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    • 1. 发明授权
    • Micromachining using high energy light ions
    • 微加工使用高能轻离子
    • US06455233B1
    • 2002-09-24
    • US09297577
    • 1999-07-06
    • Frank WattStuart Victor SpringhamThomas OsipowiczMark Breese
    • Frank WattStuart Victor SpringhamThomas OsipowiczMark Breese
    • G03F720
    • G03F7/2065H01J2237/31755
    • Structures of microminiature dimensions are formed by scanning a nearly parallel beam of high energy light ions across the surface of a resist material such as PMMA in a predetermined pattern. The resulting chemical changes in the exposed resist material allows a chemical developer to remove the exposed material while leaving the unexposed material substantially unaffected. In addition because the ions have a well defined range in the material depending on their energy, the resist can be exposed to a predetermined well defined depth. By this method, resist structures of three dimensional complexity can be micromachined. This is achieved by simultaneously scanning the beam and orienting the resist layer in a controlled manner. Further enhancement may be achieved by the use of multiple deposition and exposure of resist layers. These resist microstructures may be further utilized to produce microstructures in other materials by the application of processes such as electroplating and micromoulding.
    • 通过以预定图案扫描几乎平行的高能轻离子束穿过诸如PMMA的抗蚀剂材料的表面而形成微尺寸尺寸的结构。 暴露的抗蚀剂材料的所得化学变化允许化学显影剂除去暴露的材料,同时使未曝光的材料基本上不受影响。 此外,由于离子根据其能量在材料中具有良好限定的范围,所以抗蚀剂可以暴露于预定的良好限定的深度。 通过这种方法,三维复杂度的抗蚀结构可以被微加工。 这通过同时扫描光束并以受控的方式定向抗蚀剂层来实现。 可以通过使用多次沉积和抗蚀剂层的曝光来实现进一步的增强。 这些抗蚀剂微结构可以进一步用于通过应用诸如电镀和微成型的工艺在其它材料中产生微结构。