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1. 发明申请

WO2004093238A1 INTEGRATED PASSIVE DEVICES FABRICATED UTILIZING MULTI-LAYER, ORGANIC LAMINATES 审中-公开
标题翻译：综合利用多层有机层压板的被动设备
公开(公告)号：WO2004093238A1
公开(公告)日：2004-10-28
申请号：PCT/US2004/009486
申请日：2004-03-29
申请人： GEORGIA TECH RESEARCH CORPORATION , WHITE, George, E. , SWANIMATHAN, Madhavan , DALMIA, Sidharth , SUNDARAM, Venkatesh
发明人： WHITE, George, E. , SWANIMATHAN, Madhavan , DALMIA, Sidharth , SUNDARAM, Venkatesh
IPC分类号： H01P1/203
CPC分类号： H01P1/20381 , H01F17/0033 , H01F41/041 , H01L21/4857 , H01L25/0652 , H01L27/08 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H03H7/38 , H01L2924/00
摘要： The present invention includes an organic device that can be integrated in a multilayer board made of organic material. The passive devices can be integrally fabricated on a circuit board in either surface mount device (SMD) or ball grid array (BGA) form. Alternatively, the passive device can be constructed in a stand alone SMD or BGA/chip scale package (CSP) form to make it mountable on a multilayer board, ceramic carrier or silicon platform in the form of an integrated passive device. The passive device includes side shielding on two sides in the SMD form and four sides in the BGA/CSP form. The side shielding can be external or in-built.
摘要翻译：本发明包括可以集成在由有机材料制成的多层板中的有机器件。无源器件可以在表面贴装器件（SMD）或球栅阵列（BGA）形式的电路板上整体制造。或者，无源器件可以以独立的SMD或BGA /芯片级封装（CSP）形式构造，使其可以以集成的无源器件的形式安装在多层板，陶瓷载体或硅平台上。无源器件包括SMD形式两侧的侧屏蔽和BGA / CSP形式的四面。侧面屏蔽可以是外部的或内置的。

2. 发明申请

WO2005036567A3 STAND-ALONE ORGANIC-BASED PASSIVE DEVICES 审中-公开
公开(公告)号：WO2005036567A3
公开(公告)日：2005-04-21
申请号：PCT/US2004/009468
申请日：2004-03-29
申请人： GEORGIA TECH RESEARCH CORPORATION , WHITE, George, E. , SWANIMATHAN, Madhavan , DALMIA, Sidharth , SUNDARAM, Venkatesh
发明人： WHITE, George, E. , SWANIMATHAN, Madhavan , DALMIA, Sidharth , SUNDARAM, Venkatesh
IPC分类号： H01F17/00
摘要： The present invention provides for low cost discrete inductor devices in an all organic platform. The inductor devices can utilize virtually any organic material that provides the desired properties, such as liquid crystalline polymer (LCP) or polyphenyl ether (PPE), in a multilayer structure, wherein the organic materials have low moisture uptake and good temperature stability. Each layer may be metalized and selectively interconnected by vias formed in respective layers so as to form winding or coiled inductors. The inductor devices may advantageously include external shielding formed by metalizing the side walls and top surface of the inductor devices on in-built shielding achieved by the utilization of the hybrid co-planar waveguide topologies. The inductor devices can be configured for either ball grid array (BGA)/chip scale package (CSP) or surface mount device (SMD) mounting to circuit boards.

3. 发明申请

WO2004088731A2 METHODS FOR FABRICATING THREE-DIMENSIONAL ALL ORGANIC INTERCONNECT STRUCTURES 审中-公开
标题翻译：制造三维有机互连结构的方法
公开(公告)号：WO2004088731A2
公开(公告)日：2004-10-14
申请号：PCT/US2004/009458
申请日：2004-03-29
申请人： GEORGIA TECH RESEARCH CORPORATION , WHITE, George, E. , SWANIMATHAN, Madhavan , DALMIA, Sidharth , SUNDARAM, Venkatesh
发明人： WHITE, George, E. , SWANIMATHAN, Madhavan , DALMIA, Sidharth , SUNDARAM, Venkatesh
IPC分类号： H01L21/00
CPC分类号： B32B37/00 , H01F17/0033 , H01F41/041 , H01L21/4857 , H01L25/0652 , H01L27/08 , H01L2224/16 , H01L2224/16235 , H01L2224/48235 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/19041 , H01L2924/19105 , H01L2924/3011 , H01L2924/3025 , H05K1/00 , H05K1/162 , H05K1/167 , H05K3/4617 , H05K3/4632 , H05K3/4688 , H05K2201/0129 , H05K2201/0141 , H05K2201/0209 , Y10T29/49126 , Y10T29/49149 , Y10T29/49158 , H01L2224/0401
摘要： The present invention comprises methods for making three-dimensional (3-D) liquid crystalline polymer (LCP) interconnect structures using a high temperature singe sided liquid crystalline polymer, and low temperature single sided liquid crystalline polymer, whereas both the high temperature LCP and the low temperature LCP are drilled using a laser or mechanical drill or mechanically punch to form a z-axis connection. The single sided Conductive layer is used as a bus layer to form z axis conductive stud within the high temperature and low temperature LCP, followed by deposition of a metallic capping layer of the stud that serves as the bonding metal between the conductive interconnects to form the z-axis electrical connection. High temperature and low temperature LCP circuit layers are etched or built up to form circuit patterns and subsequently bonded together to form final 3-D multilayer circuit pattern whereas the low temperature LCP melts to form both dielectric to dielectric bond to high temperature LCP circuit layer, and dielectric to conductive bond, whereas, metal to metal bonding occurs with high temperature metal capping layer bonding to conductive metal layer. The resultant structure is then packaged using two metallized organic cores that are laminated onto either side of the device using a low temperature adhesive with similar electrical properties and subsequently metallized to form the input output terminals and EM shielding.
摘要翻译：本发明包括使用高温单面液晶聚合物和低温单面液晶聚合物制备三维（3-D）液晶聚合物（LCP）互连结构的方法，而高温LCP和使用激光或机械钻或机械冲孔钻低温LCP以形成z轴连接。单面导电层用作总线层，以在高温和低温LCP内形成z轴导电螺柱，随后在导电互连之间沉积用作接合金属的螺柱的金属覆盖层，以形成 z轴电气连接。高温低温LCP电路层被蚀刻或构建以形成电路图案，并随后结合在一起以形成最终的3-D多层电路图案，而低温LCP熔化以形成与高温LCP电路层的电介质至电介质结合，并且电介质到导电键合，而金属与金属之间的键合是与导电金属层接合的高温金属覆盖层发生的。然后使用两个金属化有机芯包裹所得到的结构，使用具有类似电性能的低温粘合剂层压到装置的任一侧上，随后金属化以形成输入输出端子和EM屏蔽。

4. 发明申请

WO2005084090A1 LIQUID CRYSTALLINE POLYMER- AND MULTILAYER POLYMER-BASED PASSIVE SIGNAL PROCESSING COMPONENTS FOR RF/WIRELESS MULTI-BAND APPLICATIONS 审中-公开
标题翻译：液晶聚合物和多层聚合物基于无源多通道应用的无源信号处理组件
公开(公告)号：WO2005084090A1
公开(公告)日：2005-09-09
申请号：PCT/US2005/006006
申请日：2005-02-23
申请人： GEORGIA TECH RESEARCH CORPORATION , WHITE, George, E. , SWAMINATHAN, Madhavan , SUNDARAM, Venkatesh , DALMIA, Sidharth
发明人： WHITE, George, E. , SWAMINATHAN, Madhavan , SUNDARAM, Venkatesh , DALMIA, Sidharth
IPC分类号： H05K1/16
CPC分类号： H05K1/16 , H01L23/552 , H01L23/66 , H01L2924/0002 , H01L2924/09701 , H01L2924/15311 , H01L2924/3011 , H01P1/203 , H01P1/20381 , H01P1/2135 , H01P5/10 , H03H7/0115 , H03H7/075 , H03H7/09 , H03H7/1708 , H03H7/1758 , H03H7/1766 , H03H7/1775 , H03H7/38 , H03H7/42 , H03H7/463 , H03H2001/0085 , H05K1/024 , H05K1/162 , H05K1/165 , H05K3/4602 , H05K3/4623 , H05K3/4626 , H05K3/4632 , H05K3/4644 , H05K3/4673 , H05K3/4688 , H05K2201/0141 , H05K2201/09536 , H01L2924/00
摘要： The present invention provides all organic fully-packaged miniature bandpass filters, baluns, diplexers, multiplexers, couplers and a combination of the above manufactured using liquid crystalline polymer (LCP) and other multilayer polymer based substrates. These devices are manufactured using one or more LCP layers having integrated passive components formed thereon to provide the density and performance necessary for multi-band wireless devices. In the designs involving multiple LCP layers, the LCP layers are separated by prepeg layers. In accordance with an aspect of the present invention, coplanar waveguide, hybrid stripline/coplanar waveguide and/or microstrip topologies are utilized to form the integrated passive components, and the devices can be mass produced on large area panels at least 18 inches by 12 inches with line widths smaller than 10um.
摘要翻译：本发明提供了使用液晶聚合物（LCP）和其它多层聚合物基底板制造的所有有机全封装微型带通滤光器，平衡 - 不平衡转换器，双工器，多路复用器，耦合器和上述组合。这些设备使用一个或多个LCP层制造，其中形成有集成的无源元件，以提供多频带无线设备所需的密度和性能。在涉及多个LCP层的设计中，LCP层被预制层隔开。根据本发明的一个方面，使用共面波导，混合带状线/共面波导和/或微带线拓扑来形成集成的无源部件，并且可以在大面积面板上批量生产至少18英寸×12英寸线宽小于10um。

5. 发明申请

WO2011149520A1 PLANAR INDUCTOR DEVICES 审中-公开
标题翻译：平面电感器器件
公开(公告)号：WO2011149520A1
公开(公告)日：2011-12-01
申请号：PCT/US2011/000920
申请日：2011-05-24
申请人： TYCO ELECTRONICS CORPORATION , DALMIA, Sidharth , HARRISON, William, Lee
发明人： DALMIA, Sidharth , HARRISON, William, Lee
IPC分类号： H01F17/00 , H01F27/28
CPC分类号： H01F5/003 , H01F17/0006 , H01F17/062 , H01F27/28 , H01F27/2804
摘要： A planar inductor device (300) comprises a substrate (302) that vertically extends from an upper surface (404) of the substrate to an opposite lower surface (402) of the substrate, and laterally extends from a first edge (322) to a second edge (324) of the substrate. A ferrite body (310) is disposed within the substrate. Upper conductors (314) are disposed above the ferrite body, and lower conductors (318) are disposed below the ferrite body. Conductive vias (316) extend through the substrate and are conductively coupled with the upper conductors and with the lower conductors. The vias, the upper conductors, and the lower conductors form one or more conductive coils (320) that encircle the ferrite body in the substrate. At least one of the first edge or the second edge passes through one or more of the vias such that the vias are exposed at the at least one of the first edge or the second edge.
摘要翻译：平面电感器装置（300）包括从衬底的上表面（404）垂直延伸到衬底的相对的下表面（402）的衬底（302），并且从第一边缘（322）横向延伸到第二边缘（324）。铁氧体本体（310）设置在衬底内。上导体（314）设置在铁氧体本体的上方，下导体（318）设置在铁氧体下方。导电孔（316）延伸穿过衬底并与上导体和下导体导电耦合。通孔，上导体和下导体形成一个或多个围绕衬底中的铁氧体的导电线圈（320）。第一边缘或第二边缘中的至少一个穿过一个或多个通孔，使得通孔在第一边缘或第二边缘中的至少一个处露出。

7. 发明申请

WO2011149523A1 PLANAR INDUCTOR DEVICES 审中-公开
标题翻译：平面电感器器件
公开(公告)号：WO2011149523A1
公开(公告)日：2011-12-01
申请号：PCT/US2011/000926
申请日：2011-05-24
申请人： TYCO ELECTRONICS CORPORATION , DALMIA, Sidharth , NGUYEN, Khanh , DAS, Jaydip , MCGRATH, Mark , HARRISON, William, Lee
发明人： DALMIA, Sidharth , NGUYEN, Khanh , DAS, Jaydip , MCGRATH, Mark , HARRISON, William, Lee
IPC分类号： H01F17/00 , H01F17/06 , H01F27/28
CPC分类号： H01F27/2804 , H01F17/0006 , H01F17/045 , H01F17/062 , H01F2027/2814
摘要： A multilayer inductor device (1500) comprises a planar substrate (1502) and a ferrite body (1506) disposed in the substrate (1502). The substrate includes a plurality of dielectric layers (1700). An outer conductive coil (1612) is helically wrapped around the ferrite body. The outer conductive coil includes a first plurality of upper conductors (1510) disposed on a first upper dielectric layer (1700 A) of the substrate, a first plurality of lower conductors (1602) disposed on a first lower dielectric layer (1700D) of the substrate, and a first plurality of conductive vias (1512, 1514) vertically extending through the substrate and conductively coupled with the first plurality of upper conductors and the first plurality of lower conductors. An inner conductive coil (1610) is helically wrapped around the ferrite body. The inner conductive coil includes a second plurality of upper conductors (1600) disposed on a second upper dielectric layer (1700B) of the substrate, a second plurality of lower conductors (1604) disposed on a second lower dielectric layer (1700C) of the substrate, and a second plurality of conductive vias (1606, 1608) vertically extending through the substrate and conductively coupled with the second plurality of upper conductors and the second plurality of lower conductors. The inner conductive coil is disposed between the outer conductive coil and the ferrite body.
摘要翻译：多层电感器件（1500）包括平面衬底（1502）和设置在衬底（1502）中的铁氧体本体（1506）。衬底包括多个电介质层（1700）。外部导电线圈（1612）螺旋缠绕在铁氧体上。外导电线圈包括设置在基板的第一上电介质层（1700A）上的第一多个上导体（1510），设置在基板的第一下介电层（1700D）上的第一多个下导体（1602）衬底和垂直延伸穿过衬底并与第一多个上导体和第一多个下导体导电耦合的第一多个导电通孔（1512,1514）。内部导电线圈（1610）螺旋缠绕在铁氧体上。所述内导电线圈包括设置在所述基板的第二上电介质层（1700B）上的第二多个上导体（1600），设置在所述基板的第二下介电层（170C）上的第二多个下导体（1604）以及垂直延伸穿过衬底并与第二多个上导体和第二多个下导体导电耦合的第二多个导电通孔（1606,1608）。内部导电线圈设置在外部导电线圈和铁氧体之间。

8. 发明申请

WO2011149521A1 PLANAR INDUCTOR DEVICES 审中-公开
标题翻译：平面电感器器件
公开(公告)号：WO2011149521A1
公开(公告)日：2011-12-01
申请号：PCT/US2011/000922
申请日：2011-05-24
申请人： TYCO ELECTRONICS CORPORATION , DALMIA, Sidharth , VANNALA, Shanit , SUN, Zhuowen , KUBES, Steven, R.
发明人： DALMIA, Sidharth , VANNALA, Shanit , SUN, Zhuowen , KUBES, Steven, R.
IPC分类号： H01F17/06 , H01F30/16
CPC分类号： H01F5/003 , H01F17/0006 , H01F17/062 , H01F27/28 , H01F27/2804
摘要： A planar inductor device (1000) comprises a ferrite body (1016) and a conductive pathway (1002). The ferrite body extends around an opening (1014) in the ferrite body. The conductive pathway includes an input section (1004), a current-splitting section (1016), a coil section (1008), a current-combining section (1010), and an output section (1012) connected with each other, the input section extending toward the opening in the ferrite body. The current- splitting section includes a plurality of conductive coils (1018) joined with the conductive pathway and electrically disposed parallel to each other. The coil section includes the conductive coils helically wrapped around the ferrite body. The current-combining section includes the conductive coils joined with each other, and the output section includes the joined conductive coils extending out of the ferrite body.
摘要翻译：平面电感器件（1000）包括铁氧体本体（1016）和导电通路（1002）。铁氧体主体围绕铁氧体本体的开口（1014）延伸。导电路径包括彼此连接的输入部分（1004），分流部分（1016），线圈部分（1008），电流合成部分（1010）和输出部分（1012），输入截面向铁素体的开口部延伸。电流分流部分包括与导电通路连接并彼此平行地电气设置的多个导电线圈（1018）。线圈部分包括螺旋缠绕在铁氧体上的导电线圈。电流组合部分包括彼此接合的导电线圈，并且输出部分包括从铁氧体本体延伸出来的接合的导电线圈。

9. 发明申请

WO2010065113A1 AN INTEGRATED PLANAR VARIABLE TRANSFORMER WITH EMBEDDED MAGNETIC CORE 审中-公开
标题翻译：具有嵌入式磁芯的集成式平面变压器
公开(公告)号：WO2010065113A1
公开(公告)日：2010-06-10
申请号：PCT/US2009/006346
申请日：2009-12-01
申请人： PLANARMAG,INC. , HARRISON, William, Lee , PHAM, Anh-vu , QUILICI, James, E. , DALMIA, Sidharth , KUBES, Steven, R.
发明人： HARRISON, William, Lee , PHAM, Anh-vu , QUILICI, James, E. , DALMIA, Sidharth , KUBES, Steven, R.
IPC分类号： H01F27/28
CPC分类号： H01F21/12 , H01F17/0033 , H01F27/22 , H01F2019/085 , H01F2027/328 , H01R13/6675 , H01R13/719
摘要： The current invention provides an integrated planar transformer and electronic component that includes at least one wideband planar transformer disposed in a planar substrate, where each wideband planar transformer includes a planar substrate in a fully-cured and rigid state, a ferrite material embedded in the planar substrate, where the ferrite material is enveloped in an elastic and non-conductive material, inter-wound conductors disposed around the embedded ferrite material, where top and bottom conductors are bonded by an insulating adhesive. The top and bottom conductors are connected in an inter-connected pattern by conductive vias disposed on each side of the ferrite material and span through the layers to the conductors. The planar transformer further includes at least one center tap connected to at least one inter-wound conductor. The integrated planar transformer and electronic component further includes at least one electronic component connected to at least one terminal of the wide-band planar transformer.
摘要翻译：本发明提供了一种集成平面变压器和电子部件，其包括设置在平面基板中的至少一个宽带平面变压器，其中每个宽带平面变压器包括处于完全固化和刚性状态的平面基板，嵌入平面衬底，其中铁氧体材料被包裹在弹性和非导电材料中，围绕在埋入的铁氧体材料周围的导体，其中顶部和底部导体通过绝缘粘合剂结合。顶部和底部导体通过设置在铁氧体材料的每一侧上的导电通孔以相互连接的形式连接，并跨越导体层。平面变压器还包括连接到至少一个互缠绕导体的至少一个中心抽头。集成平面变压器和电子部件还包括连接到宽带平面变压器的至少一个端子的至少一个电子部件。

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