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1. 发明授权

US07407608B2 Resin molding equipment and resin molding method 有权
标题翻译：树脂成型设备和树脂成型方法
公开(公告)号：US07407608B2
公开(公告)日：2008-08-05
申请号：US11262851
申请日：2005-11-01
申请人： Fumio Miyajima , Kazuhiko Kobayashi , Kenji Nakajima , Naoya Gotoh , Kazuhiko Kobayashi , Kazuro Wada , Haruhisa Makino , Haruhisa Takahashi
发明人： Fumio Miyajima , Kazuhiko Kobayashi , Kenji Nakajima , Naoya Gotoh , Kazuhiko Kobayashi , Kazuro Wada , Haruhisa Makino , Haruhisa Takahashi
IPC分类号： B29C45/14 , H01L21/56
CPC分类号： B29C33/58 , B29C33/10 , B29C33/68 , B29C43/18 , B29C43/58 , B29C2043/561 , B29C2043/5825 , B29C2043/5883 , B29C2043/5891 , H01L21/565 , H01L21/67207 , H01L21/67236 , H01L2224/48091 , H01L2924/15311 , H01L2924/00014
摘要： The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section supplying liquid resin to the work piece; a resin molding section having a molding die for molding the work piece with the liquid resin; a product measuring section measuring thickness of a resin molded part of the molded product; a product accommodating section; and a control section for controlling the sections. The control section includes means for adjusting an amount of the liquid resin, which is supplied to the work piece by the resin supplying section, on the basis of the thickness measured by the work piece measuring section.
摘要翻译：树脂成形设备包括：工件供给部; 测量安装在工件上的半导体芯片的厚度的工件测量部分; 向工件供给液体树脂的树脂供给部; 树脂模制部分，具有用于使液体树脂模制工件的模制模具; 测量模制产品的树脂模制部件的厚度的产品测量部分; 产品容纳部; 以及用于控制这些部分的控制部分。控制部分包括根据由工件测量部测量的厚度来调节由树脂供给部分供给到工件的液体树脂的量的装置。

2. 发明申请

US20060093692A1 Resin molding equipment and resin molding method 有权
标题翻译：树脂成型设备和树脂成型方法
公开(公告)号：US20060093692A1
公开(公告)日：2006-05-04
申请号：US11262851
申请日：2005-11-01
申请人： Fumio Miyajima , Kazuhiko Kobayashi , Kenji Nakajima , Naoya Gotoh , Kazuro Wada , Haruhisa Makino , Haruhisa Takahashi
发明人： Fumio Miyajima , Kazuhiko Kobayashi , Kenji Nakajima , Naoya Gotoh , Kazuro Wada , Haruhisa Makino , Haruhisa Takahashi
IPC分类号： B29C47/92
CPC分类号： B29C33/58 , B29C33/10 , B29C33/68 , B29C43/18 , B29C43/58 , B29C2043/561 , B29C2043/5825 , B29C2043/5883 , B29C2043/5891 , H01L21/565 , H01L21/67207 , H01L21/67236 , H01L2224/48091 , H01L2924/15311 , H01L2924/00014
摘要： The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section supplying liquid resin to the work piece; a resin molding section having a molding die for molding the work piece with the liquid resin; a product measuring section measuring thickness of a resin molded part of the molded product; a product accommodating section; and a control section for controlling the sections. The control section includes means for adjusting an amount of the liquid resin, which is supplied to the work piece by the resin supplying section, on the basis of the thickness measured by the work piece measuring section.
摘要翻译：树脂成形设备包括：工件供给部; 测量安装在工件上的半导体芯片的厚度的工件测量部分; 向工件供给液体树脂的树脂供给部; 树脂模制部分，具有用于使液体树脂模制工件的模制模具; 测量模制产品的树脂模制部件的厚度的产品测量部分; 产品容纳部; 以及用于控制这些部分的控制部分。控制部分包括根据由工件测量部测量的厚度来调节由树脂供给部分供给到工件的液体树脂的量的装置。

3. 发明申请

US20070262049A1 Imprinting method and nano-imprinting apparatus 审中-公开
标题翻译：压印方法和纳米压印装置
公开(公告)号：US20070262049A1
公开(公告)日：2007-11-15
申请号：US11798447
申请日：2007-05-14
申请人： Fumio Miyajima , Kazuhiko Kobayashi , Kazuhiko Kobayashi , Hideaki Nakazawa , Naoya Gotoh , Masahiko Fujisawa , Akira Katsuyama , Shuji Ide
发明人： Fumio Miyajima , Kazuhiko Kobayashi , Kazuhiko Kobayashi , Hideaki Nakazawa , Naoya Gotoh , Masahiko Fujisawa , Akira Katsuyama , Shuji Ide
IPC分类号： B44C1/22 , B29C33/40
CPC分类号： B29C33/42 , B29C43/003 , B29C43/021 , B29C43/18 , B29C2043/025 , B29C2043/3605 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： An imprinting method carries out imprinting on a workpiece by clamping UV-curable resin between a nano-imprinting mold and a workpiece and curing the UV-curable resin using UV light. In this method, the workpiece is supported on a setting table provided with through-holes that are disposed in a planar region of the setting table on which the workpiece is set and are connected to a gas pumping/evacuating mechanism. The UV-curable resin is supplied onto the workpiece and the setting table is raised to and stopped at a filling operation position where the mold surface of the nano-imprinting mold and the surface of the workpiece are apart. After this, gas is pumped toward the lower surface of the workpiece from the through-holes and the workpiece is pressed onto the nano-imprinting mold from a center of the workpiece toward a periphery of the workpiece while gradually filling the UV-curable resin between the nano-imprinting mold and the workpiece. The UV-curable resin is cured by irradiating the UV-curable resin with UV light in a state where the workpiece is pressed onto the nano-imprinting mold by the pumping pressure of the gas.
摘要翻译：压印方法通过将UV固化树脂夹在纳米压印模和工件之间并通过UV光固化UV固化树脂，在工件上进行压印。在该方法中，工件被支撑在设置有设置在设置工作台的平面区域中并且与气体抽吸/排气机构连接的通孔的设置台上。将紫外线固化树脂供给到工件上，并且将安装台升高并停止在填充操作位置，其中纳米压印模具的模具表面和工件表面分开。此后，气体从通孔向工件的下表面泵送，并且工件从工件的中心朝向工件的周边压到纳米压印模具上，同时逐渐地将UV可固化树脂填充在纳米压印模具和工件。在通过气体的泵送压力将工件压在纳米压印模上的状态下，通过用UV光照射UV固化树脂来固化紫外线固化树脂。

4. 发明授权

US06350113B1 Resin molding machine 有权
标题翻译：树脂成型机
公开(公告)号：US06350113B1
公开(公告)日：2002-02-26
申请号：US09513828
申请日：2000-02-25
申请人： Fumio Miyajima
发明人： Fumio Miyajima
IPC分类号： H01L2156
CPC分类号： B29C45/14655 , B29C45/0025 , B29C45/02 , B29C45/1468 , B29C2045/14663 , H01L2224/48091 , H01L2224/48247 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A resin molding machine is capable of preventing molded products from forming resin flash on their surfaces. The resin molding machine includes a press section, a loading section, an unloading section, an accommodating section, a film feeding section, and an air sucking mechanism. By pressing the release film on the surface of the part of the work piece, the release film prevents the melted resin from invading into a gap between the release film and the work piece, so that no resin flash is formed on the surface of the work piece.
摘要翻译：树脂成型机能够防止模制品在其表面上形成树脂闪光。树脂成型机包括压榨部，装载部，卸载部，容纳部，送膜部和吸气机构。通过按压工件表面上的脱模膜，防粘膜防止熔融树脂侵入到脱模膜和工件之间的间隙中，从而在工件的表面上不会形成树脂闪光片。

5. 发明授权

US06187243B1 Method of resin molding 失效
标题翻译：树脂成型方法
公开(公告)号：US06187243B1
公开(公告)日：2001-02-13
申请号：US09112018
申请日：1998-07-08
申请人： Fumio Miyajima
发明人： Fumio Miyajima
IPC分类号： B29C4514
CPC分类号： B29C45/14655 , B29C45/0025 , B29C45/02 , B29C45/1468 , B29C2045/14663 , H01L2224/48091 , H01L2224/48247 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： The method of resin molding is capable of preventing molded products from forming resin flash on their surfaces. The method comprises the steps of: covering over a parting face, of at least one of molding dies with release film; clamping a work piece, with the release film, by the molding dies; and filling the melted resin in the molding section of the molding die, wherein the release film is tightly pressed on a surface of a part of the work piece, which is exposed after molding, in the clamping step. By pressing the release film on the surface of the part of the work piece, the release film prevents the melted resin from invading into a gap between the release film and the work piece, so that no resin flash is formed on the surface of the work piece.
摘要翻译：树脂成型的方法能够防止模制品在其表面上形成树脂闪光。该方法包括以下步骤：用分离膜覆盖至少一个模具的分型面; 用成型模夹紧带有隔离膜的工件; 以及将熔融树脂填充到成型模具的成型部分中，其中在夹紧步骤中将剥离膜紧紧地压在成型后暴露的工件的一部分的表面上。通过按压工件表面上的脱模膜，防粘膜防止熔融树脂侵入到脱模膜和工件之间的间隙中，从而在工件的表面上不会形成树脂闪光片。

6. 发明授权

US06459159B1 Apparatus for sealing a semiconductor device utilizing a release film 失效
标题翻译：利用离型膜密封半导体器件的设备
公开(公告)号：US06459159B1
公开(公告)日：2002-10-01
申请号：US09650649
申请日：2000-08-30
申请人： Tsutomu Miyagawa , Kunihiro Aoki , Masahiro Kodama , Fumio Miyajima
发明人： Tsutomu Miyagawa , Kunihiro Aoki , Masahiro Kodama , Fumio Miyajima
IPC分类号： H01L2148
CPC分类号： H01L21/566 , B29C45/14655 , B29C2043/5875 , B29C2045/14663 , B29C2791/008 , H01L21/563 , H01L21/67126 , H01L2224/05571 , H01L2224/05573 , H01L2224/16227 , H01L2224/73203 , H01L2224/75315 , H01L2224/83102 , H01L2224/92125 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2224/05599
摘要： A resin sealing method for sealing a joining portion between a semiconductor chip 12 and a substrate 10 by filling a underfilled portion of a molded piece 40 in which a semiconductor chip is mounted on a substrate with solder bumps studded therebetween with sealing resin 14 by a transfer molding process, the method being characterized in that when the molded piece 40 is clamped with a mold of a transfer molding machine, the perimeter of the underfilled portion, except the end of a gate continuous to the underfilled portion, is closed with a release film 20, and in a state that the perimeter of the underfilled portion is closed, the sealing resin 14 having been supplied to a pot 42 provided in the mold is fed under pressure to the underfilled portion, to thereby fill the underfilled portion.
摘要翻译：一种树脂密封方法，用于通过将其中安装有半导体芯片的模制件40的未填充部分填充到衬底上来密封半导体芯片12和衬底10之间的接合部分，其中焊料凸块之间通过密封树脂14通过传输该方法的特征在于，当模制件40用传递模塑机的模具夹紧时，底部填充部分的周边除了与底部填充部分连续的浇口的端部之外，还具有脱模膜如图20所示，并且在未填充部分的周边关闭的状态下，已经供给到设置在模具中的盆42的密封树脂14在压力下被供给到未填充部分，从而填充未填充部分。

7. 发明授权

US06444157B1 Method of resin molding 失效
标题翻译：树脂成型方法
公开(公告)号：US06444157B1
公开(公告)日：2002-09-03
申请号：US09090153
申请日：1998-06-02
申请人： Fumio Miyajima
发明人： Fumio Miyajima
IPC分类号： B29C3318
CPC分类号： B29C45/14655 , B29C33/0038 , B29C33/10 , B29C33/68 , B29C45/37 , B29C70/72 , B29C2045/14663
摘要： A method of resin molding for molding regular products and a resin molding machine for the same. In the method of the present invention, release film, which is capable of easily peeling off from molding dies and resin, is provided on faces of molding dies. A member to be molded by the molding dies 15 is clamped together with the release film. An inner face of a pot of the molding die is covered with the release film. A resin tablet is supplied into the pot.
摘要翻译：用于成型常规产品的树脂模制方法和用于其的树脂模塑机。在本发明的方法中，在成型模具的表面上设置有能够从模具和树脂剥离的脱模膜。由成型模具15成型的构件与剥离膜夹持在一起。成型模具的锅的内表面被剥离膜覆盖。将一个树脂片供应到锅中。

8. 发明授权

US06344162B1 Method of manufacturing semiconductor devices and resin molding machine 有权
标题翻译：制造半导体器件和树脂成型机的方法
公开(公告)号：US06344162B1
公开(公告)日：2002-02-05
申请号：US09337276
申请日：1999-06-22
申请人： Fumio Miyajima
发明人： Fumio Miyajima
IPC分类号： B29C4514
CPC分类号： B29C43/18 , B29C43/183 , B29C43/32 , B29C43/36 , B29C2043/3416 , B29C2043/5825 , H01L21/561 , H01L21/566 , H01L24/97 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/12042 , H01L2924/15311 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： The method of manufacturing semiconductor devices is capable of efficiently manufacturing semiconductor devices and preventing production of bad products. The method is executed in a molding machine including an tipper die and a lower die, in one of which a plurality of cavities corresponding to resin-molded parts of the semiconductor devices are formed. And, the method comprises the steps of: covering inner faces of the cavities and a parting face of one of the dies, which contacts a substrate of the semiconductor devices, with release film, which is easily peelable from the dies and resin for molding; clamping the substrate with the dies; filling the resin in the cavities; and forming the semiconductor devices by cutting the molded substrate.
摘要翻译：制造半导体器件的方法能够有效地制造半导体器件并防止不良产品的生产。该方法在包括翻转模和下模的成型机中执行，其中一个形成与半导体器件的树脂模制部分相对应的多个空腔。并且，该方法包括以下步骤：覆盖空腔的内表面和与半导体器件的基板接触的一个模具的分离面，其具有易于从模具和树脂上剥离的脱模膜; 用模具夹紧基板; 将树脂填充在空腔中; 以及通过切割模制的基底来形成半导体器件。

9. 发明授权

US06770236B2 Method of resin molding 有权
标题翻译：树脂成型方法
公开(公告)号：US06770236B2
公开(公告)日：2004-08-03
申请号：US09933950
申请日：2001-08-22
申请人： Fumio Miyajima
发明人： Fumio Miyajima
IPC分类号： B29C4502
CPC分类号： B30B5/02 , B29C45/02 , B29C45/34 , B29C2045/14663 , H01L2224/48091 , H01L2224/75315 , H01L2224/7598 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01057 , H01L2924/01082 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： In the method of resin molding of the present invention, air can be perfectly discharged from a specific area of a molding die including cavities, resin paths, pots, etc. so as to mold high quality products. The method comprises the steps of: covering a specific area of a molding die, in which air is left, with release film; clamping a work piece and the release film between an upper die and a lower die of the molding die so as to air-tightly seal the specific area; discharging the air from the sealed specific area; and filling a molding section with resin.
摘要翻译：在本发明的树脂成型方法中，空气可以从包括空腔，树脂路径，花盆等的成型模具的特定区域中完全排出，从而模制高质量的产品。该方法包括以下步骤：用脱模膜覆盖留下空气的成型模具的特定区域; 将工件和脱模膜夹持在成型模具的上模和下模之间，以气密地密封特定区域; 从密封的特定区域排出空气; 并用树脂填充模制部分。

10. 发明授权

US5800841A Resin molding machine 失效
标题翻译：树脂成型机
公开(公告)号：US5800841A
公开(公告)日：1998-09-01
申请号：US562151
申请日：1995-11-22
申请人： Fumio Miyajima
发明人： Fumio Miyajima
IPC分类号： B29C33/00 , B29C33/10 , B29C33/68 , B29C45/14 , B29C45/37 , B29C70/72 , B29C45/02
CPC分类号： B29C45/14655 , B29C33/0038 , B29C33/68 , B29C45/37 , B29C70/72 , B29C2045/14663 , B29C33/10
摘要： A method of resin molding for molding regular products and a resin molding machine for the same. In the method of the present invention, release film, which is capable of easily peeling off from molding dies and resin, is provided on faces of the molding dies. A member to be molded by the molding dies is clamped together with the release film. An inner face of a pot of the molding die is covered with the release film. A resin tablet is supplied into the pot.
摘要翻译：用于成型常规产品的树脂模制方法和用于其的树脂模塑机。在本发明的方法中，在成型模具的表面上设置有能够容易地从模具和树脂剥离的脱模膜。通过模塑成型的构件与剥离膜夹紧在一起。成型模具的锅的内表面被剥离膜覆盖。将一个树脂片供应到锅中。

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