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    • 2. 发明授权
    • Circuit writer
    • 电路作家
    • US5099090A
    • 1992-03-24
    • US460980
    • 1990-01-11
    • G. Graham AllanGary A. DeBardiAmar N. NeogiKenneth N. BatesRobert B. ErleyThomas L. JacobsRamzi F. HamadeStephen J. HorneManu C. PatelJohn E. RoseMark S. SchlosserDavid P. Warden
    • G. Graham AllanGary A. DeBardiAmar N. NeogiKenneth N. BatesRobert B. ErleyThomas L. JacobsRamzi F. HamadeStephen J. HorneManu C. PatelJohn E. RoseMark S. SchlosserDavid P. Warden
    • H01B1/22H05K1/09H05K3/00H05K3/12H05K3/40H05K3/46
    • H05K1/095H01B1/22H05K3/0091H05K3/1241H05K3/4069H05K2201/09581H05K2201/09827H05K2201/0989H05K2203/0126H05K2203/0763H05K3/4644Y10T29/49155
    • An apparatus and method are disclosed for preparing electrically conductive traces on a circuit board using an additive technology. The traces are directly written in a serial process with each trace being able to be individually insulated. The apparatus includes an extrusion element for extruding a first material and a stage. The stage is for holding the extrusion element and the circuit board in relative proximity and for producing relative motion between the extrusion element and the circuit board in order to extrude the first material onto the surface of the circuit board along preselected paths to produce the electrically conductive traces. According to the method of invention, a first polymerizable material is extruded onto a circuit substrate support along preselected paths to form traces, and the first polymerizable material is polymerized, the first polymerizable material being conductive after polymerization. A circuit board for holding electrical components is disclosed which includes a circuit substrate support and a plurality of electrically conductive traces. The traces are adhered to the circuit substrate support between locations for the electrical components, the traces being formed of a polymer thick film by extrusion from an orifice onto the support along paths defining the location of the traces. Several embodiments of extrusion systems are described as are systems for milling and drilling boards to provide new manufactures of circuit boards.
    • PCT No.PCT / US89 / 02026 Sec。 371 1990年1月11日第 102(e)1990年1月11日日期PCT提交1989年5月11日PCT公布。 出版物WO89 / 11209 日本公开了一种用于使用添加剂技术在电路板上制备导电迹线的装置和方法。 轨迹直接写在串行过程中,每个迹线都可以单独隔离。 该装置包括用于挤出第一材料和台架的挤出元件。 该阶段用于将挤出元件和电路板保持在相对接近处并且用于在挤出元件和电路板之间产生相对运动,以便沿预选路径将第一材料挤压到电路板的表面上以产生导电 痕迹 根据本发明的方法,将第一可聚合材料沿预选路径挤出到电路基板支撑件上以形成迹线,并且第一可聚合材料聚合,第一可聚合材料在聚合之后是导电的。 公开了一种用于保持电气部件的电路板,其包括电路基板支撑件和多个导电迹线。 轨迹在电气部件的位置之间粘附到电路基板支撑件,迹线由聚合物厚膜形成,通过从限定走线位置的路径从孔口挤压到支撑件上。 挤压系统的几个实施例被描述为用于铣削和钻孔板以提供新的电路板制造商的系统。
    • 9. 发明授权
    • Multi-ply cellulosic products using high-bulk cellulosic fibers
    • 使用大体积纤维素纤维的多层纤维素产品
    • US06306251B1
    • 2001-10-23
    • US08912055
    • 1997-08-18
    • Richard A. JewellAmar N. Neogi
    • Richard A. JewellAmar N. Neogi
    • D21H1120
    • D21H17/07D21H11/20D21H17/15D21H17/28D21H27/38Y10T428/2965
    • A multi-ply paperboard comprising at least one ply of conventional cellulose fibers and from about 0.1 to about 6 weight percent of a water-borne binding agent; and at least one ply of chemically intrafiber crosslinked cellulosic high-bulk fibers and from about 0.1 to about 6 weight percent of a water-borne binding agent. The water-borne binding agent may be a starch, a modified starch, a polyvinyl alcohol, a polyvinyl acetate, a polyethylene/acrylic acid copolymer, an acrylic acid polymer, a polyacrylate, a polyacrylamide, a polyamine, guar gum, an oxidized polyethylene, a polyvinyl chloride, a polyvinyl chloride/acrylic acid copolymer, an acrylonitrile/butadiene/styrene copolymer or polyacrylonitrile. A method for making the paperboard is disclosed.
    • 包含至少一层常规纤维素纤维和约0.1至约6重量%水性粘合剂的多层纸板; 和至少一层化学纤维内交联的纤维素高松散纤维和约0.1至约6重量%的水性粘合剂。 水性粘合剂可以是淀粉,改性淀粉,聚乙烯醇,聚乙酸乙烯酯,聚乙烯/丙烯酸共聚物,丙烯酸聚合物,聚丙烯酸酯,聚丙烯酰胺,多胺,瓜尔胶,氧化聚乙烯 ,聚氯乙烯,聚氯乙烯/丙烯酸共聚物,丙烯腈/丁二烯/苯乙烯共聚物或聚丙烯腈。 公开了制造纸板的方法。