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    • 1. 发明申请
    • METHOD FOR PRODUCING CONTACT STRUCTURES IN SOLAR CELLS
    • 生产太阳能电池接触结构的工艺
    • WO9956324A3
    • 1999-12-16
    • PCT/DE9901246
    • 1999-04-27
    • FRAUNHOFER GES FORSCHUNGLUEDEMANN RALFSCHAEFER SEBASTIAN
    • LUEDEMANN RALFSCHAEFER SEBASTIAN
    • H01L31/04H01L21/033H01L21/308H01L21/768H01L31/0224H01L31/068H01L31/18
    • H01L31/022441H01L21/0332H01L21/3081H01L21/768H01L21/76804H01L21/7688H01L31/022425H01L31/0682H01L31/1804Y02E10/547Y02P70/521
    • The invention relates to a method for producing contact structures in semiconductor components, especially solar cells, and semiconductor components having these contact structures. According to the invention, recesses which extend through the first layer to or into a second layer located under said first layer are etched after positioning an etching mask (3) over a first layer or a series of layers (2). The etching is carried out in such a way that the etching mask is etched underneath and/or at least one area of the first layer (2) is provided with negative flanks. Afterwards, an electrically conductive material (9) is inserted in the recesses, whereby the etching mask (3) or the first layer (2) forms a shadow mask for inserting the material. The conductive material is placed in the recesses only up to a height at which there is still no contact between the conductive material (9) and the first layer (2). The structures permit the emitter to contact the base without additional masking. As a result, the invention makes it possible to produce metal contacts on solar cells in an easier and economical manner.
    • 本发明涉及一种用于制造半导体部件,特别是太阳能电池中的接触结构的方法以及具有这些接触结构的半导体部件。 根据本发明的一个方面,在将蚀刻掩模(3)定位在第一层或层序列(2)上之后,将凹槽蚀刻穿过第一层到达或者进入下面的第二层(1)。 蚀刻以蚀刻掩模(3)底切和/或第一层(2)的至少一个区域接收负侧面的方式进行。 随后,将导电材料(9)引入到凹槽中,其中蚀刻掩模(3)或第一层(2)形成用于引入材料的阴影掩模。 导电材料仅在凹部中被引入到导电材料(9)和第一层(2)之间不存在接触的高度。 该结构首次允许发射器接触基座而无需额外的掩蔽。 本发明因此能够实现太阳能电池上的金属触点的更简单和成本有效的生产。