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1. 发明授权

US5099090A Circuit writer 失效
标题翻译：电路作家
公开(公告)号：US5099090A
公开(公告)日：1992-03-24
申请号：US460980
申请日：1990-01-11
申请人： G. Graham Allan , Gary A. DeBardi , Amar N. Neogi , Kenneth N. Bates , Robert B. Erley , Thomas L. Jacobs , Ramzi F. Hamade , Stephen J. Horne , Manu C. Patel , John E. Rose , Mark S. Schlosser , David P. Warden
发明人： G. Graham Allan , Gary A. DeBardi , Amar N. Neogi , Kenneth N. Bates , Robert B. Erley , Thomas L. Jacobs , Ramzi F. Hamade , Stephen J. Horne , Manu C. Patel , John E. Rose , Mark S. Schlosser , David P. Warden
IPC分类号： H01B1/22 , H05K1/09 , H05K3/00 , H05K3/12 , H05K3/40 , H05K3/46
CPC分类号： H05K1/095 , H01B1/22 , H05K3/0091 , H05K3/1241 , H05K3/4069 , H05K2201/09581 , H05K2201/09827 , H05K2201/0989 , H05K2203/0126 , H05K2203/0763 , H05K3/4644 , Y10T29/49155
摘要： An apparatus and method are disclosed for preparing electrically conductive traces on a circuit board using an additive technology. The traces are directly written in a serial process with each trace being able to be individually insulated. The apparatus includes an extrusion element for extruding a first material and a stage. The stage is for holding the extrusion element and the circuit board in relative proximity and for producing relative motion between the extrusion element and the circuit board in order to extrude the first material onto the surface of the circuit board along preselected paths to produce the electrically conductive traces. According to the method of invention, a first polymerizable material is extruded onto a circuit substrate support along preselected paths to form traces, and the first polymerizable material is polymerized, the first polymerizable material being conductive after polymerization. A circuit board for holding electrical components is disclosed which includes a circuit substrate support and a plurality of electrically conductive traces. The traces are adhered to the circuit substrate support between locations for the electrical components, the traces being formed of a polymer thick film by extrusion from an orifice onto the support along paths defining the location of the traces. Several embodiments of extrusion systems are described as are systems for milling and drilling boards to provide new manufactures of circuit boards.
摘要翻译： PCT No.PCT / US89 / 02026 Sec。 371 1990年1月11日第 102（e）1990年1月11日日期PCT提交1989年5月11日PCT公布。出版物WO89 / 11209 日本公开了一种用于使用添加剂技术在电路板上制备导电迹线的装置和方法。轨迹直接写在串行过程中，每个迹线都可以单独隔离。该装置包括用于挤出第一材料和台架的挤出元件。该阶段用于将挤出元件和电路板保持在相对接近处并且用于在挤出元件和电路板之间产生相对运动，以便沿预选路径将第一材料挤压到电路板的表面上以产生导电痕迹根据本发明的方法，将第一可聚合材料沿预选路径挤出到电路基板支撑件上以形成迹线，并且第一可聚合材料聚合，第一可聚合材料在聚合之后是导电的。公开了一种用于保持电气部件的电路板，其包括电路基板支撑件和多个导电迹线。轨迹在电气部件的位置之间粘附到电路基板支撑件，迹线由聚合物厚膜形成，通过从限定走线位置的路径从孔口挤压到支撑件上。挤压系统的几个实施例被描述为用于铣削和钻孔板以提供新的电路板制造商的系统。

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