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    • 3. 发明授权
    • Method of producing a radiation sensor
    • 辐射传感器的制造方法
    • US06372656B1
    • 2002-04-16
    • US09406272
    • 1999-09-24
    • Franz LaermerWilhelm Frey
    • Franz LaermerWilhelm Frey
    • H01L21302
    • G01J5/12H01L31/09
    • A method of producing an infrared sensor on a semiconductor substrate involves defining at least one area on the surface of the semiconductor substrate where a recess is to be created in the semiconductor substrate, depositing a membrane on the surface, applying a radiation absorber to the membrane in the defined area, applying thermoelements with a hot contact in thermal contact with the radiation absorber and a cold contact in thermal contact with the semiconductor substrate. In this method, an opening is provided in the membrane in the defined area, and the semiconductor substrate is etched through the opening.
    • 在半导体衬底上制造红外传感器的方法包括:在半导体衬底的表面上形成至少一个区域,在半导体衬底的表面上形成凹槽,在半导体衬底中形成凹槽,在表面上沉积膜,向膜上施加辐射吸收体 在限定的区域中,将具有与辐射吸收体热接触的热接触件的热电偶和与半导体衬底热接触的冷接触件加热。 在该方法中,在限定区域中的膜中设置开口,并且通过开口蚀刻半导体衬底。
    • 6. 发明授权
    • Method for producing integrated microsystems
    • 集成微系统的制作方法
    • US06960536B2
    • 2005-11-01
    • US10613459
    • 2003-07-03
    • Wilhelm FreyFranz LaermerChristoph Duenn
    • Wilhelm FreyFranz LaermerChristoph Duenn
    • B81C1/00C23F1/14H01L21/306H01L21/461
    • B81C1/00571B81C1/00595B81C2201/0133B81C2201/016B81C2203/0735C23F1/14H01L21/30604
    • A method for producing a microsystem that has, situated on a substrate, a first functional layer that includes a conductive area and a sublayer. Situated on the first functional layer is a second mechanical functional layer, which is first initially applied onto a sacrificial layer situated and structured on the first functional layer. In addition, a layer is situated on the side of the sublayer facing away from the conductive area. The layer constitutes a protective layer on the first functional layer that acts in areas during a sacrificial layer etching process so that during removal of the sacrificial layer no etching of the areas of the first functional layer covered by the protective layer occurs, and that in the region of the areas of the first functional layer implemented without the protective layer the sublayer is removed essentially selectively to the conductive area at the same time as the sacrificial layer. Further, a method is described for producing integrated microsystems having silicon-germanium functional layers, sacrificial layers containing germanium, and open metal surfaces. The sacrificial layers containing germanium are at least partially removed in an etching solution, a pH value of the etching solution being kept at least approximately neutral during the etching procedure using a buffer.
    • 一种微系统的制造方法,其具有位于基板上的包括导电区域和子层的第一功能层。 位于第一功能层上的是第二机械功能层,其首先被初始施加到位于第一功能层上并构成的牺牲层上。 此外,层位于子层背离导电区域的一侧。 该层在第一功能层上构成保护层,其在牺牲层蚀刻工艺期间在区域中起作用,使得在去除牺牲层期间不会发生由保护层覆盖的第一功能层的区域的蚀刻, 在没有保护层的情况下实现的第一功能层的区域的区域在与牺牲层同时基本上选择性地去除导电区域。 此外,描述了一种用于制造具有硅 - 锗功能层,包含锗的牺牲层和开放金属表面的集成微系统的方法。 在蚀刻溶液中至少部分地除去含有锗的牺牲层,在使用缓冲液的蚀刻过程中,蚀刻溶液的pH值保持至少大致为中性。
    • 7. 发明授权
    • Electrochemical etching cell
    • 电化学蚀刻池
    • US06726815B1
    • 2004-04-27
    • US09937926
    • 2001-12-26
    • Hans ArtmannWilhelm FreyFranz Laermer
    • Hans ArtmannWilhelm FreyFranz Laermer
    • C25B900
    • C25F7/00Y10S204/12
    • An electrochemical etching cell (1) is proposed for etching an etching body (15) made at least superficially of an etching material. The etching cell (1) has at least one chamber filled with an electrolyte, and is provided with a first electrode (13), which at least superficially has a first electrode material, and with a second electrode (13′) which at least superficially has a second electrode material. Furthermore, the etching body (15) is in contact, at least region-wise, with the electrolyte. In this context, the first electrode material and the second electrode material are selected such that, after the etching, the etching body (15) is not contaminated and/or is not impaired in its properties by the electrode materials. In particular, the electrode materials are the same materials as the etching material. Also proposed is a method for etching an etching body (15) using this etching cell (1), the first and/or the second electrode (13, 13′) being used as a sacrificial electrode. The proposed etching cell is particularly suitable for etching silicon wafers in a CMOS-compatible production line.
    • 提出一种用于蚀刻蚀刻材料至少表面蚀刻的蚀刻体(15)的电化学蚀刻单元(1)。 蚀刻单元(1)具有填充有电解质的至少一个室,并且设置有至少表面具有第一电极材料的第一电极(13)和至少表面上的第二电极(13') 具有第二电极材料。 此外,蚀刻体(15)至少在区域上与电解质接触。 在这种情况下,选择第一电极材料和第二电极材料,使得在蚀刻之后,蚀刻体(15)不被电极材料污染和/或不损害其性能。 特别地,电极材料与蚀刻材料相同。 还提出了使用该蚀刻单元(1)蚀刻蚀刻体(15)的方法,第一和/或第二电极(13,13')用作牺牲电极。 所提出的蚀刻单元特别适用于在CMOS兼容的生产线中蚀刻硅晶片。
    • 8. 发明授权
    • Method and device for epitaxial deposition of atoms or molecules from a reactive gas on a deposition surface of a substrate
    • 用于从基底的沉积表面上的反应性气体外延沉积原子或分子的方法和装置
    • US06592664B1
    • 2003-07-15
    • US09656546
    • 2000-09-06
    • Wilhelm FreyFranz LaermerKlaus Heyers
    • Wilhelm FreyFranz LaermerKlaus Heyers
    • C30B2508
    • C30B25/105Y10T117/10
    • A method for epitaxial deposition of atoms or molecules from a reactive gas on a deposition surface of a substrate is described. The method includes the following steps: a first amount of energy is supplied by heating at least the deposition surface; and an ionized inert gas is conducted, at least from time to time, onto the deposition surface in order to supply, at least from time to time, a second amount of energy through the effect of ions of the ionized inert gas on the deposition surface. The first amount of energy is less than the energy amount necessary for the epitaxial deposition of atoms or molecules of the reactive gas on the deposition surface. A sum of the first energy amount and the second energy equaling, at least from time to time, a total amount of energy that is sufficient for the epitaxial deposition of atoms or molecules of the reactive gas onto the deposition surface.
    • 描述了从衬底的沉积表面上的反应性气体外延沉积原子或分子的方法。 该方法包括以下步骤:通过至少加热沉积表面来提供第一量的能量; 并且电离惰性气体至少不时地进行到沉积表面上,以便至少通过电离惰性气体的离子在沉积表面上的时间来供应第二量的能量。 第一量的能量小于沉积表面上的反应气体的原子或分子的外延沉积所需的能量。 至少不时地使第一能量和第二能量的总和等于足以将反应气体的原子或分子外延沉积到沉积表面上的能量的总量。
    • 10. 发明授权
    • Method of producing optical waveguides
    • 制造光波导的方法
    • US06174746B1
    • 2001-01-16
    • US09209941
    • 1998-12-11
    • Manfred MoellendorfFranz LaermerWilhelm Frey
    • Manfred MoellendorfFranz LaermerWilhelm Frey
    • H01L2100
    • G02B6/1345
    • A method of producing an optical waveguide, in which a substrate of silicon is etched porously to a defined depth by anodic oxidation in an electrolyte containing hydrofluoric acid. The etched substrate is doped in a suitable dopant liquid containing cations. The doped layer of porous silicon is stabilized at an elevated temperature, and the stabilized layer is oxidized with a further increase in temperature. The oxidized porous layer is made to collapse at a temperature sufficient for partial melting. The surface of the collapsed silicon dioxide layer is covered in a pattern by a lithographic technique, and the cations are replaced by silver ions in the uncovered areas of the surface by bringing the surface in contact with a solution containing silver ions or silver complex ions.
    • 一种制造光波导的方法,其中通过在含有氢氟酸的电解质中通过阳极氧化将硅基底蚀刻到限定的深度。 蚀刻的衬底被掺杂在含有阳离子的合适的掺杂剂液体中。 多孔硅的掺杂层在升高的温度下稳定,并且稳定层随着温度的进一步升高而被氧化。 使氧化的多孔层在足以部分熔融的温度下塌陷。 塌陷的二氧化硅层的表面通过光刻技术被覆盖在图案中,并且通过使表面与含有银离子或银络离子的溶液接触,阳离子被表面的未覆盖区域中的银离子所取代。