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1. 发明申请

WO2004044965A3 METHOD OF PRODUCING SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：WO2004044965A3
公开(公告)日：2004-05-27
申请号：PCT/JP2003/014123
申请日：2003-11-05
申请人： FUJITSU LIMITED , MARUYAMA, Kenji , KURASAWA, Masaki , KONDO, Masao , ARIMOTO, Yoshihiro
发明人： MARUYAMA, Kenji , KURASAWA, Masaki , KONDO, Masao , ARIMOTO, Yoshihiro
IPC分类号： H01L21/02
摘要： ABSTRACT A semiconductor device incorporating a capacitor structure that includes a ferroelectric thin film is obtained by forming, on a single crystalline substrate 10 having a surface suited for growing thereon a thin film layer of ferroelectric single crystal having a plane (111), a ferroelectric single crystalline thin film 12' containing Pb and having a plane (111) in parallel with the surface of the substrate (or a ferroelectric polycrystalline thin film containing Pb and oriented parallel with the plane (111) in parallel with the surface of the substrate) and part 16 of a circuit of a semiconductor device, to thereby fabricate the single crystalline substrate 10 having said ferroelectric thin film containing Pb and said part of the circuit of the semiconductor device; and bonding said single crystalline substrate 10 to another substrate on which the other circuit of the semiconductor device has been formed in advance, to couple the two circuits together. The capacitor in the semiconductor device thus obtained includes a ferroelectric thin film having a large amount of polarizing charge. The semiconductor device can be used as a highly reliable nonvolatile memory.

2. 发明授权

EP2833239B1 MODULAR DATA CENTER AND CONTROL METHOD THEREFOR 有权
公开(公告)号：EP2833239B1
公开(公告)日：2019-02-20
申请号：EP12873472.0
申请日：2012-03-29
申请人： FUJITSU LIMITED
发明人： KONDO, Masao , ENDO, Hiroshi , UMEMIYA, Shigeyoshi , ARIOKA, Takahiro , FUKUDA, Hiroyuki
IPC分类号： G06F1/20 , F24F3/14 , H05K7/20 , H05K7/14

3. 发明公开

EP2833239A1 MODULAR DATA CENTER AND CONTROL METHOD THEREFOR 有权
标题翻译：模块化数据中心及其控制方法
公开(公告)号：EP2833239A1
公开(公告)日：2015-02-04
申请号：EP12873472.0
申请日：2012-03-29
申请人： FUJITSU LIMITED
发明人： KONDO, Masao , ENDO, Hiroshi , UMEMIYA, Shigeyoshi , ARIOKA, Takahiro , FUKUDA, Hiroyuki
IPC分类号： G06F1/20 , F24F3/14 , F24F11/02 , H05K7/20
CPC分类号： H05K7/20736 , C09K5/041 , G06F1/20 , H05K7/1497 , H05K7/20745 , H05K7/20836
摘要： [Objective] To provide a module-type data center and a method of controlling the same, which increase the air-conditioning efficiency of the data center.
[Solving Means] Provided is a module-type data center including: a casing 21 including a first intake opening 21a, a second intake opening 21b, and an exhaust opening 21c; an air conditioner 31 provided in the casing 21 and configured to generate a first airflow B1 by taking in outside air A through the first intake opening 21a and bringing the outside air A into direct contact with a refrigerant W; a fan unit 38 provided in the casing 21 and configured to generate a second airflow B2 by taking in the outside air A through the second intake opening 21b; and an electronic device 44 provided in the casing 21 and configured to be air-cooled by a mixed airflow C of the first airflow B1 and the second airflow B1 and release an exhaust airflow E after the air-cooling to the exhaust opening 21c. The first intake opening 21a and the second intake opening 21b are provided on different surfaces 21x, 21y of the casing 21.
摘要翻译：【目的】提供一种模块式数据中心及其控制方法，提高数据中心的空调效率。 [解决方案]提供了一种模块型数据中心，包括：外壳21，其包括第一进气口21a，第二进气口21b和排气口21c; 空调31，其设置在壳体21内，并且构造成通过经由第一进气开口21a吸入外部空气A并使外部空气A与制冷剂W直接接触而产生第一气流B1; 风扇单元38，其设置在壳体21内，并且构造成通过经由第二进气开口21b吸入外部空气A来产生第二气流B2; 以及电子设备44，其设置在壳体21内，并被构造成通过第一气流B1和第二气流B1的混合气流C进行空气冷却，并将空气冷却后的排气气流E释放到排气开口21c。第一进气口21a和第二进气口21b设置在壳体21的不同表面21x，21y上。

4. 发明公开

EP2833237A1 MODULAR DATACENTER AND METHOD FOR CONTROLLING SAME 审中-公开
标题翻译： VERFAHREN ZUR STEUERUNG DAVON的MODULARES DATENCENTER
公开(公告)号：EP2833237A1
公开(公告)日：2015-02-04
申请号：EP12872623.9
申请日：2012-03-29
申请人： Fujitsu Limited
发明人： FUKUDA, Hiroyuki , ENDO, Hiroshi , OGAWA, Masatoshi , UMEMIYA, Shigeyoshi , KONDO, Masao
IPC分类号： G06F1/20 , F24F3/14 , F24F11/02 , H05K7/20
CPC分类号： H05K7/20736 , F24F2011/0006 , G06F1/20 , G06F2200/201 , H05K7/20745 , H05K7/20818 , H05K7/20836
摘要： [Objective] To provide a module-type data center and a method of controlling the same, which increase the air-conditioning efficiency of the data center.
[Solving Means] Provided is a module-type data center including: a casing 21 including a first intake opening 21a, a second intake opening 21b, and an exhaust opening 21c; an air conditioner 31 provided in the casing 21 and configured to generate a first airflow B1 by taking in outside air A through the first intake opening 21a and bringing the outside air A into direct contact with a refrigerant W; a fan unit 38 provided in the casing 21 and configured to generate a second airflow B2 by taking in the outside air A through the second intake opening 21b; and an electronic device 44 provided in the casing 21 and configured to be exposed to a mixed airflow C of the first airflow B1 and the second airflow B1 and release an exhaust airflow E containing the mixed airflow C to the exhaust opening 21c. The first intake opening 21a and the second intake opening 21b are provided on the same surface 21y of the casing 21.
摘要翻译： [目的]提供一种模块式数据中心及其控制方法，提高数据中心的空调效率。 [解决方案]提供一种模块型数据中心，包括：壳体21，包括第一进气开口21a，第二进气开口21b和排气开口21c; 设置在壳体21中并构造成通过从第一吸入口21a吸入外部空气A并使外部空气A与制冷剂W直接接触而产生第一气流B1的空调装置31; 风扇单元38，其设置在壳体21中，并且被构造成通过从第二吸入口21b吸入外部空气A而产生第二气流B2; 以及设置在壳体21中并且被配置为暴露于第一气流B1和第二气流B1的混合气流C并将包含混合气流C的排气气流E释放到排气口21c的电子设备44。第一吸入口21a和第二吸入口21b设置在壳体21的同一面21y上。

5. 发明授权

EP2787801B1 RACK FOR ELECTRONIC EQUIPMENT, AND INFORMATION PROCESSING DEVICE 有权
标题翻译： GESTELLFÜRELEKTRONISCHE VORRICHTUNG UND INFORMATIONSVERARBEITUNGSVORRICHTUNG
公开(公告)号：EP2787801B1
公开(公告)日：2017-04-12
申请号：EP11876495.0
申请日：2011-12-01
申请人： Fujitsu Limited
发明人： KONDO, Masao , FUKUDA, Hiroyuki , UMEMIYA, Shigeyoshi , ENDO, Hiroshi
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20736 , G06F1/206 , G06F2200/201 , H05K7/20818 , H05K7/20836 , Y02D10/16
摘要： [Problem] To provide an electronic device rack and an information processing apparatus capable of efficiently cooling electronic devices even when the amount of heat generated per rack reaches 30 kW or larger. [Solving Means] An electronic device rack 10 includes a plurality of panels 10a, 10b, 10c, ... surrounding a first space. Moreover, the electronic device rack 10 includes: an electronic-device housing unit 11 disposed in the first space and configured to house electronic devices 15; a heat exchanger 12 disposed in the first space at a position away from the electronic-device housing unit 11; a second space 21 provided between the electronic-device housing unit 11 and the heat exchanger 12 and isolated from the rest of the first space; and an air blower 13 configured to circulate air inside the first space through the electronic-device housing unit 11, the second space 21, and the heat exchanger 12 in the described order.
摘要翻译： [问题]即使当每个机架产生的热量达到30kW或更大时，提供一种能够有效地冷却电子设备的电子设备机架和信息处理设备。电子装置架10包括围绕第一空间的多个面板10a，10b，10c，...。此外，电子设备机架10包括：电子设备容纳单元11，其设置在第一空间中并构造成容纳电子设备15; 设置在远离电子设备壳体单元11的位置处的第一空间中的热交换器12; 设置在电子设备容纳单元11和热交换器12之间并与第一空间的其余部分隔离的第二空间21; 以及鼓风机13，其构造成以所述顺序通过电子设备容纳单元11，第二空间21和热交换器12使第一空间内的空气循环。

6. 发明公开

EP2835715A1 MODULE-TYPE DATA CENTER 审中-公开
标题翻译：模块型数据中心
公开(公告)号：EP2835715A1
公开(公告)日：2015-02-11
申请号：EP12873691.5
申请日：2012-04-02
申请人： Fujitsu Limited
发明人： ENDO, Hiroshi , KONDO, Masao , FUKUDA, Hiroyuki , OGAWA, Masatoshi
IPC分类号： G06F1/20 , F24F3/14 , F24F11/02 , H05K7/20
CPC分类号： H05K7/20836 , F24F2001/0048 , G06F1/206 , H05K7/1497 , H05K7/20736 , H05K7/20745 , Y02D10/16
摘要： [Objective] To provide a module-type data center capable of precisely controlling the circulation amount of warm air.
[Solving Means] A module-type data center includes: a casing 30 having an intake vent 31a and an exhaust vent 31b; a rack 33 accommodating an electronic device 33a; and an air blower 32 configured to introduce outside air into the casing 30 through the intake vent 31a and pass air through the rack 33 from one of surfaces of the rack 33 to another one of the surfaces of the rack 33. Moreover, a shielding-slat unit 36 is placed on the exhaust vent 31b side. The shielding-slat unit 36 includes shielding slats 51 configured to change between an open state and a closed state and drive devices configured to drive the corresponding shielding slats. An inner space of the casing 30 is divided into a first space 41, 42 defined between the rack 33 and the intake vent 31a, a second space 43 defined between the rack 33 and the exhaust vent 31b, and a third space 44 defined above the rack 33 and allowing the second space 43 to communicate with the first space 41, 42.
摘要翻译： [目的]提供一种能够精确控制暖风循环量的模块式数据中心。 [解决方案]模块型数据中心包括：壳体30，其具有进气口31a和排气口31b; 容纳电子装置33a的机架33; 以及鼓风机32，该鼓风机32构造成通过进气口31a将外部空气引入到壳体30中并且使空气从齿条33的一个表面穿过齿条33到另一个齿条33的表面。此外，板条单元36放置在排气口31b侧。屏蔽板单元36包括构造成在打开状态和闭合状态之间变换的屏蔽板条51以及构造成驱动相应屏蔽板条的驱动装置。壳体30的内部空间被划分成限定在齿条33和进气口31a之间的第一空间41,42，限定在齿条33和排气口31b之间的第二空间43以及限定在齿条33和排气口31b之上的第三空间44。使第二空间43与第一空间41,42连通。

7. 发明授权

EP2894524B1 TEMPERATURE ADMINISTRATION SYSTEM 有权
公开(公告)号：EP2894524B1
公开(公告)日：2020-01-15
申请号：EP12884059.2
申请日：2012-09-04
申请人： Fujitsu Limited
发明人： OGAWA, Masatoshi , ENDO, Hiroshi , FUKUDA, Hiroyuki , KONDO, Masao
IPC分类号： H05K7/20 , G05B11/42 , G06F1/20

8. 发明授权

EP2977852B1 TEMPERATURE MANAGEMENT SYSTEM 有权
公开(公告)号：EP2977852B1
公开(公告)日：2019-03-13
申请号：EP13878781.7
申请日：2013-03-18
申请人： Fujitsu Limited
发明人： OGAWA, Masatoshi , ENDO, Hiroshi , FUKUDA, Hiroyuki , KONDO, Masao
IPC分类号： G06F1/20 , F24F7/06 , H01L23/467 , H05K7/20 , G05D23/19

9. 发明公开

EP2977852A1 TEMPERATURE MANAGEMENT SYSTEM 有权
标题翻译： TEMPERATURREGELUNGSSYSTEM
公开(公告)号：EP2977852A1
公开(公告)日：2016-01-27
申请号：EP13878781.7
申请日：2013-03-18
申请人： Fujitsu Limited
发明人： OGAWA, Masatoshi , ENDO, Hiroshi , FUKUDA, Hiroyuki , KONDO, Masao
IPC分类号： G06F1/20 , F24F7/06 , H01L23/467 , H05K7/20
CPC分类号： G06F1/206 , G05B15/02 , G05D23/1931 , G06F1/325 , H01L23/34 , H01L23/467 , H01L2924/0002 , H05K7/20745 , H05K7/20836 , Y02D10/16 , H01L2924/00
摘要： [Problem]
To provide a temperature management system that is capable of achieving much more power saving than a conventional system by predicting a change of the ambient temperature and a change of the operational state of a heat generation component to properly control a cooling apparatus.
[Solution]
The temperature management system includes: a first temperature detection unit 32 configured to detect a temperature of a heat generation component 14a in an electronic device 14; a cooling apparatus 12 configured to circulate air in the electronic device 14 and to cool the heat generation component 14a; a second temperature detection unit 33 configured to detect a temperature of air flowing in the electronic device 14; a parameter setting unit 31 configured to set a target value of the temperature of the heat generation component 14a; and a control unit 30. The control unit 30 calculates a predicted value of a future temperature of the heat generation component 14a based on the outputs of the first temperature detection unit 32 and the second temperature detection unit 33, and the power consumption of the electronic device 14, and determines a manipulated variable of the cooling apparatus 12 based on the predicted value and the target value.
摘要翻译： [问题]提供一种温度管理系统，其能够通过预测环境温度的变化和发热部件的操作状态的变化来实现比常规系统更多的功率节省，以适当地控制冷却装置。 [解决方案]温度管理系统包括：第一温度检测单元32，被配置为检测电子设备14中的发热部件14a的温度; 配置为使电子设备14中的空气循环并冷却发热部件14a的冷却装置12; 被配置为检测在电子设备14中流动的空气的温度的第二温度检测单元33; 被配置为设定发热部件14a的温度的目标值的参数设定部31; 和控制单元30.控制单元30基于第一温度检测单元32和第二温度检测单元33的输出来计算发热部件14a的未来温度的预测值，以及电子装置14，并基于预测值和目标值确定冷却装置12的操纵变量。

10. 发明公开

EP2894524A1 TEMPERATURE ADMINISTRATION SYSTEM 有权
标题翻译： TEMPERATURVERWALTUNGSSYSTEM
公开(公告)号：EP2894524A1
公开(公告)日：2015-07-15
申请号：EP12884059.2
申请日：2012-09-04
申请人： Fujitsu Limited
发明人： OGAWA, Masatoshi , ENDO, Hiroshi , FUKUDA, Hiroyuki , KONDO, Masao
IPC分类号： G05B11/42 , F24F11/02 , F24F11/04 , G06F1/20 , H05K7/20
CPC分类号： G06F1/206 , G01K13/02 , G06F11/3051 , H05K7/20136 , H05K7/207 , H05K7/20836 , Y02D10/16
摘要： [Problem]
There is provided a temperature management system capable of suppressing deterioration in control performance attributed to reset windup, and efficiently cooling an electronic device such as a computer.
[Solution]
A temperature management system includes: temperature detection units (32) which individually detect temperatures of a plurality of electronic devices each changing an amount of heat generation depending on its operational state; a cooling device (12) which cools the electronic devices; and a control unit (30) which controls the cooling device (12) depending on outputs from the temperature detection units (32). The control unit (30) includes: an idle state determination unit (44) which determines whether or not the electronic devices are in an idle state; a manipulated variable calculation unit (40) which has an integrator (50) and calculates a manipulated variable by using a difference between a target value and a controlled variable; and an accumulation value correction unit (45) which corrects an accumulation value of the integrator (50) with a predetermined value when the idle state determination unit (44) determines that the electronic devices are in the idle state.
摘要翻译： [问题]提供了一种温度管理系统，其能够抑制归因于复位结束的控制性能的劣化，并且有效地冷却诸如计算机的电子设备。 [解决方案]温度管理系统包括：温度检测单元（32），其单独地检测根据其操作状态改变发热量的多个电子设备的温度; 冷却装置（12），其冷却电子装置; 以及根据来自温度检测单元（32）的输出来控制冷却装置（12）的控制单元（30）。控制单元（30）包括：空闲状态确定单元（44），确定电子设备是否处于空闲状态; 具有积分器（50）并通过使用目标值和受控变量之间的差来计算操作变量的操作变量计算单元（40）以及当空闲状态确定单元（44）确定电子设备处于空闲状态时，以预定值校正积分器（50）的累积值的累加值校正单元（45）。

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