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1. 发明授权

US06803548B2 Batch-type heat treatment apparatus and control method for the batch-type heat treatment apparatus 有权
标题翻译：批式热处理装置和批式热处理装置的控制方法
公开(公告)号：US06803548B2
公开(公告)日：2004-10-12
申请号：US09950876
申请日：2001-09-13
申请人： Wenling Wang , Koichi Sakamoto , Fujio Suzuki , Moyuru Yasuhara , Sunil Shah , Pradeep Pandey , Mark Erickson
发明人： Wenling Wang , Koichi Sakamoto , Fujio Suzuki , Moyuru Yasuhara , Sunil Shah , Pradeep Pandey , Mark Erickson
IPC分类号： H05B102
CPC分类号： H01L21/67109 , C23C16/46 , C23C16/52 , C30B31/18 , F27D19/00 , F27D21/0014 , G05D23/1932 , H01L21/67248
摘要： A heat treatment apparatus for making a heat treatment while estimating temperatures of objects-to-be-processed that can estimate correct temperatures of the objects-to-be-processed. A reaction tube includes heaters and temperature sensors, and receives a wafer boat. A controller estimates temperatures of wafers and temperatures of the temperature sensors in zones in the reaction tube corresponding to the heaters by using the temperature sensors and electric powers of the heaters. Based on relationships between estimated temperatures of the temperature sensors and really metered temperatures, functions expressing the relationships between the estimated temperatures and the really metered temperatures are given for the respective zones. The functions are substituted by the estimated wafer temperatures to correct the estimated wafer temperatures. Electric powers to be fed to the respective heaters are respectively controlled so that the corrected wafer temperatures are converged to target temperature trajectories.
摘要翻译：一种用于进行热处理的热处理装置，同时估计能够估计被处理物体的正确温度的待处理物体的温度。反应管包括加热器和温度传感器，并接收晶片舟。控制器通过使用温度传感器和加热器的电力来估计对应于加热器的反应管中的晶片温度和温度传感器的温度。基于温度传感器的估计温度和真正计量温度之间的关系，给出了各个区域表达估计温度和真实计量温度之间的关系的函数。功能由估计的晶片温度代替，以校正估计的晶片温度。分别控制供给到各个加热器的电力，使得校正的晶片温度收敛到目标温度轨迹。

2. 发明授权

US06730885B2 Batch type heat treatment system, method for controlling same, and heat treatment method 有权
标题翻译：批式热处理系统，其控制方法和热处理方法
公开(公告)号：US06730885B2
公开(公告)日：2004-05-04
申请号：US09897908
申请日：2001-07-05
申请人： Fujio Suzuki , Wenling Wang , Koichi Sakamoto , Moyuru Yasuhara , Sunil Shah , Pradeep Pandey
发明人： Fujio Suzuki , Wenling Wang , Koichi Sakamoto , Moyuru Yasuhara , Sunil Shah , Pradeep Pandey
IPC分类号： H05B302
CPC分类号： H01L21/67248 , H01L21/67109
摘要： There is provided a batch type heat treatment system, control method and heat treatment method capable of appropriately coping with a multi-product small-lot production. A reaction tube 2 comprises a plurality of heaters 31 through 35 and a plurality of temperature sensors, and houses therein a wafer boat 23. A control part 100 stores therein many mathematical models for estimating (calculating) the temperature of wafers W in the reaction tube 2, in accordance with the number and arranged position of the wafers W mounted on the wafer boat 23, and many target temperature trajectories. If the wafer boat 23 is loaded in the reaction tube 2, a mathematical model and a target temperature trajectory corresponding to the number and arranged position of the mounted wafers W are read. If a deposition process is started, the output of a temperature sensor S and the model are used for estimating the temperature of the wafers W in the reaction tube 2, and the powers to be supplied to the heaters 31 through 35 are separately controlled so that the estimated temperature approaches the target temperature trajectory.
摘要翻译：提供能够适当应对多产品小批量生产的批式热处理系统，控制方法和热处理方法。反应管2包括多个加热器31至35和多个温度传感器，以及在其中容纳晶片舟23.控制部分100存储许多用于根据安装在晶片舟23上的晶片W的数量和布置位置来估计（计算）反应管2中的晶片W的温度的数学模型，以及许多目标温度轨迹。如果晶片舟23装载在反应管2中，则读取与安装的晶片W的数量和排列位置对应的数学模型和目标温度轨迹。如果开始沉积工艺，则使用温度传感器S和模型的输出来估计反应管2中的晶片W的温度，并且分别控制供给到加热器31至35的功率，使得估计的温度接近目标温度轨迹。

3. 发明授权

US07519885B2 Monitoring a monolayer deposition (MLD) system using a built-in self test (BIST) table 失效
标题翻译：使用内置自检（BIST）表监测单层沉积（MLD）系统
公开(公告)号：US07519885B2
公开(公告)日：2009-04-14
申请号：US11278382
申请日：2006-03-31
申请人： Sanjeev Kaushal , Pradeep Pandey , Kenji Sugishima
发明人： Sanjeev Kaushal , Pradeep Pandey , Kenji Sugishima
IPC分类号： G06F11/00 , G11C29/00 , G06F11/30 , G06F19/00 , G01R31/26
CPC分类号： G05B19/41875 , C23C16/45546 , C23C16/52 , G05B23/0254 , G05B2219/1112 , G05B2219/37514 , G05B2219/37533 , G05B2219/45031 , G05B2223/02 , Y02P90/14 , Y02P90/22 , Y02P90/26
摘要： A method of monitoring a processing system in real-time using low-pressure based modeling techniques that include processing one or more of wafers in a processing chamber; determining a measured dynamic process response for a rate of change for a process parameter; executing a real-time dynamic model to generate a predicted dynamic process response; determining a dynamic estimation error using a difference between the predicted dynamic process response and the expected process response; and comparing the dynamic estimation error to operational limits.
摘要翻译：一种使用基于低压的建模技术实时监控处理系统的方法，所述技术包括处理处理室中的一个或多个晶片; 确定针对过程参数的变化率的测量的动态过程响应; 执行实时动态模型以产生预测的动态过程响应; 使用预测的动态过程响应和预期过程响应之间的差来确定动态估计误差; 并将动态估计误差与运算极限进行比较。

4. 发明授权

US07459175B2 Method for monolayer deposition 有权
标题翻译：单层沉积方法
公开(公告)号：US07459175B2
公开(公告)日：2008-12-02
申请号：US11043459
申请日：2005-01-26
申请人： Sanjeev Kaushal , Pradeep Pandey , Kenji Sugishima
发明人： Sanjeev Kaushal , Pradeep Pandey , Kenji Sugishima
IPC分类号： C23C16/52 , C23C14/22 , C23C16/44 , H01L21/66
CPC分类号： C23C16/45527 , C23C16/45546 , C23C16/45557 , C23C16/46 , C23C16/52
摘要： An adaptive real time thermal processing system is presented that includes a multivariable controller. The method includes creating a dynamic model of the MLD processing system and incorporating virtual sensors in the dynamic model. The method includes using process recipes comprising intelligent set points, dynamic models, and/or virtual sensors.
摘要翻译：提出了一种包括多变量控制器的自适应实时热处理系统。该方法包括创建MLD处理系统的动态模型，并将虚拟传感器并入动态模型中。该方法包括使用包括智能设定点，动态模型和/或虚拟传感器的过程配方。

5. 发明授权

US07406644B2 Monitoring a thermal processing system 有权
标题翻译：监控热处理系统
公开(公告)号：US07406644B2
公开(公告)日：2008-07-29
申请号：US11278012
申请日：2006-03-30
申请人： Sanjeev Kaushal , Pradeep Pandey , Kenji Sugishima
发明人： Sanjeev Kaushal , Pradeep Pandey , Kenji Sugishima
IPC分类号： G01R31/28
CPC分类号： H01L22/20
摘要： A method of monitoring a thermal processing system in real-time using a built-in self test (BIST) table to detect, diagnose and/or predict fault conditions and/or degraded performance. The method includes positioning a plurality of wafers in a processing chamber in the thermal processing system, performing a self test process, determining a real-time transient error from a measured transient response and a baseline transient response determined by a BIST rule stored in the BIST table, and comparing the transient error to operational limits and warning limits established by the BIST rule for the self test process.
摘要翻译：使用内置自检（BIST）表来实时监测热处理系统的方法来检测，诊断和/或预测故障状况和/或降级的性能。该方法包括将多个晶片定位在热处理系统中的处理室中，执行自测试过程，从测量的瞬态响应确定实时瞬态误差，以及由存储在BIST中的BIST规则确定的基线瞬态响应表，并将瞬态误差与BIST规则为自检过程建立的运行极限和警告限制进行比较。

6. 发明授权

US06289508B1 Method and apparatus for dynamic optimization 有权
标题翻译：动态优化的方法和装置
公开(公告)号：US06289508B1
公开(公告)日：2001-09-11
申请号：US09594462
申请日：2000-06-14
申请人： Mark A. Erickson , Pradeep Pandey , Sunil C. Shah , Thorkell Gudmundsson
发明人： Mark A. Erickson , Pradeep Pandey , Sunil C. Shah , Thorkell Gudmundsson
IPC分类号： G06F945
CPC分类号： G05B13/042 , G05B13/04 , G05B17/02
摘要： The present invention is a method and apparatus for dynamic optimization of a dynamic physical system having a device under control and a controller along with a modeling system having an estimator and a constrained nonlinear program. The time varying trajectories of the dynamic physical system are parameterized and run through the modeling system in order to produce a set of optimal time varying setpoint trajectories to be used in the dynamic physical system. The optimal time varying setpoint trajectories optimize the physical system to produce the desired end result (or product) of the dynamic physical system.
摘要翻译：本发明是用于动态优化动态物理系统的方法和装置，其具有被控制的装置和控制器以及具有估计器和约束非线性程序的建模系统。动态物理系统的时变轨迹被参数化并运行在建模系统中，以便产生要在动态物理系统中使用的一组最佳时变设定点轨迹。最优时变设定点轨迹优化物理系统以产生动态物理系统的期望最终结果（或产品）。

7. 发明授权

US06285971B1 Method for real-time nonlinear system state estimation and control 有权
标题翻译：实时非线性系统状态估计与控制方法
公开(公告)号：US06285971B1
公开(公告)日：2001-09-04
申请号：US09372396
申请日：1999-08-10
申请人： Sunil C. Shah , Pradeep Pandey
发明人： Sunil C. Shah , Pradeep Pandey
IPC分类号： G06F1750
CPC分类号： G05B13/04
摘要： A method for the estimation of the state variables of nonlinear systems with exogenous inputs is based on improved extended Kalman filtering (EKF) type techniques. The method uses a discrete-time model, based on a set of nonlinear differential equations describing the system, that is linearized about the current operating point. The time update for the state estimates is performed using integration methods. Integration, which is accomplished through the use of matrix exponential techniques, avoids the inaccuracies of approximate numerical integration techniques. The updated state estimates and corresponding covariance estimates use a common time-varying system model for ensuring stability of both estimates. Other improvements include the use of QR factorization for both time and measurement updating of square-root covariance and Kalman gain matrices and the use of simulated annealing for ensuring that globally optimal estimates are produced.
摘要翻译：用外推法估计非线性系统的状态变量的方法是基于改进的扩展卡尔曼滤波（EKF）类型技术。该方法使用离散时间模型，基于描述系统的一组非线性微分方程，其关于当前工作点线性化。使用集成方法执行状态估计的时间更新。通过使用矩阵指数技术实现的集成避免了近似数值积分技术的不准确性。更新的状态估计和相应的协方差估计使用通用的时变系统模型来确保两个估计的稳定性。其他改进包括使用QR因子分析进行时间和平方根协方差和卡尔曼增益矩阵的测量更新，以及使用模拟退火确保产生全局最优估计。

8. 发明授权

US07838072B2 Method and apparatus for monolayer deposition (MLD) 有权
标题翻译：单层沉积方法和装置（MLD）
公开(公告)号：US07838072B2
公开(公告)日：2010-11-23
申请号：US11043199
申请日：2005-01-26
申请人： Sanjeev Kaushal , Pradeep Pandey , Kenji Sugishima
发明人： Sanjeev Kaushal , Pradeep Pandey , Kenji Sugishima
IPC分类号： C23C16/00
CPC分类号： C23C16/45527 , C23C16/52
摘要： An adaptive real time thermal processing system is presented that includes a multivariable controller. The method includes creating a dynamic model of the MLD processing system and incorporating virtual sensors in the dynamic model. The method includes using process recipes comprising intelligent set points, dynamic models, and/or virtual sensors.
摘要翻译：提出了一种包括多变量控制器的自适应实时热处理系统。该方法包括创建MLD处理系统的动态模型，并将虚拟传感器并入动态模型中。该方法包括使用包括智能设定点，动态模型和/或虚拟传感器的过程配方。

9. 发明授权

US07526699B2 Method for creating a built-in self test (BIST) table for monitoring a monolayer deposition (MLD) system 失效
标题翻译：用于创建用于监测单层沉积（MLD）系统的内置自检（BIST）表的方法
公开(公告)号：US07526699B2
公开(公告)日：2009-04-28
申请号：US11278386
申请日：2006-03-31
申请人： Sanjeev Kaushal , Pradeep Pandey , Kenji Sugishima
发明人： Sanjeev Kaushal , Pradeep Pandey , Kenji Sugishima
IPC分类号： G06F11/00 , G11C29/00 , G06F11/30 , G06F19/00 , G01R31/26
CPC分类号： G05B19/41875 , C23C16/45546 , C23C16/52 , G05B23/0254 , G05B2219/37514 , G05B2219/37533 , G05B2219/45031 , Y02P90/22 , Y02P90/26
摘要： A method of monitoring a processing system in real-time using low-pressure based modeling techniques that include processing one or more of wafers in a processing chamber, calculating dynamic estimation errors for the precursor and/or purging process, and determining if the dynamic estimation errors can be associated with pre-existing BIST rules for the process. When the dynamic estimation error cannot be associated with a pre-existing BIST rule, the method includes either modifying the BIST table by creating a new BIST rule for the process, or stopping the process when a new BIST rule cannot be created.
摘要翻译：一种使用基于低压的建模技术来实时监测处理系统的方法，所述建模技术包括处理处理室中的一个或多个晶片，计算前体和/或清洗过程的动态估计误差，以及确定动态估计错误可以与进程的预先存在的BIST规则相关联。当动态估计错误不能与预先存在的BIST规则相关联时，该方法包括通过为进程创建一个新的BIST规则来修改BIST表，或者在无法创建新的BIST规则时停止该过程。

10. 发明授权

US07302363B2 Monitoring a system during low-pressure processes 有权
标题翻译：在低压过程中监控系统
公开(公告)号：US07302363B2
公开(公告)日：2007-11-27
申请号：US11278379
申请日：2006-03-31
申请人： Sanjeev Kaushal , Pradeep Pandey , Kenji Sugishima
发明人： Sanjeev Kaushal , Pradeep Pandey , Kenji Sugishima
IPC分类号： G06F11/30
CPC分类号： G05B19/41875 , C23C16/52 , G05B23/0254 , G05B2219/37514 , G05B2219/37533 , G05B2219/45031 , Y02P90/22 , Y02P90/26
摘要： A method of monitoring a processing system in real-time using low-pressure based modeling techniques that include processing one or more of wafers in a processing chamber; determining a measured dynamic process response for a rate of change for a process parameter; executing a real-time dynamic model to generate a predicted dynamic process response; determining a dynamic estimation error using a difference between the predicted dynamic process response and the expected process response; and comparing the dynamic estimation error to operational limits.
摘要翻译：一种使用基于低压的建模技术实时监控处理系统的方法，所述技术包括处理处理室中的一个或多个晶片; 确定针对过程参数的变化率的测量的动态过程响应; 执行实时动态模型以产生预测的动态过程响应; 使用预测的动态过程响应和预期过程响应之间的差来确定动态估计误差; 并将动态估计误差与运算极限进行比较。

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