形，其可以是诸如Invar或Inconel的镍基金属合金，并且可以是薄且细长的柔性带。每个标记具有沟槽的横截面并且可以具有在0.5至2微米范围内的深度。每个标记的中心区域可以是波纹或脊状的，并且可以变暗，以提供相对于周围的反射表面区域的增强的光反射率。一种制造方法包括以下重复步骤：（1）通过在来自激光的一系列重叠脉冲的标记位置处照射基板的表面来产生刻度标记，每个脉冲的能量密度小于约1焦耳/厘米＆lt; SUP＆gt; 2＆gt;和（2）通过在衬底上限定下一标记位置的位移量来改变激光和衬底的相对位置，在该衬底上将要生成刻度的下一个标记。

4. 发明申请

WO2005038995A3 MEMORY LINK PROCESSING WITH PICOSECOND LASERS 审中-公开
标题翻译：使用PICOSECOND激光的存储器链接处理
公开(公告)号：WO2005038995A3
公开(公告)日：2006-03-16
申请号：PCT/US2004032972
申请日：2004-10-06
申请人： GSI LUMONICS CORP , GU BO , SMART DONALD V , CORDINGLEY JAMES J , LEE JOOHAN , SVETKOFF DONALD J , JOHNSON SHEPARD D , EHRMANN JONATHAN S
发明人： GU BO , SMART DONALD V , CORDINGLEY JAMES J , LEE JOOHAN , SVETKOFF DONALD J , JOHNSON SHEPARD D , EHRMANN JONATHAN S
IPC分类号： B23K26/00 , B23K26/04 , B23K26/06 , B23K26/073 , B23K26/36 , B23K26/38 , B23K26/40 , H01L21/48 , H01L21/66 , H01L21/768 , H01L23/525 , H01S20060101 , H05K3/00 , H01L21/461
CPC分类号： H01L23/5258 , B23K26/04 , B23K26/0624 , B23K26/0736 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2201/38 , B23K2201/40 , B23K2203/08 , B23K2203/10 , B23K2203/12 , B23K2203/50 , H01L21/485 , H01L21/76894 , H01L22/12 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： A laser-based method of removing a target link (107) structure of a circuit fabricated on a substrate (110) includes generating a pulsed laser output (104) at a pre-determined wavelength less than an absorption edge of the substrate. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target structure to reduce the reflectivity of the target structure and efficiently couple the focused laser output into the target structure to remove the link without damaging the substrate.
摘要翻译：基于激光的方法去除在衬底（110）上制造的电路的目标连接（107）结构包括以小于衬底的吸收边缘的预定波长产生脉冲激光输出（104）。激光输出包括脉冲持续时间在约10皮秒至小于1纳秒范围内的至少一个脉冲，脉冲持续时间在热激光器处理范围内。该方法还包括将激光输出传送和聚焦到目标链路结构上。聚焦的激光输出在目标结构内的位置处具有足够的功率密度，以减小目标结构的反射率，并将聚焦的激光输出有效地耦合到目标结构中以去除连接而不损坏基板。

5. 发明申请

WO9965123A9 PULSE CONTROL IN LASER SYSTEMS 审中-公开
标题翻译：激光系统中的脉冲控制
公开(公告)号：WO9965123A9
公开(公告)日：2000-03-09
申请号：PCT/US9912148
申请日：1999-06-02
申请人： GEN SCANNING INC , SMART DONALD V
发明人： SMART DONALD V
IPC分类号： B23K26/00 , B23K26/06 , H01C17/242 , H01G5/019 , H01S3/00 , H01S3/10 , H01S3/11 , H01S3/117 , H01S3/13
CPC分类号： H01C17/242 , B23K26/0622 , B23K26/064 , B23K26/0648 , H01G5/019 , H01S3/0057 , H01S3/0085 , H01S3/08068 , H01S3/10038 , H01S3/10046 , H01S3/1068 , H01S3/117
摘要： A pulsed laser system includes a laser pump (14), a laser rod (12), a reflector (18) interposed between the laser pump and the laser rod, through which energy from the laser pump enters the laser rod, an output reflector (28) through which energy is emitted from the laser rod, a switch (20) interposed between the laser rod and the output reflector, and a control device. The control device allows a primary laser pulse emitted from the laser rod during the emission period to impinge on a workpiece and blocks from the workpiece secondary laser emission occurring during the emission period after emission of the primary pulse. The pulsed laser system is operated over a range of repetition rates, so as to cause laser energy emitted during plural emission periods at each repetition rate. A portion of the laser energy emitted is directed toward the target structure.
摘要翻译：脉冲激光系统包括激光泵（14），激光棒（12），介于激光泵和激光棒之间的反射器（18），来自激光泵的能量通过激光泵进入激光棒，输出反射器 28），通过该激光棒发射能量，设置在激光棒和输出反射器之间的开关（20）和控制装置。控制装置允许在发射周期期间从激光棒发射的初级激光脉冲撞击工件并阻止在发射主脉冲之后的发射周期期间发生的工件辅助激光发射。脉冲激光系统在重复频率范围内运行，以便在每个重复频率下在多个发射周期期间产生激光能量。发射的激光能量的一部分指向目标结构。

6. 发明申请

WO2007092803A3 LASER-BASED REMOVAL OF TARGET LINK STRUCTURES 审中-公开
标题翻译：目标链路结构的基于激光的移除
公开(公告)号：WO2007092803A3
公开(公告)日：2008-09-18
申请号：PCT/US2007061592
申请日：2007-02-05
申请人： GSI GROUP CORP , GU BO , SMART DONALD V , CORDINGLEY JAMES J , LEE JOOHAN , SVETKOFF DONALD J , JOHNSON SHEPARD D , EHRMANN JONATHAN S
发明人： GU BO , SMART DONALD V , CORDINGLEY JAMES J , LEE JOOHAN , SVETKOFF DONALD J , JOHNSON SHEPARD D , EHRMANN JONATHAN S
IPC分类号： B23K26/40
CPC分类号： B23K26/0736 , B23K26/0624 , B23K26/40 , B23K2203/50
摘要： Laser-based methods and systems for removing one or more target link structures 107 of a circuit fabricated on a substrate 110 includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output ontothe target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.
摘要翻译：提供了用于去除在基板110上制造的电路的一个或多个目标链路结构107的基于激光的方法和系统，包括产生比基板的吸收边缘小的预定波长的脉冲激光输出。激光输出包括脉冲持续时间在约10皮秒至小于1纳秒范围内的至少一个脉冲，脉冲持续时间在热激光器处理范围内。该方法还包括将激光输出传递和聚焦到目标链路结构上。聚焦的激光输出在目标链路结构内的位置处具有足够的功率密度，以减少目标链路结构的反射率，并将聚焦的激光输出有效地耦合到目标链路结构中以去除目标链路结构而不损坏基板。

7. 发明申请

WO0198016A3 LASER SYSTEM FOR PROCESSING TARGET MATERIAL 审中-公开
标题翻译：用于加工目标材料的激光系统
公开(公告)号：WO0198016A3
公开(公告)日：2002-06-27
申请号：PCT/US0117543
申请日：2001-05-31
申请人： GEN SCANNING INC , SMART DONALD V , SVETKOFF DONALD J
发明人： SMART DONALD V , SVETKOFF DONALD J
IPC分类号： B23K26/00 , B23K26/06 , B23K26/073 , B23K26/40 , B23K101/36 , B81C1/00 , H01L21/302 , H01L21/3205 , H01L21/768 , H01L23/52 , H01L23/525 , H01S3/00 , H01S3/06 , H01S3/067 , H01S3/23 , H01S3/30 , H01L21/70
CPC分类号： H01S3/2308 , B23K26/0624 , B23K26/0736 , B23K26/40 , B23K2203/50 , H01L21/76894 , H01L23/5258 , H01L2924/0002 , H01S3/06754 , H01S3/2375 , H01S3/302 , H01S2301/08 , H01L2924/00
摘要： An energy-efficient method and system for processing target material such as microstructures in a microscopic region without causing undesirable changes in electrical and/or physical characteristics of material surrounding the target material is provided. The system includes a controller for generating a processing control signal and a signal generator for generating a modulated drive waveform based on the processing control signal. The waveform has a sub-nanosecond rise time. The system also includes a gain-switched, pulsed semiconductor seed laser having a first wavelength for generating a laser pulse train at a repetition rate. The drive waveform pumps the laser so that each pulse of the pulse train has a predetermined shape. Further, the system includes a fiber amplifier subsystem for optically amplifying the pulse train to obtain an amplified pulse train without significantly changing the predetermined shape of the pulses. The amplified pulses have little distortion and have substantially the same relative temporal power distribution as the original pulse train from the laser. Each of the amplified pulses has a substantially square temporal power density distribution, a sharp rise time, a pulse duration and a fall time. The subsystem also includes a wavelength shifter in the form of an optical fiber for controllably shifting the first wavelength to a second, larger wavelength to obtain an amplified, wavelength-shifted, pulse train.
摘要翻译：提供了一种用于在微观区域中处理诸如微结构的目标材料而不引起围绕目标材料的材料的电气和/或物理特性的不期望的变化的能量效率方法和系统。该系统包括用于产生处理控制信号的控制器和用于基于处理控制信号产生调制的驱动波形的信号发生器。波形具有亚纳秒上升时间。该系统还包括具有用于以重复率产生激光脉冲串的第一波长的增益切换的脉冲半导体种子激光器。驱动波形泵浦激光器，使得脉冲串的每个脉冲具有预定的形状。此外，该系统包括光纤放大器子系统，用于光学放大脉冲串以获得放大的脉冲串，而不显着改变预定形状的脉冲。放大的脉冲具有很小的失真，并且具有与来自激光器的原始脉冲串相当的相对时间功率分布。每个放大的脉冲具有基本上正方形的时间功率密度分布，急剧上升时间，脉冲持续时间和下降时间。子系统还包括光纤形式的波长移位器，用于将第一波长可控地移位到第二较大波长以获得放大的波长偏移脉冲序列。

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