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1. 发明授权

US08388423B2 Method and apparatus for a low impedance anti-recirculation air moving inlet device 失效
标题翻译：低阻抗再循环空气移动入口装置的方法和装置
公开(公告)号：US08388423B2
公开(公告)日：2013-03-05
申请号：US12170940
申请日：2008-07-10
申请人： Ethan E. Cruz , Maurice F. Holahan , Roger R. Schmidt
发明人： Ethan E. Cruz , Maurice F. Holahan , Roger R. Schmidt
IPC分类号： H05K5/00 , H05K7/20
CPC分类号： H05K7/2019
摘要： An inlet recirculation apparatus for an air moving device includes a housing defined by a wall extending from a base. The base includes an aperture therethrough receptive to alignment with an inlet of the air moving device. A plurality of flaps each pivotally extends radially outwardly from a center pivot to another corresponding pivot disposed around a perimeter of the wall. The center pivot is coaxial with a center of the aperture. Each flap moves to an open position due to air pressure from the air moving device causing air to flow into the inlet wherein each flap pivotally rotates about the center pivot and corresponding pivot at the wall, and moves to a closed position when air pressure from the air moving device ceases wherein a space between contiguous flaps is eliminated when each flap pivotally rotates to the closed position about the center pivot and corresponding pivot at the wall to prevent reverse airflow through the air moving device.
摘要翻译：用于空气移动装置的入口再循环装置包括由从基座延伸的壁限定的壳体。底座包括一个穿过其的孔，该孔穿过空气移动装置的入口对准。多个翼片各自枢转地从中心枢轴径向向外延伸到围绕壁的周边设置的另一对应的枢轴。中心枢轴与孔的中心同轴。由于来自空气移动装置的空气压力，每个翼片移动到打开位置，导致空气流入入口，其中每个翼片围绕中心枢轴和在壁处的相应枢轴枢转地旋转，并且当来自空气移动装置停止，其中当每个翼片围绕中心枢轴转动到关闭位置时在相邻翼片之间的空间被消除，并且在壁处具有相应的枢轴以防止通过空气移动装置的反向气流。

2. 发明申请

US20080268764A1 METHOD AND APPARATUS FOR A LOW IMPEDANCE ANTI-RECIRCULATION AIR MOVING INLET DEVICE 失效
标题翻译：用于低阻抗反循环空气移动入口装置的方法和装置
公开(公告)号：US20080268764A1
公开(公告)日：2008-10-30
申请号：US12170940
申请日：2008-07-10
申请人： Ethan E. Cruz , Maurice F. Holahan , Roger R. Schmidt
发明人： Ethan E. Cruz , Maurice F. Holahan , Roger R. Schmidt
IPC分类号： H05K5/00
CPC分类号： H05K7/2019
摘要： An inlet recirculation apparatus for an air moving device includes a housing defined by a wall extending from a base. The base includes an aperture therethrough receptive to alignment with an inlet of the air moving device. A plurality of flaps each pivotally extends radially outwardly from a center pivot to another corresponding pivot disposed around a perimeter of the wall. The center pivot is coaxial with a center of the aperture. Each flap moves to an open position due to air pressure from the air moving device causing air to flow into the inlet wherein each flap pivotally rotates about the center pivot and corresponding pivot at the wall, and moves to a closed position when air pressure from the air moving device ceases wherein a space between contiguous flaps is eliminated when each flap pivotally rotates to the closed position about the center pivot and corresponding pivot at the wall to prevent reverse airflow through the air moving device.
摘要翻译：用于空气移动装置的入口再循环装置包括由从基座延伸的壁限定的壳体。底座包括一个穿过其的孔，该孔穿过空气移动装置的入口对准。多个翼片各自枢转地从中心枢轴径向向外延伸到围绕壁的周边设置的另一对应的枢轴。中心枢轴与孔的中心同轴。由于来自空气移动装置的空气压力，每个翼片移动到打开位置，导致空气流入入口，其中每个翼片围绕中心枢轴和在壁处的相应枢轴枢转地旋转，并且当来自空气移动装置停止，其中当每个翼片围绕中心枢轴转动到关闭位置时在相邻翼片之间的空间被消除，并且在壁处具有相应的枢轴以防止通过空气移动装置的反向气流。

3. 发明授权

US09043035B2 Dynamically limiting energy consumed by cooling apparatus 有权
标题翻译：动力限制冷却装置消耗的能量
公开(公告)号：US09043035B2
公开(公告)日：2015-05-26
申请号：US13305967
申请日：2011-11-29
申请人： Timothy J. Chainer , Milnes P. David , Madhusudan K. Iyengar , Pritish R. Parida , Roger R. Schmidt , Mark D. Schultz
发明人： Timothy J. Chainer , Milnes P. David , Madhusudan K. Iyengar , Pritish R. Parida , Roger R. Schmidt , Mark D. Schultz
IPC分类号： G06F19/00 , G05D7/06 , G06F1/20 , G11B33/14 , H05K7/20 , G06F1/32
CPC分类号： G05D7/0635 , G06F1/20 , G06F1/206 , G06F1/3206 , G11B33/144 , H05K7/20281 , H05K7/20781 , H05K7/2079 , H05K7/20836 , Y02D10/16
摘要： Cooling apparatuses and methods are provided which include one or more coolant-cooled structures associated with an electronics rack, a coolant loop coupled in fluid communication with one or more passages of the coolant-cooled structure(s), one or more heat exchange units coupled to facilitate heat transfer from coolant within the coolant loop, and N controllable components associated with the coolant loop or the heat exchange unit(s), wherein N≧1. The N controllable components facilitate circulation of coolant through the coolant loop or transfer of heat from the coolant via the heat exchange unit(s). A controller is coupled to the N controllable components, and dynamically adjusts operation of the N controllable components, based on Z input parameters and one or more specified constraints, to provide a specified cooling to the coolant-cooled structure(s), while limiting energy consumed by the N controllable components, wherein Z≧1.
摘要翻译：提供了冷却装置和方法，其包括与电子机架相关联的一个或多个冷却剂冷却结构，与冷却剂冷却结构的一个或多个通道流体连通的冷却剂回路，一个或多个热交换单元以促进从冷却剂回路内的冷却剂的热传递，以及与冷却剂回路或热交换单元相关联的N个可控部件，其中N≥1。 N个可控部件促使冷却剂循环通过冷却剂回路或通过热交换单元从冷却剂传递热量。控制器耦合到N个可控组件，并且基于Z输入参数和一个或多个指定的约束来动态调整N个可控组件的操作，以向冷却剂冷却的结构提供特定的冷却，同时限制能量由N个可控部件消耗，其中Z≥1。

4. 发明授权

US08913384B2 Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s) 有权
标题翻译：将电子卡耦合到冷却剂冷却结构的热转印结构
公开(公告)号：US08913384B2
公开(公告)日：2014-12-16
申请号：US13527947
申请日：2012-06-20
申请人： Milnes P. David , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Pritish R. Parida , Roger R. Schmidt , Mark E. Steinke
发明人： Milnes P. David , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Pritish R. Parida , Roger R. Schmidt , Mark E. Steinke
IPC分类号： H05K7/20 , H05K13/00
CPC分类号： H05K7/20745 , H05K7/2079 , H05K13/00
摘要： Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.
摘要翻译：提供冷却装置和冷却剂冷却的电子系统，其包括热传递结构，其被配置成与弹簧力接合一个或多个电子卡，其中电子卡在电子系统的相应插座内对接。冷却装置的热传递结构包括具有第一热传导表面的散热器和耦合到散热器的导电表面的导热弹簧组件，并被定位和配置成驻留在物理上耦合电子器件的第一表面卡到散热器的第一表面，使电子卡在电子系统的插座内对接。在一个实施例中，热传递结构是冶金结合到冷却剂冷却结构，并且有助于将热量从电子卡传递到流过冷却剂冷却结构的冷却剂。

5. 发明授权

US08880225B2 Data center cooling control 有权
标题翻译：数据中心冷却控制
公开(公告)号：US08880225B2
公开(公告)日：2014-11-04
申请号：US13276247
申请日：2011-10-18
申请人： Madhusudan K. Iyengar , Roger R. Schmidt
发明人： Madhusudan K. Iyengar , Roger R. Schmidt
IPC分类号： G05D23/19 , H05K7/20
CPC分类号： H05K7/20836 , G05D23/1932
摘要： A method, system, and computer program product for controlling data center cooling. In an example embodiment the method includes calculating, using a processor, an over-provisioning factor, where the over-provisioning factor is a function of a ratio of a rated cooling power to a calculated cooling power of a set of cooling units, the set of cooing units comprising at least one cooling unit. The method proceeds by adjusting the data-center cooling until the over-provisioning factor is substantially equal to a target over-provisioning factor.
摘要翻译：一种用于控制数据中心冷却的方法，系统和计算机程序产品。在示例实施例中，该方法包括使用处理器计算过度供应因子，其中过度供应因子是额定冷却功率与一组冷却单元的计算的冷却功率的比率的函数，该组包括至少一个冷却单元的冷却单元。该方法通过调整数据中心冷却来进行，直到过度供应因子基本上等于目标过度供应因子。

6. 发明申请

US20140071626A1 VAPOR CONDENSER WITH THREE-DIMENSIONAL FOLDED STRUCTURE 有权
标题翻译：具有三维折叠结构的蒸汽冷凝器
公开(公告)号：US20140071626A1
公开(公告)日：2014-03-13
申请号：US13613753
申请日：2012-09-13
申请人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, JR. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F28D15/02 , B21D53/02 , H05K7/20 , F28D7/00
CPC分类号： H05K7/20309 , B23P15/26 , F28D9/0025 , F28D15/02 , F28F3/046 , F28F3/12 , F28F9/02 , H05K7/203 , H05K7/20809 , Y10T29/4935 , Y10T29/49359 , Y10T29/49396
摘要： A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.
摘要翻译：提供了一种蒸汽冷凝器，其包括三维折叠结构，其至少部分地限定一组冷却剂传送通道和一组蒸气冷凝通道，其中冷却剂传送通道与蒸汽冷凝通道。折叠结构包括在片材中具有多个折叠的导热片。片材的一侧是蒸汽冷凝表面，并且片材的相对侧是冷却剂冷却的表面，冷却剂冷却表面的至少一部分限定了冷却剂传送通道，并与冷却剂内部的冷却剂接触冷却液承载通道。蒸气冷凝器在一个实施例中还包括顶板，以及第一和第二端部歧管，其连接到折叠结构的相对端并与冷却剂承载通道流体连通以便于冷却剂流过冷却剂携带频道

7. 发明申请

US20130000736A1 ADJUSTABLE AND DIRECTIONAL FLOW PERFORATED TILES 审中-公开
标题翻译：可调和方向流动执行平台
公开(公告)号：US20130000736A1
公开(公告)日：2013-01-03
申请号：US13172765
申请日：2011-06-29
申请人： Patrick A. Coico , David P. Graybill , Allan R. Hoeft , Madhusudan K. Iyengar , Roger R. Schmidt , Gerard V. Weber, JR.
发明人： Patrick A. Coico , David P. Graybill , Allan R. Hoeft , Madhusudan K. Iyengar , Roger R. Schmidt , Gerard V. Weber, JR.
IPC分类号： F17D3/00
CPC分类号： H05K7/20836 , F17D3/00 , H05K7/20 , H05K7/20181 , H05K7/20745 , Y10T137/0324 , Y10T137/6851
摘要： An air flow control assembly, system, and method for controlling air flow to a server rack. An example air flow control assembly includes a retractable barrier configured to block the air flow, at least partially, from passing through a perforated floor tile to the server rack. The air flow control assembly also includes a barrier mount configured to secure the retractable barrier proximate the perforated floor tile.
摘要翻译：用于控制到服务器机架的空气流的气流控制组件，系统和方法。示例性空气流量控制组件包括可缩回屏障，所述可伸缩屏障被配置为阻挡空气流，至少部分地阻止穿过穿孔的地板砖到服务器机架。空气流量控制组件还包括被配置为将可伸缩的屏障固定在穿孔地板砖附近的阻挡安装座。

8. 发明授权

US07979250B2 Method of laying out a data center using a plurality of thermal simulators 有权
标题翻译：使用多个热模拟器布置数据中心的方法
公开(公告)号：US07979250B2
公开(公告)日：2011-07-12
申请号：US11950747
申请日：2007-12-05
申请人： Matthew R. Archibald , Richard C. Chu , Hendrik F. Hamann , Madhusudan K. Iyengar , Roger R. Schmidt
发明人： Matthew R. Archibald , Richard C. Chu , Hendrik F. Hamann , Madhusudan K. Iyengar , Roger R. Schmidt
IPC分类号： G06F17/50 , G06G7/56 , G06G7/50 , H02B1/00 , G01K13/00 , G01K1/08 , G01K7/16 , G01K11/30 , G01K1/16 , G01N9/36
CPC分类号： G06F17/509 , G06F1/20 , G06F17/5004 , G06F2217/78 , G06F2217/80
摘要： A method is provided for facilitating installation of one or more electronics racks within a data center. The method includes: placing a plurality of thermal simulators in the data center in a data center layout to establish a thermally simulated data center, each thermal simulator simulating at least one of airflow intake or heated airflow exhaust of a respective electronics rack of a plurality of electronics racks to be installed in the data center; monitoring temperature within the thermally simulated data center at multiple locations, and verifying the data center layout if measured temperatures are within respective acceptable temperature ranges for the data center when containing the plurality of electronics racks; and establishing the plurality of electronics racks within the data center using the verified data center layout, the establishing including at least one of reconfiguring or replacing each thermal simulator with a respective electronics rack.
摘要翻译：提供了一种便于在数据中心内安装一个或多个电子机架的方法。该方法包括：将多个热模拟器放置在数据中心中的数据中心布局中，以建立热仿真数据中心，每个热模拟器模拟多个模拟数据中心的相应电子机架的气流吸入或加热气流排气中的至少一个电子机架要安装在数据中心; 监测多个位置的热仿真数据中心内的温度，以及如果测量温度在包含多个电子机架时数据中心的可接受温度范围内，则验证数据中心布局; 以及使用已验证的数据中心布局在所述数据中心内建立所述多个电子机架，所述建立包括用相应的电子机架重新配置或替换每个热模拟器中的至少一个。

9. 发明授权

US07978473B2 Cooling apparatus with cold plate formed in situ on a surface to be cooled 有权
标题翻译：具有冷板的冷却装置在待冷却的表面上原位形成
公开(公告)号：US07978473B2
公开(公告)日：2011-07-12
申请号：US12706912
申请日：2010-02-17
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Bruce K. Furman , Madhusudan K. Iyengar , Paul A. Lauro , Roger R. Schmidt , Da-Yuan Shih , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Bruce K. Furman , Madhusudan K. Iyengar , Paul A. Lauro , Roger R. Schmidt , Da-Yuan Shih , Robert E. Simons
IPC分类号： H05K7/20 , G06F1/20 , H01L23/34
CPC分类号： H01L23/4735 , H01L23/473 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled.
摘要翻译：提供冷却装置和制造方法以便于从发热电子装置中除去热量。制造方法包括：获得焊料材料; 将焊料材料设置在要冷却的表面上; 回流和成形设置在待冷却表面上的焊料材料，以将焊料材料构成为具有从其延伸的多个翅片的基底。除了在待冷却的表面上原位配置，基底同时冶金结合到待冷却的表面上。构造为具有从其延伸的多个翅片的基底的焊料材料是通过其被冶金结合到要冷却的表面热连接到要冷却的表面的单个整体结构。

10. 发明授权

US07837352B2 Light source for illuminating an electronics rack to facilitate servicing thereof 有权
标题翻译：用于照亮电子机架以便于维修的光源
公开(公告)号：US07837352B2
公开(公告)日：2010-11-23
申请号：US11954272
申请日：2007-12-12
申请人： David P. Graybill , Madhusudan K. Iyengar , Jeffrey A. Newcomer , Roger R. Schmidt , Prabjit Singh , Gerard V. Weber
发明人： David P. Graybill , Madhusudan K. Iyengar , Jeffrey A. Newcomer , Roger R. Schmidt , Prabjit Singh , Gerard V. Weber
IPC分类号： F21S4/00
CPC分类号： H05K7/1488 , F21K9/00 , F21S4/20 , F21V21/30
摘要： An apparatus is provided for facilitating servicing of an electronics rack. The apparatus includes a light source, which includes a plurality of light-emitting diodes. The plurality of light-emitting diodes are secured to the electronics rack or a floor tile disposed adjacent to the electronics rack, and are configured to illuminate at least a lower portion of the electronics rack at either the air inlet or air outlet side of the rack. A power supply is also provided for selectively supplying power to the plurality of light-emitting diodes. In one implementation, the light source includes an elongate light bar, which is configured to mount to either the inlet door or outlet door of the electronics rack, and the plurality of light-emitting diodes are secured to an elongate housing structure which pivotally couples to a base plate for adjustment of a direction of illumination by the light-emitting diodes.
摘要翻译：提供了一种便于维护电子机架的装置。该装置包括一个包括多个发光二极管的光源。多个发光二极管被固定到电子机架或邻近电子机架设置的地板瓦片，并且被构造成在机架的空气入口或空气出口侧的至少一部分照明电子机架。还提供用于选择性地向多个发光二极管供电的电源。在一个实施方案中，光源包括细长的光条，其被配置为安装到电子机架的入口门或出口门，并且多个发光二极管被固定到细长的壳体结构，其被枢转地耦合到用于调节发光二极管的照明方向的基板。

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