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1. 发明申请

WO2007047721A2 METHODS AND APPARATUS FOR UTILIZING AN OPTICAL REFERENCE 审中-公开
标题翻译：使用光学参考的方法和装置
公开(公告)号：WO2007047721A2
公开(公告)日：2007-04-26
申请号：PCT/US2006040633
申请日：2006-10-18
申请人： GSI GROUP CORP , EHRMANN JONATHAN S , DUFFY PATRICK S , WEBER MARKUS M , METZGER GREGG A , LENTO JOSEPH V , MABBOUX PIERRE-YVES , ZINK JENS , CHU YUN FEE
发明人： EHRMANN JONATHAN S , DUFFY PATRICK S , WEBER MARKUS M , METZGER GREGG A , LENTO JOSEPH V , MABBOUX PIERRE-YVES , ZINK JENS , CHU YUN FEE
IPC分类号： G01R31/26
CPC分类号： G01R31/2891 , B23K26/032 , B23K26/042 , B23K26/0861 , B23K26/351 , B23K26/705
摘要： A laser processing system implements a method for aligning a probe element (e.g., a probe pin) with a device interface element (e.g., a contact pad of a circuit substrate). First, the laser processing system generates an optical reference beam at one or more predetermined positions to calibrate a reference field. The laser processing system then detects a position of the probe element in the reference field. The laser processing system also determines a relative position of the device interface element in the reference field. Based on the position of the probe element and the device interface element, the laser processing system then initiates alignment of the probe element and the device interface element. In one application, alignment of the probe element and the device interface element further includes contacting the probe element to the device interface element to make an electrical connection.
摘要翻译：激光处理系统实现将探针元件（例如，探针）与装置接口元件（例如，电路基板的接触焊盘）对准的方法。首先，激光处理系统在一个或多个预定位置处产生光学参考光束，以校准参考场。激光处理系统然后在参考场中检测探针元件的位置。激光处理系统还确定设备接口元件在参考场中的相对位置。基于探针元件和器件接口元件的位置，激光加工系统然后启动探针元件和器件接口元件的对准。在一个应用中，探针元件和器件接口元件的对准还包括将探针元件接触到器件接口元件以进行电连接。

2. 发明申请

WO2007090051A2 METHOD AND SYSTEM FOR HIGH-SPEED PRECISE LASER TRIMMING AND SCAN LENS FOR USE THEREIN 审中-公开
标题翻译：用于高速精密激光切割和扫描镜头的方法和系统
公开(公告)号：WO2007090051A2
公开(公告)日：2007-08-09
申请号：PCT/US2007061121
申请日：2007-01-26
申请人： GSI GROUP CORP , GU BO , EHRMANN JONATHAN S , LENTO JOSEPH V , COUCH BRUCE L , CHU YUN FEE , JOHNSON SHEPARD D
发明人： GU BO , EHRMANN JONATHAN S , LENTO JOSEPH V , COUCH BRUCE L , CHU YUN FEE , JOHNSON SHEPARD D
IPC分类号： H01L21/00 , G06K7/10
CPC分类号： H01C17/242 , B23K26/0622 , B23K26/351 , B23K26/361
摘要： A method, system and scan lens for use therein are provided for high-speed, laser-based, precise laser trimming at least one electrical element along a trim path. The method includes generating a pulsed laser output with a laser, the output having one or more laser pulses at a repetition rate. A fast rise/fall time, pulse-shaped q-switched laser or an ultra-fast laser may be used. Beam shaping optics may be used to generate a flat-top beam profile. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance, high absorption and reduced or eliminated heat-affected zone (HAZ) along the trim path, but not so short so as to cause microcracking. In this way, resistance drift after the trimming process is reduced.
摘要翻译：提供了一种用于其中的方法，系统和扫描透镜，用于沿着修剪路径的高速，基于激光的精确激光修整至少一个电气元件。该方法包括用激光产生脉冲激光输出，该输出具有一个或多个重复频率的激光脉冲。可以使用快速上升/下降时间，脉冲形q切换激光器或超快速激光器。光束成形光学元件可用于产生平顶光束轮廓。每个激光脉冲具有脉冲能量，在激光波长范围内的激光波长和脉冲持续时间。波长足够短以产生小斑点尺寸，紧公差，高吸收以及沿着修剪路径减少或消除的热影响区（HAZ）的期望的短波长益处，但不太短以致于引起微裂纹。以这种方式，减少了修整过程之后的电阻漂移。

3. 发明申请

WO2006042231A2 METHOD AND SYSTEM FOR HIGH-SPEED PRECISE LASER TRIMMING, SCAN LENS SYSTEM FOR USE THEREIN AND ELECTRICAL DEVICE PRODUCED THEREBY 审中-公开
标题翻译：高速精密激光切割方法与系统及其使用的扫描镜头系统及其制造的电气设备
公开(公告)号：WO2006042231A2
公开(公告)日：2006-04-20
申请号：PCT/US2005036421
申请日：2005-10-07
申请人： GSI LUMONICS CORP , GU BO , LENTO JOSEPH V , EHRMANN JONATHAN S , COUCH BRUCE L , CHU YUN FEE , JOHNSON SHEPARD D
发明人： GU BO , LENTO JOSEPH V , EHRMANN JONATHAN S , COUCH BRUCE L , CHU YUN FEE , JOHNSON SHEPARD D
IPC分类号： G06K7/10
CPC分类号： H01C17/242 , B23K26/0622 , B23K26/082
摘要： A method, system and scan lens system are provided for high-speed, laser-based, precise laser trimming at least one electrical element. The method includes generating a pulsed laser output having one or more laser pulses at a repetition rate. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The method further includes selectively irradiating the at least one electrical element with the one or more laser pulses focused into at least one spot having a non-uniform intensity profile along a direction and a spot diameter as small as about 6 microns to about 15 microns so as to cause the one or more laser pulses to selectively remove material from the at least one element and laser trim the at least one element while avoiding substantial microcracking within the at least one element. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance and high absorption, but not so short so as to cause microcracking.
摘要翻译：提供了一种方法，系统和扫描透镜系统，用于高速，基于激光的，精确的激光修剪至少一个电气元件。该方法包括以重复率产生具有一个或多个激光脉冲的脉冲激光输出。每个激光脉冲具有脉冲能量，在激光波长范围内的激光波长和脉冲持续时间。所述方法还包括选择性地照射所述至少一个电气元件，所述一个或多个激光脉冲聚焦在沿着方向具有不均匀强度分布的至少一个点和小至约6微米至约15微米的光点直径上以使所述一个或多个激光脉冲从所述至少一个元件选择性地去除材料，并激光修整所述至少一个元件，同时避免所述至少一个元件内的实质性微裂纹。波长足够短以产生小斑点尺寸，紧度公差和高吸收性能所需的短波长益处，但不会如此短，从而导致微裂纹。

4. 发明申请

WO2007044798A2 OPTICAL METROLOGICAL SCALE AND LASER-BASED MANUFACTURING METHOD THEREFOR 审中-公开
标题翻译：光学尺度和激光制造方法
公开(公告)号：WO2007044798A2
公开(公告)日：2007-04-19
申请号：PCT/US2006039704
申请日：2006-10-11
申请人： GSI GROUP CORP , PELSUE KURT , DODSON II STUART A , HUNTER BRADLEY L , SMART DONALD V , MABBOUX PIERRE-YVES , EHRMANN JONATHAN S
发明人： PELSUE KURT , DODSON II STUART A , HUNTER BRADLEY L , SMART DONALD V , MABBOUX PIERRE-YVES , EHRMANN JONATHAN S
IPC分类号： C08K3/32
CPC分类号： B41M5/24 , B23K26/364 , G01D5/34707
摘要： A reflective metrological scale has a scale pattern of elongated side-by-side marks surrounded by reflective surface areas of a substrate, which may be a nickel-based metal alloy such as Invar® or Inconel® and may be a thin and elongated flexible tape. Each mark has a furrowed cross section and may have a depth in the range of 0.5 to 2 microns. The central region of each mark may be rippled or ridged and may be darkened to provide an enhanced optical reflection ratio with respect to surrounding reflective surface areas. A manufacturing method includes the repeated steps of (1) creating a scale mark by irradiating a surface of the substrate at a mark location with a series of overlapped pulses from a laser, each pulse having an energy density of less than about 1 joule per cm 2 , and (2) changing the relative position of the laser and the substrate by a displacement amount defining a next mark location on the substrate at which a next mark of the scale is to be created.
摘要翻译：反射计量标尺具有由基底的反射表面区域包围的细长的并排标记的刻度图形，其可以是诸如Invar或Inconel的镍基金属合金，并且可以是薄且细长的柔性带。每个标记具有沟槽的横截面并且可以具有在0.5至2微米范围内的深度。每个标记的中心区域可以是波纹或脊状的，并且可以变暗，以提供相对于周围的反射表面区域的增强的光反射率。一种制造方法包括以下重复步骤：（1）通过在来自激光的一系列重叠脉冲的标记位置处照射基板的表面来产生刻度标记，每个脉冲的能量密度小于约1焦耳/厘米＆lt; SUP＆gt; 2＆gt;和（2）通过在衬底上限定下一标记位置的位移量来改变激光和衬底的相对位置，在该衬底上将要生成刻度的下一个标记。

5. 发明申请

WO2007092803A3 LASER-BASED REMOVAL OF TARGET LINK STRUCTURES 审中-公开
标题翻译：目标链路结构的基于激光的移除
公开(公告)号：WO2007092803A3
公开(公告)日：2008-09-18
申请号：PCT/US2007061592
申请日：2007-02-05
申请人： GSI GROUP CORP , GU BO , SMART DONALD V , CORDINGLEY JAMES J , LEE JOOHAN , SVETKOFF DONALD J , JOHNSON SHEPARD D , EHRMANN JONATHAN S
发明人： GU BO , SMART DONALD V , CORDINGLEY JAMES J , LEE JOOHAN , SVETKOFF DONALD J , JOHNSON SHEPARD D , EHRMANN JONATHAN S
IPC分类号： B23K26/40
CPC分类号： B23K26/0736 , B23K26/0624 , B23K26/40 , B23K2203/50
摘要： Laser-based methods and systems for removing one or more target link structures 107 of a circuit fabricated on a substrate 110 includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output ontothe target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.
摘要翻译：提供了用于去除在基板110上制造的电路的一个或多个目标链路结构107的基于激光的方法和系统，包括产生比基板的吸收边缘小的预定波长的脉冲激光输出。激光输出包括脉冲持续时间在约10皮秒至小于1纳秒范围内的至少一个脉冲，脉冲持续时间在热激光器处理范围内。该方法还包括将激光输出传递和聚焦到目标链路结构上。聚焦的激光输出在目标链路结构内的位置处具有足够的功率密度，以减少目标链路结构的反射率，并将聚焦的激光输出有效地耦合到目标链路结构中以去除目标链路结构而不损坏基板。

6. 发明申请

WO2009039184A3 LINK PROCESSING WITH HIGH SPEED BEAM DEFLECTION 审中-公开
标题翻译：具有高速光束偏转的链接处理
公开(公告)号：WO2009039184A3
公开(公告)日：2010-05-27
申请号：PCT/US2008076694
申请日：2008-09-17
申请人： GSI GROUP CORP , EHRMANN JONATHAN S , GRIFFITHS JOSEPH J , CORDINGLEY JAMES J , SVETKOFF DONALD J , JOHNSON SHEPARD D , PLOTKIN MICHAEL
发明人： EHRMANN JONATHAN S , GRIFFITHS JOSEPH J , CORDINGLEY JAMES J , SVETKOFF DONALD J , JOHNSON SHEPARD D , PLOTKIN MICHAEL
IPC分类号： B23K26/06 , B23K26/08
CPC分类号： B23K26/0869 , B23K26/0344 , B23K26/06 , B23K26/0624 , B23K26/064 , B23K26/0648 , B23K26/0665 , B23K26/082 , B23K26/0853 , B23K26/361 , B23K26/40 , B23K2201/40 , B23K2203/16 , B23K2203/50 , H01L21/76894 , H01L23/5258 , H01L27/10844 , H01L2924/0002 , Y10T29/49156 , H01L2924/00
摘要： The present invention relates to the field of laser processing methods and systems, and specifically, to laser processing methods and systems for laser processing multi-material devices. Systems and methods may utilize high speed deflectors to improve processing energy window and/or improve processing speed. In some embodiments, a deflector is used for non-orthogonal scanning of beam spots. In some embodiment, a deflector is used to implement non-synchronous processing of target structures.
摘要翻译：本发明涉及激光加工方法和系统的领域，具体涉及用于激光加工多材料装置的激光加工方法和系统。系统和方法可以利用高速偏转器来改善处理能量窗口和/或提高处理速度。在一些实施例中，偏转器用于束斑的非正交扫描。在一些实施例中，偏转器用于实现目标结构的非同步处理。

7. 发明申请

WO2007092716A3 LASER-BASED METHOD AND SYSTEM FOR PROCESSING A MULTI-MATERIAL DEVICE HAVING CONDUCTIVE LINKS STRUCTURES 审中-公开
标题翻译：用于处理具有导电链路结构的多材料装置的基于激光的方法和系统
公开(公告)号：WO2007092716A3
公开(公告)日：2009-09-11
申请号：PCT/US2007061365
申请日：2007-01-31
申请人： GSI GROUP CORP , LEE JOOHAN , CORDINGLEY JAMES J , GU BO , EHRMANN JONATHAN S , GRIFFITHS JOSEPH J
发明人： LEE JOOHAN , CORDINGLEY JAMES J , GU BO , EHRMANN JONATHAN S , GRIFFITHS JOSEPH J
IPC分类号： H01L21/00
CPC分类号： H01L23/5258 , B23K26/40 , B23K2203/50 , H01L27/1052 , H01L2924/0002 , H01L2924/00
摘要： A laser-based method and system for selectively processing a multi-material device having a target link structure formed on a substrate while avoiding undesirable change to an adjacent link structure also formed on the substrate are disclosed. The method includes applying at least one focused laser pulse having a wavelength into a spot. The at least one focused laser pulse has an energy density over the spot sufficient to completely process the target link structure while avoiding undesirable change to the adjacent link structure, the substrate and any layers between the substrate and the link structures. The target link structure and the adjacent structure may have a pitch of about 2.0 microns or less.
摘要翻译：公开了一种基于激光的方法和系统，用于选择性地处理具有形成在基板上的目标连杆结构的多材料装置，同时避免对基板上也形成的相邻连接结构的不期望的改变。该方法包括将至少一个具有波长的聚焦激光脉冲施加到光斑中。所述至少一个聚焦激光脉冲具有足以完全处理目标连杆结构的点的能量密度，同时避免对相邻连接结构，基板和基板和连接结构之间的任何层的不期望的改变。目标连杆结构和相邻结构可以具有约2.0微米或更小的间距。

8. 发明申请

WO2011082065A3 LINK PROCESSING WITH HIGH SPEED BEAM DEFLECTION 审中-公开
标题翻译：具有高速光束偏转的链接处理
公开(公告)号：WO2011082065A3
公开(公告)日：2011-11-24
申请号：PCT/US2010061797
申请日：2010-12-22
申请人： GSI GROUP CORP , ROMASHKO DMITRY N , PLOTKIN MICHAEL , EHRMANN JONATHAN S , CORDINGLEY JAMES J , JOHNSON SHEPARD D
发明人： ROMASHKO DMITRY N , PLOTKIN MICHAEL , EHRMANN JONATHAN S , CORDINGLEY JAMES J , JOHNSON SHEPARD D
IPC分类号： B23K26/08 , H01L21/00 , H01S3/10
CPC分类号： H01L23/5258 , B23K26/042 , B23K26/0732 , B23K26/082 , H01L21/76892 , H01L2924/0002 , H01L2924/00
摘要： Link processing systems and methods use controlled two dimensional deflection of a beam along an optical axis trajectory to process links positioned along and transverse to the trajectory during a pass of the optical axis along the trajectory. Predictive position calculations allow link blowing accuracy during constant velocity and accelerating trajectories.
摘要翻译：链路处理系统和方法使用沿着光轴轨迹的光束的受控二维偏转，以在沿着轨迹的光轴的通过期间处理沿着和横向于轨迹定位的链接。预测位置计算允许在恒定速度和加速轨迹期间的链接吹风精度。

9. 发明申请

WO2012116226A2 PREDICTIVE LINK PROCESSING 审中-公开
标题翻译：预测链接处理
公开(公告)号：WO2012116226A2
公开(公告)日：2012-08-30
申请号：PCT/US2012026386
申请日：2012-02-23
申请人： GSI GROUP CORP , MALTSEV DIMITRY , ROMASHKO DMITRY N , PLOTKIN MICHAEL , EHRMANN JONATHAN S , CORDINGLEY JAMES J
发明人： MALTSEV DIMITRY , ROMASHKO DMITRY N , PLOTKIN MICHAEL , EHRMANN JONATHAN S , CORDINGLEY JAMES J
CPC分类号： B23K26/0732 , B23K26/042 , B23K26/0619 , B23K26/0622 , B23K26/082 , H01L21/76892 , H01L23/5258 , H01L2924/0002 , H01L2924/00
摘要： A method of processing material of device elements by laser interaction is disclosed. According to one aspect, the method includes generating a pulsed laser processing output along a laser beam axis, the output including a plurality of laser pulses triggered sequentially at times determined by a pulse repetition rate. A trajectory relative to locations of device elements to be processed is generated. A position of one or more designated device elements relative to an intercept point position on the trajectory at one or more laser pulse times is determined, and a laser beam is deflected based on the predicted position within a predetermined deflection range. According to some aspects, the predetermined deflection range may correspond to a compass rose or cruciform field shape. As a result, a deflection accuracy for laser processing may be improved.
摘要翻译：公开了一种通过激光相互作用处理器件元件材料的方法。根据一个方面，所述方法包括沿着激光束轴产生脉冲激光处理输出，所述输出包括在由脉冲重复率确定的时间顺序触发的多个激光脉冲。产生相对于要处理的设备元件的位置的轨迹。确定一个或多个指定装置元件相对于在一个或多个激光脉冲时间的轨迹上的截点位置的位置，并且激光束基于在预定偏转范围内的预测位置偏转。根据一些方面，预定的偏转范围可以对应于罗盘玫瑰或十字形场的形状。结果，可以提高激光加工的偏转精度。

10. 发明申请

WO2011156283A3 LASER PROCESSING WITH ORIENTED SUB-ARRAYS 审中-公开
标题翻译：带有面向对象的子阵列的激光加工
公开(公告)号：WO2011156283A3
公开(公告)日：2012-04-05
申请号：PCT/US2011039304
申请日：2011-06-06
申请人： GSI GROUP CORP , LAUER WILLIAM , EHRMANN JONATHAN S , GRIFFITHS JOSEPH J
发明人： LAUER WILLIAM , EHRMANN JONATHAN S , GRIFFITHS JOSEPH J
IPC分类号： B23K26/067 , B23K26/073 , B23K26/38
CPC分类号： B23K26/0676 , B23K26/0006 , B23K26/06 , B23K26/067 , B23K26/36 , B23K2203/56 , H01L21/02686 , H01L21/02691 , H01L23/525 , H01L2924/0002 , H01L2924/00
摘要： In a system for severing conductive links by laser irradiation to repair electronic devices, multiple laser beams are deflected at high-speed to target selected links for processing by positioning laser spots in a two dimensional pattern during relative motion of a substrate and a beam delivery system. As link targeting flexibility is increased, selection may be required from a large number of addressable link pairs. Various embodiments advantageously use beam deflection and beam splitting to improve memory repair processing rates.
摘要翻译：在用于通过激光照射来切断导电连接以修复电子设备的系统中，多个激光束在基板和光束传送系统的相对运动期间以高速偏转到目标所选择的链接以进行处理，其中定位激光斑点为二维图案。随着链路定向灵活性的增加，可能需要从大量可寻址链路对中进行选择。各种实施例有利地使用光束偏转和光束分割来改善存储器修复处理速率。

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