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    • 3. 发明授权
    • Single feature size MOS technology power device
    • 单功能尺寸MOS技术电源设备
    • US06468866B2
    • 2002-10-22
    • US09427237
    • 1999-10-26
    • Ferruccio FrisinaAngelo MagriGiuseppe FerlaRichard A. Blanchard
    • Ferruccio FrisinaAngelo MagriGiuseppe FerlaRichard A. Blanchard
    • H01L21336
    • H01L29/7802H01L29/0696H01L29/0847H01L29/0869H01L29/1095H01L29/66333
    • A MOS technology power device comprises a semiconductor material layer of a first conductivity type, a conductive insulated gate layer covering the semiconductor material layer, and a plurality of elementary functional units. The conductive insulated gate layer includes a first insulating material layer placed above the semiconductor material layer, a conductive material layer placed above the first insulating material layer, and a second insulating material layer placed above the conductive material layer. Each elementary functional unit includes an elongated body region of a second conductivity type formed in the semiconductor material layer. Each elementary functional unit further includes an elongated window in the insulated gate layer extending above the elongated body region. Each elongated body region includes a source region doped with dopants of the first conductivity type, intercalated with a portion of the elongated body region wherein no dopant of the first conductivity type are provided. The MOS technology power device further includes a plurality of insulating material sidewall spacers disposed above the semiconductor material layer along elongated edges of each elongated window to seal the edges of each elongated window in the insulated gate layer from a source metal layer disposed over the insulated gate layer and the semiconductor material layer. The source metal layer contacts each body region and each source region through each elongated window along the length of the elongated body region.
    • MOS技术功率器件包括第一导电类型的半导体材料层,覆盖半导体材料层的导电绝缘栅极层和多个基本功能单元。 导电绝缘栅层包括置于半导体材料层上方的第一绝缘材料层,位于第一绝缘材料层上方的导电材料层和置于导电材料层上方的第二绝缘材料层。 每个基本功能单元包括形成在半导体材料层中的第二导电类型的细长体区域。 每个基本功能单元还包括在细长体区域上方延伸的绝缘栅极层中的细长窗口。 每个细长体区域包括掺杂有第一导电类型的掺杂剂的源区,插入有细长体区的一部分,其中不提供第一导电类型的掺杂剂。 MOS技术功率器件还包括多个绝缘材料侧壁间隔物,其沿着每个细长窗口的细长边缘设置在半导体材料层之上,以密封绝缘栅极层中每个细长窗口的边缘与设置在绝缘栅极上的源极金属层 层和半导体材料层。 源极金属层沿着细长主体区域的长度通过每个细长窗口接触每个体区域和每个源极区域。
    • 6. 发明授权
    • Process of making a MOS-technology power device
    • 制造MOS技术电源设备的过程
    • US5817546A
    • 1998-10-06
    • US576989
    • 1995-12-19
    • Giuseppe FerlaFerruccio Frisina
    • Giuseppe FerlaFerruccio Frisina
    • H01L21/336H01L29/10H01L21/332
    • H01L29/66712H01L29/1095Y10S148/126
    • A process forms a MOS-technology power device including a semiconductor material layer of a first conductivity type and a body region disposed therein. The body region includes a heavily doped region of a second conductivity type, a lightly doped region of the second conductivity type and a heavily doped region of the first conductivity type. The process includes forming an insulated gate layer on portions of the surface of the semiconductor material layer to leave selected portions of the semiconductor material layer exposed. A dopant of the second conductivity type is implanted twice at different concentrations and energies into the selected regions of the semiconductor material layer. The implanted ions are thermally diffused to form body regions, each body region including a heavily doped region substantially aligned with the edges of the insulated gate layer, and a lightly doped region formed by lateral diffusion of the first dopant under the insulated gate layer. A dopant of the first conductivity type is then implanted into the heavily doped regions to form source regions substantially aligned with the edges of the insulated gate layer.
    • 一种工艺形成包括第一导电类型的半导体材料层和设置在其中的体区的MOS技术功率器件。 身体区域包括第二导电类型的重掺杂区域,第二导电类型的轻掺杂区域和第一导电类型的重掺杂区域。 该方法包括在半导体材料层的表面的部分上形成绝缘栅极层,以使半导体材料层的选定部分露出。 将第二导电类型的掺杂剂以不同的浓度和能量注入到半导体材料层的选定区域中两次。 注入的离子热扩散以形成体区,每个体区包括基本上与绝缘栅层的边缘对准的重掺杂区,以及通过第一掺杂剂在绝缘栅层下方的横向扩散形成的轻掺杂区。 然后将第一导电类型的掺杂剂注入到重掺杂区域中以形成与绝缘栅极层的边缘基本对准的源极区域。
    • 10. 发明授权
    • Gate insulating structure for power devices, and related manufacturing process
    • 功率器件门绝缘结构及相关制造工艺
    • US06756259B2
    • 2004-06-29
    • US10061606
    • 2002-02-01
    • Ferruccio FrisinaGiuseppe Ferla
    • Ferruccio FrisinaGiuseppe Ferla
    • H01L218238
    • H01L29/7802G11C29/14G11C29/50G11C2029/0403H01L21/76202H01L21/8238H01L29/6656H01L29/66712
    • Semiconductor power device including a semiconductor layer of a first type of conductivity, wherein a body region of a second type of conductivity including source regions of the first type of conductivity is formed, a gate oxide layer superimposed to the semiconductor layer with an opening over the body region, polysilicon regions superimposed to the gate oxide layer, and regions of a first insulating material superimposed to the polysilicon regions. The device includes regions of a second insulating material situated on a side of both the polysilicon regions and the regions of a first insulating material and over zones of the gate oxide layer situated near the opening on the body region, oxide regions interposed between the polysilicon regions and the regions of a second insulating material, oxide spacers superimposed to the regions of a second insulating material.
    • 半导体功率器件包括第一导电类型的半导体层,其中形成包括第一导电类型的源极区的第二导电类型的体区,与半导体层重叠的栅极氧化层, 主体区域,叠加到栅极氧化物层的多晶硅区域和叠加到多晶硅区域的第一绝缘材料的区域。 该器件包括位于两个多晶硅区域和第一绝缘材料的区域的一侧上的第二绝缘材料的区域,以及位于主体区域上的开口附近的栅极氧化物层的区域,位于多晶硅区域之间的氧化物区域 以及第二绝缘材料的区域,叠加到第二绝缘材料的区域的氧化物间隔物。