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1. 发明专利

JP2007318080A Flexible printed board 有权
标题翻译：柔性印刷板
公开(公告)号：JP2007318080A
公开(公告)日：2007-12-06
申请号：JP2007039495
申请日：2007-02-20
申请人： Fuchigami Micro:Kk , Innovation Ts Flex-Technology (M) Sdn Bhd , イノベーションティーエスフレックス−テクノロジー(エム)エスディーエヌ、ビーエイチディー , 株式会社渕上ミクロ
发明人： UEDA SUSUMU , ARIMURA SHUICHI
IPC分类号： H05K1/02 , H05K1/11
摘要： PROBLEM TO BE SOLVED: To provide a flexible printed board which can eliminate the need for forming through holes and ensure the strength required for mounting.
SOLUTION: An FPC 1 has a metal foil layer 4 formed only on one side of an insulating layer 2 via an adhesive layer 3. A surface of the metal foil layer 4 on the side to be brought into contact with the adhesive layer 3 is treated to roughen, so that irregularity is formed. The FPC 1 is configured such that the insulating layer 2 and the adhesive layer 3 are partially removed, and the surface of the metal foil layer 4 on the side from which the insulating layer 2 and the adhesive layer 3 have been removed is treated to be flatten. In a region A from which the insulating layer 2 and the adhesive layer 3 have been removed, an overcoat layer 5 for reinforcing the metal foil layer 4 is provided along the metal foil layer 4 on a side opposite to the surface-treated side. A drive IC 6a is mounted on a first metal foil surface 4a of the metal foil layer 4 and on a second metal foil surface 4b which is the flattened surface of the metal foil layer 4, and is provided with electrical conduction by the metal foil layer 4.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种柔性印刷板，其可以消除对形成通孔的需要并确保安装所需的强度。解决方案：FPC1具有通过粘合剂层3仅在绝缘层2的一侧形成的金属箔层4.金属箔层4的与粘合剂层接触的一侧的表面 3被处理粗糙，从而形成不规则。 FPC1被构造为使得绝缘层2和粘合剂层3被部分地去除，并且金属箔层4在绝缘层2和粘合剂层3被去除的一侧的表面被处理为扁平化。在去除了绝缘层2和粘合剂层3的区域A中，在金属箔层4的与表面处理侧相反的一侧设置用于加强金属箔层4的覆盖层5。驱动IC 6a安装在金属箔层4的第一金属箔表面4a和作为金属箔层4的平坦表面的第二金属箔表面4b上，并被金属箔层 4.版权所有（C）2008，JPO＆INPIT

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