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    • 2. 发明申请
    • XEROGRAPHIC MICRO-ASSEMBLER
    • US20080089705A1
    • 2008-04-17
    • US11959030
    • 2007-12-18
    • Jeng Ping LuEugene Chow
    • Jeng Ping LuEugene Chow
    • H05K3/32G03G15/00
    • H01L25/50H01L21/67271H01L21/67282H01L21/67294H01L24/95H01L2224/95085H01L2224/95144H01L2224/95145H01L2924/14H01L2924/1461Y10T29/4913Y10T29/49133Y10T29/53004Y10T29/5313Y10T29/53174Y10T29/53178Y10T29/53278H01L2924/00
    • Xerographic micro-assembler systems and methods are disclosed. The systems and methods involve manipulating charge-encoded micro-objects. The charge encoding identifies each micro-object and specifies its orientation for sorting. The micro-objects are sorted in a sorting unit so that they have defined positions and orientations. The sorting unit has the capability of electrostatically and magnetically manipulating the micro-objects based on their select charge encoding. The sorted micro-objects are provided to an image transfer unit. The image transfer unit is adapted to receive the sorted micro-objects, maintain them in their sorted order and orientation, and deliver them to a substrate. Maintaining the sorted order as the micro-objects are delivered to the substrate may be accomplished through the use of an electrostatic image, as is done in xerography. The substrate with the micro-objects is further processed to interconnect the micro-objects—through electrical wiring, for example—to form the final micro-assembly.
    • 公开了静电印刷微组装系统和方法。 系统和方法涉及操纵电荷编码的微物体。 电荷编码识别每个微物体并指定其排列方向。 微物体在分类单元中排序,使得它们具有定义的位置和取向。 分选单元具有基于其选择电荷编码的静电和磁性操纵微物体的能力。 分类的微物体被提供给图像传送单元。 图像传送单元适于接收分类的微物体,将它们保持在排列顺序和方位,并将其传送到基底。 将排序的顺序作为微物体传送到基底可以通过使用静电图像来实现,如在静电复印中所做的那样。 具有微物体的衬底被进一步处理以使例如微通孔电线互连,以形成最终的微组件。
    • 4. 发明申请
    • Digital Gravure Printing with a Pixilated Photoconductor
    • 数字凹版印刷与Pixilated光电导体
    • US20110185925A1
    • 2011-08-04
    • US12697109
    • 2010-01-29
    • Eugene ChowJeng Ping Lu
    • Eugene ChowJeng Ping Lu
    • B41M1/10
    • B41M1/10
    • A printing sub-system including same including a pixilated photoconductive member (such as a photobelt) is disclosed. Electrically isolated cells hold surface application material above the photoconductor. The surface application material is first charged. Charge on the surface application material in an individual cell may then be discharged by exposure of a region of the photoconductor proximate that cell to light from an optical addressing system. The surface application material is brought into proximity of an image receiving member such as paper, which is either charged or proximate a charge source. Charged surface application material in a cell may then be electrostatically transferred from the cell onto the image receiving member, while discharged surface application material remains in the cell. The subsystem may form a part of a complete printing system using many existing components. Among other advantages, viscous liquid surface application material may thereby be printed.
    • 公开了包括像素化感光体(例如光带)的包括其的印刷子系统。 电隔离的电池在光电导体上方保持表面应用材料。 首先对表面施用材料进行充电。 然后可以通过将靠近该单元的光电导体的区域暴露于来自光寻址系统的光来对单个单元中的表面施加材料上的电荷进行放电。 表面施加材料被带入诸如纸的图像接收构件,其被充电或靠近电荷源。 然后可以将电池中的充电表面施用材料静电从细胞转移到图像接收部件上,同时放电的表面施用材料保留在电池中。 子系统可以使用许多现有组件形成完整打印系统的一部分。 除了其它优点之外,可以印刷粘性液体表面施加材料。
    • 5. 发明申请
    • Microsprings Having Nanowire Tip Structures
    • 具有纳米线尖端结构的微管
    • US20110167526A1
    • 2011-07-07
    • US13045042
    • 2011-03-10
    • Eugene ChowPengfei Qi
    • Eugene ChowPengfei Qi
    • G01Q70/08B82Y30/00
    • B81C1/0015B81B2203/019B81B2207/07B82Y10/00
    • A stress-engineered microspring is formed generally in the plane of a substrate. A nanowire (or equivalently, a nanotube) is formed at the tip thereof, also in the plane of the substrate. Once formed, the length of the nanowire may be defined, for example photolithographically. A sacrificial layer underlying the microspring may then be removed, allowing the engineered stresses in the microspring to cause the structure to bend out of plane, elevating the nanowire off the substrate and out of plane. Use of the nanowire as a contact is thereby provided. The nanowire may be clamped at the tip of the microspring for added robustness. The nanowire may be coated during the formation process to provide additional functionality of the final device.
    • 应力工程微球通常在基底的平面上形成。 纳米线(或等效地,纳米管)也在其顶端形成在基板的平面中。 一旦形成,可以例如光刻地限定纳米线的长度。 然后可以去除位于微弹簧下面的牺牲层,允许微弹簧中的工程应力使结构弯曲出平面,从而使纳米线离开基底并离开平面。 由此提供了使用纳米线作为接触。 可以将纳米线夹在微弹簧的末端以增加坚固性。 在形成过程中可以涂覆纳米线以提供最终装置的附加功能。
    • 6. 发明申请
    • Vertically spaced plural microsprings
    • 垂直间隔的多个微弹簧
    • US20070125486A1
    • 2007-06-07
    • US11292474
    • 2005-12-02
    • Thomas HantschelEugene Chow
    • Thomas HantschelEugene Chow
    • B32B37/00
    • B81B3/001B81B2207/07B81C1/00666B81C1/00952G01R1/06722G01R1/06727G01R1/06744G01R3/00H05K3/4092
    • A plurality of vertically spaced-apart microsprings are provided to increase microspring contact force, contact area, contact reliability, and contact yield. The microspring material is deposited, either as a single layer or as a composite of multiple sub layers, to have a tailored stress differential along its cross-section. A lower microspring may be made to push up against an upper microspring to provide increased contact force, or push down against a substrate to ensure release during manufacture. The microsprings may be provided with similar stress differentials or opposite stress differentials to obtain desired microspring profiles and functionality. Microsprings may also be physically connected at their distal ends for increased contact force. The microsprings may be formed of electrically conductive material or coated with electrically conductive material for probe card and similar applications.
    • 提供多个垂直间隔开的微弹簧以增加微弹簧接触力,接触面积,接触可靠性和接触屈服。 微珠材料作为单层或作为多个子层的复合材料沉积,沿其横截面具有定制的应力差。 可以制备较低的微弹簧以向上推动上部微型弹性体以提供增加的接触力,或者向下推动抵靠基底以确保制造过程中的释放。 可以提供类似的应力差异或相反的应力差异以获得所需的微弹体轮廓和功能性。 微弹簧也可以在其远端物理连接以增加接触力。 微弹簧可以由导电材料形成或涂覆有用于探针卡和类似应用的导电材料。
    • 7. 发明申请
    • Curved spring structure with elongated section located under cantilevered section
    • 弯曲弹簧结构,细长部分位于悬臂部分下方
    • US20070069751A1
    • 2007-03-29
    • US11549066
    • 2006-10-12
    • Thomas HantschelEugene Chow
    • Thomas HantschelEugene Chow
    • G01R31/02
    • H01G5/18G01R1/06738
    • A curved spring structure includes a base section extending parallel to the substrate surface, a curved cantilever section bent away from the substrate surface, and an elongated section extending from the base section along the substrate surface under the cantilevered section. The spring structure includes a spring finger formed from a self-bending material film (e.g., stress-engineered metal, bimorph/bimetallic) that is patterned and released. A cladding layer is then electroplated and/or electroless plated onto the spring finger for strength. The elongated section is formed from plating material deposited simultaneously with cladding layers. To promote the formation of the elongated section, a cementation layer is provided under the spring finger to facilitate electroplating, or the substrate surface is pre-treated to facilitate electroless plating.
    • 弯曲弹簧结构包括平行于基板表面延伸的基部部分,弯曲的远离基板表面的弯曲悬臂部分,以及从基部沿着悬臂部分下方的基板表面延伸的细长部分。 弹簧结构包括由图案化和释放的自弯曲材料膜(例如,应力工程金属,双晶型/双金属)形成的弹簧指状物。 然后将包覆层电镀和/或无电镀在弹簧手指上用于强度。 细长部分由与包覆层同时沉积的电镀材料形成。 为了促进细长部分的形成,在弹簧指状物下方设置有胶结层以促进电镀,或者基板表面被预处理以便于化学镀。
    • 8. 发明申请
    • Integrateable capacitors and microcoils and methods of making thereof
    • 可集成电容器和微型线圈及其制造方法
    • US20070148895A1
    • 2007-06-28
    • US11319075
    • 2005-12-28
    • Koenraad Van SchuylenberghEugene ChowJengPing Lu
    • Koenraad Van SchuylenberghEugene ChowJengPing Lu
    • H01L21/00
    • H01G5/18H01F17/0006H01F17/02H01F21/04H01F27/40H01F41/041H01L28/10H01L28/40
    • Methods for integrally forming high Q tunable capacitors and high Q inductors on a substrate are described. A method for integrally forming a capacitor and a microcoil on a substrate may involve depositing and patterning a dielectric layer on the substrate, depositing and patterning a sacrificial layer on the substrate, depositing and patterning conductive material on the semiconductor substrate, depositing and patterning a polymer layer on the semiconductor substrate, removing an exposed portion of the conductive material exposed by the patterned polymer layer to release a portion of the conductive pattern from the semiconductor substrate to form out-of-plane windings of the microcoil, depositing second conductive material on exposed portions of the conductive material, and removing the sacrificial layer. The patterned conductive material may include a windings portion of the microcoil, an overlapping electrode portion of the capacitor and a support portion for the electrode of the capacitor.
    • 描述了在衬底上整体形成高Q可调谐电容器和高Q电感器的方法。 用于在基板上一体地形成电容器和微线圈的方法可以包括在基板上沉积和图案化电介质层,在衬底上沉积和图案化牺牲层,在半导体衬底上沉积和图案化导电材料,沉积和图案化聚合物 去除由所述图案化聚合物层暴露的所述导电材料的暴露部分,以从所述半导体衬底释放所述导电图案的一部分,以形成所述微线圈的面外绕组,将第二导电材料沉积在暴露的 部分导电材料,并去除牺牲层。 图案化导电材料可以包括微线圈的绕组部分,电容器的重叠电极部分和用于电容器电极的支撑部分。
    • 9. 发明申请
    • Xerographic micro-assembler
    • 静电复印机
    • US20060128057A1
    • 2006-06-15
    • US11011652
    • 2004-12-14
    • Jeng LuEugene Chow
    • Jeng LuEugene Chow
    • H01L21/50H01L21/30B23P21/00
    • H01L25/50H01L21/67271H01L21/67282H01L21/67294H01L24/95H01L2224/95085H01L2224/95144H01L2224/95145H01L2924/14H01L2924/1461Y10T29/4913Y10T29/49133Y10T29/53004Y10T29/5313Y10T29/53174Y10T29/53178Y10T29/53278H01L2924/00
    • Xerographic micro-assembler systems and methods are disclosed. The systems and methods involve manipulating charge-encoded micro-objects. The charge encoding identifies each micro-object and specifies its orientation for sorting. The micro-objects are sorted in a sorting unit so that they have defined positions and orientations. The sorting unit has the capability of electrostatically and magnetically manipulating the micro-objects based on their select charge encoding. The sorted micro-objects are provided to an image transfer unit. The image transfer unit is adapted to receive the sorted micro-objects, maintain them in their sorted order and orientation, and deliver them to a substrate. Maintaining the sorted order as the micro-objects are delivered to the substrate may be accomplished through the use of an electrostatic image, as is done in xerography. The substrate with the micro-objects is further processed to interconnect the micro-objects—through electrical wiring, for example—to form the final micro-assembly.
    • 公开了静电印刷微组装系统和方法。 系统和方法涉及操纵电荷编码的微物体。 电荷编码识别每个微物体并指定其排列方向。 微物体在分类单元中排序,使得它们具有定义的位置和取向。 分选单元具有基于其选择电荷编码的静电和磁性操纵微物体的能力。 分类的微物体被提供给图像传送单元。 图像传送单元适于接收分类的微物体,将它们保持在排列顺序和方位,并将其传送到基底。 将排序的顺序作为微物体传送到基底可以通过使用静电图像来实现,如在静电复印中所做的那样。 具有微物体的衬底被进一步处理以使例如微通孔电线互连,以形成最终的微组件。
    • 10. 发明申请
    • Curved spring structure with elongated section located under cantilevered section
    • 弯曲弹簧结构,细长部分位于悬臂部分下方
    • US20060087335A1
    • 2006-04-27
    • US10971467
    • 2004-10-21
    • Thomas HantschelEugene Chow
    • Thomas HantschelEugene Chow
    • G01R31/02
    • H01G5/18G01R1/06738
    • A curved spring structure includes a base section extending parallel to the substrate surface, a curved cantilever section bent away from the substrate surface, and an elongated section extending from the base section along the substrate surface under the cantilevered section. The spring structure includes a spring finger formed from a self-bending material film (e.g., stress-engineered metal, bimorph/bimetallic) that is patterned and released. A cladding layer is then electroplated and/or electroless plated onto the spring finger for strength. The elongated section is formed from plating material deposited simultaneously with cladding layers. To promote the formation of the elongated section, a cementation layer is provided under the spring finger to facilitate electroplating, or the substrate surface is pre-treated to facilitate electroless plating.
    • 弯曲弹簧结构包括平行于基板表面延伸的基部部分,弯曲的远离基板表面的弯曲悬臂部分,以及从基部沿着悬臂部分下方的基板表面延伸的细长部分。 弹簧结构包括由图案化和释放的自弯曲材料膜(例如,应力工程金属,双晶型/双金属)形成的弹簧指状物。 然后将包覆层电镀和/或无电镀在弹簧手指上用于强度。 细长部分由与包覆层同时沉积的电镀材料形成。 为了促进细长部分的形成,在弹簧指状物下方设置有胶结层以促进电镀,或者基板表面被预处理以便于化学镀。