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    • 1. 发明授权
    • Method for fabricating transistor structures having very short effective
channels
    • 制造具有非常短的有效通道的晶体管结构的方法
    • US4173818A
    • 1979-11-13
    • US910254
    • 1978-05-30
    • Ernest BassousTak H. NingCarlton M. Osburn
    • Ernest BassousTak H. NingCarlton M. Osburn
    • H01L21/033H01L21/265H01L21/336H01L21/8247H01L29/10H01L29/78H01L29/788H01L29/792B01J17/00
    • H01L29/7816H01L21/033H01L21/2652H01L29/1045H01L29/66659H01L29/66674H01L29/7801H01L29/7835
    • A method, including a sequence of process steps, for fabricating insulated gate field effect transistors having very short effective channel lengths. In a first version of the method, the source and drain regions of the device are opened in one process step and self-alignment of the source and the drain to the gate is achieved in one masking step. The drain region is then masked and the source side of the channel is implanted to adjust the threshold voltage of the high threshold voltage channel region. In a second version of the method, the source region is opened and self-aligned with the gate prior to the opening of drain region. Implantation to adjust the threshold voltage of the high threshold voltage channel region takes place before the drain region is opened, and then the drain region is opened and self-aligned with the gate in a further masking step. In either version, the threshold voltage is adjustable and the channel length is controlled to be a small value.
    • 一种包括一系列工艺步骤的方法,用于制造具有非常短的有效通道长度的绝缘栅场效应晶体管。 在该方法的第一版本中,器件的源极和漏极区域在一个处理步骤中被打开,并且在一个掩模步骤中实现源极和漏极到栅极的自对准。 然后对漏极区进行掩模,并且注入沟道的源极侧以调整高阈值电压沟道区的阈值电压。 在该方法的第二版本中,源极区域在漏极区域打开之前被打开并与栅极自对准。 在漏极区域打开之前进行用于调整高阈值电压沟道区域的阈值电压的植入,然后在另外的掩模步骤中,漏极区域被打开并与栅极自对准。 在任一版本中,阈值电压是可调节的,并且通道长度被控制为小的值。
    • 6. 发明授权
    • Germanium lateral bipolar junction transistor
    • 锗横向双极结晶体管
    • US08586441B1
    • 2013-11-19
    • US13611606
    • 2012-09-12
    • Jin CaiKevin K. ChanChristopher P. D'EmicBahman HekmatshoartabariTak H. NingDae-Gyu Park
    • Jin CaiKevin K. ChanChristopher P. D'EmicBahman HekmatshoartabariTak H. NingDae-Gyu Park
    • H01L21/331
    • H01L29/6625H01L29/161H01L29/735
    • A germanium lateral bipolar junction transistor (BJT) is formed employing a germanium-on-insulator (GOI) substrate. A silicon passivation layer is deposited on the top surface of a germanium layer in the GOI substrate. Shallow trench isolation structures, an extrinsic base region structure, and a base spacer are subsequently formed. A germanium emitter region, a germanium base region, and a germanium collector region are formed within the germanium layer by ion implantation. A silicon emitter region, a silicon base region, and a silicon collector region are formed in the silicon passivation layer. After optional formation of an emitter contact region and a collector contact region, metal semiconductor alloy regions can be formed. A wide gap contact for minority carriers is provided between the silicon base region and the germanium base region and between the silicon emitter region and the germanium emitter region.
    • 使用绝缘体上的锗(GOI)衬底形成锗横向双极结型晶体管(BJT)。 在GOI衬底的锗层的顶表面上沉积硅钝化层。 随后形成浅沟槽隔离结构,非本征基区结构和基底间隔物。 通过离子注入在锗层内形成锗发射极区,锗基区和锗集电极区。 在硅钝化层中形成硅发射极区域,硅基区域和硅集电极区域。 在可选地形成发射极接触区域和集电极接触区域之后,可以形成金属半导体合金区域。 在硅基区和锗基区之间以及硅发射极区和锗发射极区之间提供少量载流子的宽间隙接触。
    • 9. 发明授权
    • SOI SiGe-base lateral bipolar junction transistor
    • SOI SiGe基极横向双极结晶体管
    • US08420493B2
    • 2013-04-16
    • US13556372
    • 2012-07-24
    • Tak H. NingKevin K. ChanMarwan H. Khater
    • Tak H. NingKevin K. ChanMarwan H. Khater
    • H01L21/331H01L21/336
    • H01L29/7317H01L27/0821H01L27/1203H01L29/0808H01L29/165H01L29/66265
    • A lateral heterojunction bipolar transistor (HBT) is formed on a semiconductor-on-insulator substrate. The HBT includes a base including a doped silicon-germanium alloy base region, an emitter including doped silicon and laterally contacting the base, and a collector including doped silicon and laterally contacting the base. Because the collector current is channeled through the doped silicon-germanium base region, the HBT can accommodate a greater current density than a comparable bipolar transistor employing a silicon channel. The base may also include an upper silicon base region and/or a lower silicon base region. In this case, the collector current is concentrated in the doped silicon-germanium base region, thereby minimizing noise introduced to carrier scattering at the periphery of the base. Further, parasitic capacitance is minimized because the emitter-base junction area is the same as the collector-base junction area.
    • 在绝缘体上半导体衬底上形成横向异质结双极晶体管(HBT)。 HBT包括基底,其包括掺杂的硅 - 锗合金基底区域,包括掺杂硅并且横向接触基底的发射体,以及包括掺杂硅并且横向接触基底的收集器。 因为集电极电流被引导通过掺杂的硅 - 锗基区,所以与使用硅沟道的可比较的双极晶体管相比,HBT可以容纳更大的电流密度。 基底还可以包括上硅基区和/或下硅基区。 在这种情况下,集电极电流集中在掺杂的硅 - 锗基区域中,从而最小化引入到基极周边的载流子散射的噪声。 此外,寄生电容被最小化,因为发射极 - 基极结面积与集电极 - 基极结面积相同。