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JP2007277634A Plating method, plating apparatus and electroplated battery can 有权
标题翻译：电镀方法，电镀设备和电镀电池
公开(公告)号：JP2007277634A
公开(公告)日：2007-10-25
申请号：JP2006105118
申请日：2006-04-06
申请人： Fuji Hatsujo Kk , Kida Seiko Kk , 冨士発條株式会社 , 木田精工株式会社
发明人： SAKAMOTO KIYOSHI , FUJII SHINJI , FUJII HIROSHI , OSAKO KENJI , KIDA HIROFUMI
IPC分类号： C25D21/10 , C25D7/00 , C25D7/04 , C25D17/08 , C25D17/12 , H01M2/02
CPC分类号： Y02E60/12
摘要： PROBLEM TO BE SOLVED: To provide a plating method and a plating apparatus which can surely and uniformly plate the inside surface of even a thin, long, bottom-blind and cylindrical body so as to provide a battery can for a hybrid car in which a thick plated film is formed on its slender inside surface and even on the inside surface of its bottom surface .
SOLUTION: One end of a holding tool 13 to be used also as a cathode is inserted into an object 10 to be plated from the side of an opening 10a thereof and brought into contact with the inside surface of the object 10 to be plated to hold the object 10 to be plated and the other end of the holding tool 13 is supported to be freely rotated to give a rotatory motion to one end of the holding tool 13. The object 10 to be plated is reciprocated between such a position A that the object 10 to be plated is immersed in a plating solution 14 while keeping the opening 10a upward and such a position B that the opening 10a of the object 10 to be plated is kept lower than the bottom 10b thereof on the outside of the plating solution 14. The object 10 to be plated is plated while repeating the work of immersing the object 10 to be plated in the plating solution 14 and the work of discharging the plating solution in the object 10 to be plated.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够可靠地均匀地平板化薄，长，底部和圆筒体的内表面的电镀方法和电镀装置，以便为混合动力汽车提供电池罐其中在其细长的内表面以及其底表面的内表面上形成厚镀膜。解决方案：也用作阴极的保持工具13的一端插入到要从其开口10a的侧面进行电镀的物体10中，并与物体10的内表面接触电镀以保持要镀覆的物体10，并且保持工具13的另一端被支撑以自由旋转，以向保持工具13的一端进行旋转运动。被镀物体10在这样的位置之间往复运动 A，将要镀覆的物体10浸入电镀液14中，同时保持开口10a向上，并且将待镀物体10的开口10a保持低于其底部10b的位置B 镀覆对象物10，在重复将要镀覆的物体10浸渍在电镀液14中的工序以及将电镀液排出到被镀物体10中的工序的同时进行电镀。版权所有（C）2008，JPO＆INPIT

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