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    • 4. 发明授权
    • Silicon chip with an integrated magnetoresistive head mounted on a slider
    • 具有安装在滑块上的集成磁阻头的硅芯片
    • US5587857A
    • 1996-12-24
    • US324841
    • 1994-10-18
    • Steven H. VoldmanAlbert J. WallashReginald B. Wilcox, Jr.
    • Steven H. VoldmanAlbert J. WallashReginald B. Wilcox, Jr.
    • G11B5/39G11B5/31G11B5/40G11B5/48G11B33/12G11B21/21
    • G11B5/40G11B5/3106G11B33/12G11B5/3967G11B5/4806Y10T29/49034Y10T29/49041
    • An MR head has its MR stripe protected from electro-static discharge (ESD) on a slider, such as titanium carbide. The MR stripe is protected by a plurality of silicon integrated circuit devices which conduct ESD-induced current from the MR stripe to a silicon chip substrate ground potential or to larger components in the MR head such as the first and second shield layers and the coil layer. In a preferred embodiment the integrated circuit devices and interconnects are constructed in a single crystal silicon chip. The silicon chip is fixedly mounted to a trailing edge of the slider and the MR head is mounted on a trailing edge of the silicon chip adjacent the integrated circuit devices. The invention includes a method of mass producing sliders by combining thin film technology for making MR heads with integrated circuit technology for making integrated circuit devices. These technologies are combined at the wafer level to ultimate completion of individual sliders. At the wafer level a silicon wafer, which contains the integrated circuit devices, is fixedly mounted to a wafer of slider material, such as titanium carbide. A plurality of rows and columns of MR heads are constructed on the silicon wafer adjacent the integrated circuit devices. The composite wafer is then diced into quadrants wherein each quadrant contains rows and columns of sliders with MR heads. Each quadrant is then diced into rows. Each row is then diced into individual sliders, each slider carrying an MR head which is ESD protected.
    • MR磁头具有防止静电放电(ESD)的MR条纹,例如碳化钛。 MR条纹由多个硅集成电路器件保护,这些硅集成电路器件将从MR条纹到ESD芯片衬底接地电位的ESD感应电流或MR头中的较大部件(例如第一和第二屏蔽层)以及线圈层 。 在优选实施例中,集成电路器件和互连构造在单晶硅芯片中。 硅芯片固定地安装在滑块的后缘,并且MR磁头安装在硅芯片的与集成电路器件相邻的后缘。 本发明包括通过将用于制造MR磁头的薄膜技术与用于制造集成电路器件的集成电路技术结合在一起来批量生产滑块的方法。 这些技术在晶圆级别结合到最终完成各个滑块。 在晶片级,包含集成电路器件的硅晶片固定地安装在诸如碳化钛的滑块材料的晶片上。 在与集成电路器件相邻的硅晶片上构造多个行和列MR磁头。 然后将复合晶片切割成象限,其中每个象限包含具有MR磁头的行和列的滑块。 然后将每个象限切成行。 然后将每一行切成单独的滑块,每个滑块承载ESD保护的MR头。
    • 10. 发明授权
    • Disk drive flex cable with ESD contact pad
    • 带ESD接触垫的磁盘驱动器柔性电缆
    • US07505229B1
    • 2009-03-17
    • US11031326
    • 2005-01-07
    • Albert J. Wallash
    • Albert J. Wallash
    • G11B5/48G11B21/16H01H3/00
    • G11B5/4846G11B5/40G11B5/455G11B33/1493
    • A disk drive electrical interconnect includes one or more electrical contacts for providing a controlled discharge form a disk drive head in a manner that reduces the potential for damaging the head in preparation for testing or the like. In some embodiments the electrical interconnect includes a charge dissipation electrical contact that is interconnected with a read element of the head using an electrical trace. A resistor is disposed in series between the charge dissipation electrical contact and the read element. A probe may engage the charge dissipation electrical contact to remove the electrical charge from the read element at a desired rate because of the resistor. Once the electrical charge has been sufficiently dissipated, another probe may engage another contact of the electrical interconnect to provide a desired electrical signal to the head.
    • 磁盘驱动器电互连包括一个或多个电触头,用于以减少在准备测试等方面损坏磁头的可能性的方式提供盘驱动头的受控放电形式。 在一些实施例中,电互连包括电荷耗散电接触,其使用电迹线与头部的读取元件互连。 在电荷耗散电接触和读取元件之间串联设置电阻器。 由于电阻器,探针可以接合电荷耗散电接触以以期望的速率从读取元件去除电荷。 一旦电荷充分消散,另一个探针可以与电互连的另一个接触件接合,以向头部提供所需的电信号。