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1. 发明专利

JPH11233291A PLASMA PROCESSING DEVICE 失效
公开(公告)号：JPH11233291A
公开(公告)日：1999-08-27
申请号：JP3518998
申请日：1998-02-17
申请人： FRON TEC KK , ULVAC CORP
发明人： FUKUDA KOICHI , KIN SEITETSU , NAKANO AKIRA , ISHIKAWA MICHIO , HASHIMOTO YUKINORI , MORI KATSUHIKO , KUROKAWA KUNIAKI , ARAI SUSUMU
IPC分类号： H05H1/46 , C23C16/458 , C23C16/50 , C23C16/509 , C23F4/00 , H01L21/00 , H01L21/205 , H01L21/302 , H01L21/3065 , H01L21/31 , H01L21/687
摘要： PROBLEM TO BE SOLVED: To provide a plasma processing device that can prevent unnecessary plasma discharge and can stably perform highly uniform processing when various kinds of processing is performed in the plasma processing device. SOLUTION: This plasma processing device is provided with susceptor pins 14 which are used for supporting a processed object 16, are so formed as to penetrate holes formed in a susceptor 13, project from the upper surface of the suscepter when the susceptor is lowered and are buried in the holes of the susceptor by being lowered by the weight of themselves when the susceptor is lifted, and susceptor pin guides to guide the lifting and lowering of the susceptor pins, and the suscepter pins 14 and the susceptor pin guides are formed from a ceramic.

2. 发明专利

JP2003100851A VACUUM PROCESSING APPARATUS AND METHOD THEREFOR 审中-公开
公开(公告)号：JP2003100851A
公开(公告)日：2003-04-04
申请号：JP2001293954
申请日：2001-09-26
申请人： ULVAC CORP
发明人： ARAI SUSUMU
IPC分类号： C23C14/50 , C23C16/458 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a vacuum processing apparatus and a vacuum processing method which never generate a positional deviation between a susceptor and a substrate when placing the substrate on the susceptor, lifting the substrate from on the susceptor, or the like, in heating and processing the substrate in the vacuum. SOLUTION: In a vacuum chamber 2, a glass substrate S is moved up and down by the susceptor 6 to put the glass substrate S on and heat it which can move up and down, and a support board 31. The support board 31 supports lower ends of a plurality of hollow up-and-down pins 11 which are disposed around the glass substrate S and are passed through the susceptor 6 in the up and down direction and support the edge of the glass substrate S by flange sections 12 formed at the top ends. At the same time, the support board 31 also supports lower ends of substrate support pins 21 which are inserted in the hollow parts of the up-and-down pins 11 and have their cone-shaped parts 22 projecting above the flange sections 12 on other occasions than when a film is formed. The support board 31 is moved up and down independently from the susceptor 6. In the middle of lifting the glass substrate S to a film formation position, a mask 41 is lifted by the glass substrate S, to be set.

3. 发明专利

JP2002164399A TEMPERATURE-CONTROLLED CHAMBER, AND VACUUM PROCESSING APPARATUS USING THE SAME 失效
公开(公告)号：JP2002164399A
公开(公告)日：2002-06-07
申请号：JP2000356965
申请日：2000-11-24
申请人： ULVAC CORP
发明人： MATSUMOTO KOICHI , ARAI SUSUMU
IPC分类号： C23C14/54 , C23C14/56 , H01L21/203 , H01L21/677 , H01L21/68 , H05B3/84
摘要： PROBLEM TO BE SOLVED: To provide a temperature-controlled chamber with small installation space which enables heating of glass substrate. SOLUTION: Heating means 291 through 293 and cooling means 391 through 393 are mounted within mounting bases 111 through 113, and 114 through 116, respectively, of temperature control rooms 51, 52. A substrate 4 is carried to each of mount bases 111 through 113, and 114 through 116, in this order, by transfer mechanisms 211 through 213, 214 through 216 and carry mechanisms 261 through 263, and 264 through 266 and are heated or cooled gradually. When the directions of mounting bases 111 though 113, and 114 through 116 that are adjacent to a carry-in chamber 2 are changed, so that since two sides that face conveying chamber 2 of substrate 4 can be made orthogonal to a direction for a hand 93 to move by a telescopic motion of an arm 92, substrate 4 can be carried into carry-in chamber 2 and carried out in stabilized conditions.

4. 发明专利

JP2001267246A VACUUM CHAMBER AND VACUUM PROCESSOR 失效
公开(公告)号：JP2001267246A
公开(公告)日：2001-09-28
申请号：JP2000071410
申请日：2000-03-15
申请人： ULVAC CORP
发明人： ARAI SUSUMU , MASUDA HAJIME
IPC分类号： F16K51/02 , B01J19/08 , C23C16/44 , H01L21/205 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a vacuum processor in which film deposition does not occur in the vicinity of each opening that leads to a transfer chamber in a film forming chamber. SOLUTION: This vacuum processor 1 has vacuum chambers 51-56 and a loading/unloading chamber 57, which respectively have first chambers 31-37 and second chambers 41-47. A vacuum valve is arranged inside each of the second chambers 41-47, and each vacuum valve opens/closes a first opening arranged between each of the first chambers 31-37 and respective each of the second chambers 41-47 to enable connection/isolation between each of the inside of the first chambers 31-37 and the inside of the transfer chamber 2. Since the transfer chamber 2 and each of the first chambers 31-37 are not directly connected, each temperature in the vicinity of the first opening inside the first chambers 31-37 does not descend even if the transfer chamber 2 is cooled for purpose of protecting a transfer robot, and the film deposition due to the temperature lowering does not occur.

5. 发明专利

JPH10237658A METHOD FOR FITTING SUSCEPTER, PLATE FOR FIXING SUSCEPTER AND VACUUM TREATMENT DEVICE 失效
公开(公告)号：JPH10237658A
公开(公告)日：1998-09-08
申请号：JP5851897
申请日：1997-02-26
申请人： FRONTEC INC , ULVAC CORP
发明人： FUKUDA KOICHI , KIN SEITETSU , ARAI SUSUMU , KUROKAWA KUNIAKI
IPC分类号： C23C16/44 , C23C16/458 , C23F4/00 , H01L21/205 , H01L21/302 , H01L21/3065 , H01L21/68 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a suscepter fitting method capable of simply positioning a suscepter, and to provide a plate for fixing the suscepter used for the method and a vacuum treatment device. SOLUTION: At the time of arranging a setting plate 11 fixed to the upper end part of a supporting 12 of the susceter 10 vertically movably in a vacuum vessel 20, after positioning the suscepter 10 by inserting into a bellows 30 from the lower end part 13 side of the supporting 12, the supporting is fixed to a sealing plate 33 at the lower end part of the bellows 30. The fitting is easily executed and the positioning accuracy of the susceptor 10 is not affected with dimensional allowance of the bellows 30. The tip part 14 at the lower end part of the supporting 12 is formed as non-round shape, and a plate 2 having non-round shaped inserting hole is fitted to the tip part 14 and fixed to the sealing plate 33, and then the suscepter 10 may be fitted.

6. 发明专利

JPH0910577A STRUCTURAL MATERIAL FOR VACUUM APPARATUS AND STRUCTURAL MEMBER FOR VACUUM APPARATUS 失效
公开(公告)号：JPH0910577A
公开(公告)日：1997-01-14
申请号：JP18212295
申请日：1995-06-26
申请人： ULVAC CORP
发明人： SAGUSA NOBUYUKI , HASEGAWA TSUTOMU , NAGASHIMA SHIGEYUKI , OZAKI NORIO , SUWA HIDENORI , KIKUCHI MASASHI , MORI KATSUHIKO , ARAI SUSUMU , SHIMIZU YASUO , HIRATA MASAYORI , OGATA HIDEYUKI
IPC分类号： B01J3/00 , C23C2/12 , C23C14/00 , C23C16/44 , C23C16/54 , C23C26/00 , C23C28/00 , H01L21/205
摘要： PURPOSE: To provide a structural material for a vacuum apparatus with high corrosion resistance to a halogen-containing type etching gas excited by plasma discharge. CONSTITUTION: A corrosion resistant shower plate 71 is made of a plate material 74 with 4mm thickness of a Ni-based corrosion resistant alloy of which the whole area including bolt hole 72 and gas flow straightening hole 73 parts is coated with aluminum (A 5052) with 1.3mm and the surface of the aluminum coating is further coated with an oxidized aluminum layer 76 with 20μm thickness by anodization oxidation.

7. 发明专利

JPH08319570A PLASMA CVD DEVICE 失效
公开(公告)号：JPH08319570A
公开(公告)日：1996-12-03
申请号：JP14824995
申请日：1995-05-22
申请人： ULVAC CORP
发明人： ARAI SUSUMU , MORI KATSUHIKO , KIKUCHI MASASHI , SHIMIZU YASUO , OGATA HIDEYUKI
IPC分类号： C23C16/44 , C23C16/455 , C23C16/50 , C23C16/509 , C23C16/54 , H01L21/205 , H01L21/285 , H01L21/31
摘要： PURPOSE: To provide a plasma CVD device in which a shower plate is easily exchangeable in a short time. CONSTITUTION: An air cylinder 2 is fitted to the air side in an electrode flange 11 served also as the wall member of a vacuum chamber 19, and the tip part of a rod 3 directly connected to the piston, penetrating the flange 11 and having a length reaching a shower plate 13 in the vacuum side is provided with a fixing and exchanging mechanism 1 engaging the hook 14 of the shower plate 13. By the rod 3, the shower plate 13 is drawn near and is fixed, and it is isolated from the electrode flange 11 and is exchanged.

8. 发明专利

JPH08311654A PLASMA CVD APPARATUS AND THIN FILM FORMING PROCESS BY PLASMA CVD 失效
公开(公告)号：JPH08311654A
公开(公告)日：1996-11-26
申请号：JP13725595
申请日：1995-05-10
申请人： ULVAC CORP
发明人： ARAI SUSUMU
IPC分类号： C23C16/50 , H01L21/205
摘要： PURPOSE: To provide a plasma CVD apparatus to form a stable thin film having a uniform thickness, wherein a shower plate is never deformed even by use for a long period, and a thin film forming process by plasma CVD. CONSTITUTION: A vacuum chamber 19 attached with a gas introducing pipe 24 comprises an electrode flange 11 as an upper cover becoming a cathode and a vessel part 16. A body to be treated S is mounted on a susceptor 18 becoming an anode in the vacuum chamber 19. Only at the time of film formation, when reaction gas is introduced and then plasma is excited with RF electric power supply and when etching gas is introduced and then plasma is excited with RF electric power supply, the shower plate 13 is fixed by being pressed on an impressing flange 1 with a push pin 4 connected directly to an air cylinder 3.

9. 发明专利

JP2001192834A MASK AND VACUUM TREATMENT SYSTEM 失效
公开(公告)号：JP2001192834A
公开(公告)日：2001-07-17
申请号：JP2000000046
申请日：2000-01-04
申请人： ULVAC CORP
发明人： KUROKAWA KUNIAKI , ARAI SUSUMU
IPC分类号： H01L21/302 , C23C16/458 , H01L21/3065 , H01L21/31
摘要： PROBLEM TO BE SOLVED: To provide a technique for preventing chipping by means of a mask covering the outside peripheral surface of a substrate. SOLUTION: A mask 31 has a bottom plate 36 constituted by assembling bottom plate members 361 to 364 into a frame and top plate members 371 to 374 placed on the respective bottom plate members 361 to 364. An opening 38 formed by the top plate members 371 to 374 is smaller than a substrate 60 and when the mask 31 descends to the substrate 60, the members 371 to 374 are mounted in such a way that they abut on the outside peripheral region of the surface of the substrate 60. The members 371 to 374 are made separable from the respective members 361 to 364. As the result, even if the bottom plate further descends after the members 371 to 374 abut on the surface of the substrate 60, the weight of the members 371 to 374 alone are imposed on the substrate 60 and the weight of the bottom plate 36 are not imposed on it. Accordingly, the weight imposed on the substrate becomes smaller than heretofore, and conventionally occurring chipping can be prevented.

10. 发明专利

JPH10237653A VACUUM TREATING DEVICE 失效
公开(公告)号：JPH10237653A
公开(公告)日：1998-09-08
申请号：JP5851797
申请日：1997-02-26
申请人： ULVAC CORP , FRONTEC INC
发明人： ARAI SUSUMU , KUROKAWA KUNIAKI , FUKUDA KOICHI , KIN SEITETSU
IPC分类号： H05H1/46 , C23C14/50 , C23C16/44 , C23C16/50 , C23F4/00 , H01L21/205 , H01L21/302 , H01L21/3065 , H01L21/31
摘要： PROBLEM TO BE SOLVED: To prevent abnormal discharge between a member for elevating/ lowering a substrate and a vacuum treating tank in a vacuum treating device executing treatment to a substrate in a state in which voltage is applied to a member supporting the substrate. SOLUTION: The inside of a vacuum treating tank 2 is provided with susceptor 6 supporting a substrate 5 and substrate elevating/lowering pins 14A and 14B elevating and lowering the substrate 5 in a state of being electrically connected to the susceptor 6. The substrate elevating/lowering pins 14A and 14B pierce the susceptor 6 and are arranged freely vertically movable. At the time of executing plasma treatment to the substrate 5, high frequency voltage is applied to the susceptor 6 from a high frequency power source 13. Insulating members 16A and 16B are composed of a pair of cylindrical insulating members capable of relative movement in the up and down directions in a state of being partially overlapped. The exposed parts in the substrate elevating/lowering pins 14A and 14B from the susceptor 6 are covered with the insulating members 16A and 16B.

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