专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5591264A Spin coating device 失效
标题翻译：旋涂装置
公开(公告)号：US5591264A
公开(公告)日：1997-01-07
申请号：US405133
申请日：1995-03-16
申请人： Emi Sugimoto , Akira Yoshio , Yoshinori Ito
发明人： Emi Sugimoto , Akira Yoshio , Yoshinori Ito
IPC分类号： B05C11/08 , G03F7/16 , B05B13/00
CPC分类号： B05C11/08 , G03F7/162
摘要： A spin coating device for a substrate, in which a uniform thin film can be formed by applying an application liquid to a substrate and the quality of the substrate can be further improved. The spin coating device for a substrate comprises a turntable 2 for holding and rotating a substrate 1; an application liquid supply means 4 for supplying an application liquid 3 to the rotating substrate 1: splash preventing means 20, which are arranged at the periphery of the substrate 1 held by the turntable 2, prevent the droplets of the application liquid from splashing and provide with an opening portion 10 for circulating the flow A of external air in an area ranging from the central portion toward the peripheral portion of the substrate 1 held by the turntable 2. Exhaust means 8 and 9 for exhausting air from within the splash preventing means 20 are provided.
摘要翻译：用于基材的旋涂装置，其中可以通过将涂布液施加到基底上而形成均匀的薄膜，并且可以进一步提高基材的质量。用于基板的旋涂装置包括用于保持和旋转基板1的转盘2; 向旋转基板1供给涂布液3的涂布液供给装置4：设置在由转台2保持的基板1的周围的防溅装置20，防止涂布液的液滴飞溅，具有用于使外部空气流A在从由转台2保持的基板1的中心部分朝向周边部分的范围内循环的开口部分10.用于从防溅装置20内排出空气的排气装置8和9 被提供。

2. 发明授权

US06797623B2 Methods of producing and polishing semiconductor device and polishing apparatus 失效
标题翻译：半导体器件和抛光装置的制造和抛光方法
公开(公告)号：US06797623B2
公开(公告)日：2004-09-28
申请号：US09800580
申请日：2001-03-08
申请人： Shuzo Sato , Yuji Segawa , Akira Yoshio , Hiizu Ootorii , Zenya Yasuda , Masao Ishihara , Takeshi Nogami , Naoki Komai
发明人： Shuzo Sato , Yuji Segawa , Akira Yoshio , Hiizu Ootorii , Zenya Yasuda , Masao Ishihara , Takeshi Nogami , Naoki Komai
IPC分类号： H01L21302
CPC分类号： B24B37/042 , B23H5/08 , B24B37/046 , B24B37/16 , B24B37/26 , C25F3/30 , C25F7/00 , H01L21/3212 , H01L21/32125 , H01L21/7684 , H01L21/76843
摘要： A method of production and a method of polishing a semiconductor device and a polishing apparatus, capable of easily flattening an initial unevenness of a metal film, excellent in efficiency of removal of an excess metal film, and capable of suppressing damage to an interlayer insulation film below the metal film when flattening the metal film by polishing, the polishing method including the steps of interposing an electrolytic solution including a chelating agent between a cathode member and the copper film, applying a voltage between the cathode member used as a cathode and the copper film used as an anode to oxidize the surface of the copper film and forming a chelate film of the oxidized copper, selectively removing a projecting portion of the chelate film corresponding to the shape of the copper film to expose the projecting portion of the copper film at its surface, and repeating the above chelate film forming step and the above chelate film removing step until the projecting portion of the copper film is flattened.
摘要翻译：一种生产方法和抛光半导体器件和抛光装置的方法，其能够容易地平坦化金属膜的初始不均匀性，除去过量金属膜的效率优异，并且能够抑制对层间绝缘膜的损伤在通过抛光使金属膜平坦化时，金属膜下方的抛光方法包括以下步骤：在阴极构件和铜膜之间插入包含螯合剂的电解液，在用作阴极的阴极构件和铜膜用作氧化铜膜的表面并形成氧化铜的螯合膜，选择性地除去与铜膜形状相对应的螯合膜的突出部分，以暴露铜膜的突出部分并重复上述螯合膜形成步骤和上述螯合膜去除步骤，直到突出使铜膜变平。

3. 发明申请

US20070284247A1 Bioassay Substrate With Feeder Wirings 审中-公开
标题翻译：生物测定基板与馈线布线
公开(公告)号：US20070284247A1
公开(公告)日：2007-12-13
申请号：US10579044
申请日：2004-11-11
申请人： Akira Yoshio
发明人： Akira Yoshio
IPC分类号： C12M1/00
CPC分类号： G01N33/54366 , B01L3/5085 , B01L2300/0645 , B01L2300/0803
摘要： A contrivance is applied to the wiring configuration for securely feeding electricity to electrodes provided in a multiplicity of reaction regions arranged on a substrate, irrespectively of the arrangement configuration of the electrodes. A bioassay substrate being a disk-shaped substrate having such a configuration that reaction regions 2 to be fields for interactions between substances are arranged in multiplicity and electrodes E are provided in the reaction regions 2, wherein feeder wirings 401, 402 which are extended from a current passing portion or portions (for example, 36) provided at a central portion of the substrate 1 and which are connected to the electrodes E1, E2 in the reaction regions 2 are extended to entirely cover the whole area of the substrate.
摘要翻译：无论电极的布置结构如何，都将布线配置应用于布置在安装在基板上的多个反应区域中的电极的电力的布线配置。作为盘状基板的生物测定基板具有这样的结构：反应区域2设置在反应区域2内，反应区域2为从多个位置排列的用于物质之间的相互作用的反应区域2和电极E，其中馈线布线401,402从设置在基板1的中心部分并且与反应区域2中的电极E 1，E 2连接的电流通过部分（例如36）被延伸以完全覆盖基板的整个区域。

4. 发明申请

US20070051632A1 Polishing method, polishing apparatus, plating method, and plating apparatus 审中-公开
标题翻译：抛光方法，抛光装置，电镀方法和电镀装置
公开(公告)号：US20070051632A1
公开(公告)日：2007-03-08
申请号：US11590723
申请日：2006-10-31
申请人： Shuzo Sato , Yuji Segawa , Akira Yoshio , Takeshi Nogami
发明人： Shuzo Sato , Yuji Segawa , Akira Yoshio , Takeshi Nogami
IPC分类号： C25D5/02
CPC分类号： C25D5/02 , B24B37/042 , C25D5/04 , C25D7/123 , C25D17/001 , C25D21/12 , C25F3/16 , C25F7/00 , H01L21/2885 , H01L21/32115 , H01L21/3212 , H01L21/7684 , H01L21/76888
摘要： A polishing method and polishing apparatus able to easily flatten an initial unevenness with an excellent efficiency of removal of excess copper film and suppress damage to a lower interlayer insulation film, and a plating method and plating apparatus able to deposit a flat copper film. The polishing method comprises the steps of measuring thickness equivalent data of a film on a wafer, making a cathode member smaller than the surface face a region thereof, interposing an electrolytic solution between the surface and the cathode member, applying a voltage using the cathode member as a cathode and the film an anode, performing electrolytic polishing by electrolytic elution or anodic oxidation and chelation and removal of a chelate film in the same region preferentially from projecting portions of the film until removing the target amount of film obtained from the thickness equivalent data, and repeating steps of moving the cathode member to another region to flattening the regions over the entire surface. Further, plating is performed by a reverse reaction of the above.
摘要翻译：一种抛光方法和抛光装置，其能够以极好的去除多余的铜膜的效率并且抑制对下层间绝缘膜的损坏而容易地平坦化初始凹凸，以及能够沉积扁平铜膜的电镀方法和电镀装置。抛光方法包括以下步骤：测量晶片上的膜的厚度当量数据，使阴极部件小于表面面积的阴极部件，在电极表面和阴极部件之间插入电解液，使用阴极部件施加电压作为阴极，膜是阳极，通过电解洗脱或阳极氧化进行电解抛光，并优先从膜的突出部分螯合并除去相同区域中的螯合膜，直到从厚度等效数据中除去目标量的膜并且重复将阴极部件移动到另一区域以使整个表面上的区域变平的步骤。此外，通过上述的反作用进行电镀。

5. 发明申请

US20050112548A1 Unit for detecting interaction between substances utilizing capillarity, and method and bioassay substrate using the detecting unit 审中-公开
标题翻译：用于检测利用毛细管作用的物质之间的相互作用的单元，以及使用该检测单元的方法和生物测定底物
公开(公告)号：US20050112548A1
公开(公告)日：2005-05-26
申请号：US10955278
申请日：2004-09-30
申请人： Yuji Segawa , Akira Yoshio
发明人： Yuji Segawa , Akira Yoshio
IPC分类号： G01N33/53 , B01L3/00 , C12M1/00 , C12N15/09 , G01N21/11 , G01N21/64 , G01N33/566 , G01N37/00 , C12Q1/68 , C12M1/34
CPC分类号： G01N21/11 , B01L3/502715 , B01L2200/0647 , B01L2200/0663 , B01L2300/0654 , B01L2300/0887 , B01L2400/0406 , B01L2400/0415 , G01N21/645 , G01N2021/6482
摘要： Disclosed herein is a unit for detecting an interaction between substances, including a reaction region for providing sites for the interaction between the substances, at least one pair of opposite electrodes disposed oppositely to each other so as to make it possible to impress an electric field on a medium contained in the reaction region, and an injection hole and an exhaust hole for feeding the medium containing the substances into the reaction region by capillarity.
摘要翻译：本文公开了一种用于检测物质之间相互作用的单元，包括用于提供物质之间的相互作用的位置的反应区域，彼此相对设置的至少一对相对电极，以使得可以将电场施加包含在反应区域中的介质，以及用于通过毛细管作用将含有物质的介质输送到反应区域中的注入孔和排气孔。

6. 发明申请

US20080220136A1 Method for Producing Dried Foods to be Eaten After Cooked or Reconstituted with Hot Water, and Dried Noodles 审中-公开
标题翻译：用热水和干面煮熟或重新配制后生产干食物的方法
公开(公告)号：US20080220136A1
公开(公告)日：2008-09-11
申请号：US10582664
申请日：2004-12-22
申请人： Keiichi Ookubo , Nobuaki Matsuzawa , Akira Yoshio
发明人： Keiichi Ookubo , Nobuaki Matsuzawa , Akira Yoshio
IPC分类号： A23L1/16
CPC分类号： A23L7/113 , A23L7/109
摘要： To provide a method for manufacturing, etc., dried foods that can be cooked or reconstituted in hot water in a short time and have a good texture and a good unraveling property. [Solution Means] A dried food is manufactured by subjecting a to-be-processed object, obtained by shaping a prepared object of a raw material containing starchy matter to a predetermined shape, to at least: (1) a first step P1 of performing a boiling treatment; (2) a second step P2 of putting the boiled to-be-processed object in contact with an aqueous solution after the abovementioned first step P1; and (3) a third step P3 of subjecting the to-be-processed object, subjected to the abovementioned second step P2, to a wind drying treatment at conditions of a temperature of 45 to 100° C. and a humidity of 5 to less than 55%.
摘要翻译：为了提供制造方法等，可以在短时间内在热水中煮熟或重构并具有良好的质地和良好的分解性能的干燥食品。 [解决方案]通过将含有淀粉质的原料的制备对象成形为预定形状的待处理物体至少至少：（1）第一步骤P _{1 进行沸腾处理; （2）在上述第一步骤P 1之后将煮沸的被处理物体与水溶液接触的第二步骤P 2> 2; 和（3）将经受上述第二步骤P＆lt; 2＆gt;的待处理物体进行风干处理的第三步骤P 3 3 温度为45〜100℃，湿度为5〜小于55％。}

7. 发明授权

US07186322B2 Methods of producing and polishing semiconductor device and polishing apparatus 有权
标题翻译：半导体器件和抛光装置的制造和抛光方法
公开(公告)号：US07186322B2
公开(公告)日：2007-03-06
申请号：US10327860
申请日：2002-12-26
申请人： Shuzo Sato , Yuji Segawa , Akira Yoshio , Hiizu Ootorii , Zenya Yasuda , Masao Ishihara , Takeshi Nogami , Naoki Komai
发明人： Shuzo Sato , Yuji Segawa , Akira Yoshio , Hiizu Ootorii , Zenya Yasuda , Masao Ishihara , Takeshi Nogami , Naoki Komai
IPC分类号： C25D17/00
CPC分类号： B24B37/042 , B23H5/08 , B24B37/046 , B24B37/16 , B24B37/26 , C25F3/30 , C25F7/00 , H01L21/3212 , H01L21/32125 , H01L21/7684 , H01L21/76843
摘要： A method of production and a method of polishing a semiconductor device and a polishing apparatus, capable of easily flattening an initial unevenness of a metal film, excellent in efficiency of removal of an excess metal film, and capable of suppressing damage to an interlayer insulation film below the metal film when flattening the metal film by polishing, the polishing method including the steps of interposing an electrolytic solution including a chelating agent between a cathode member and the copper film, applying a voltage between the cathode member used as a cathode and the copper film used as an anode to oxidize the surface of the copper film and forming a chelate film of the oxidized copper, selectively removing a projecting portion of the chelate film corresponding to the shape of the copper film to expose the projecting portion of the copper film at its surface, and repeating the above chelate film forming step and the above chelate film removing step until the projecting portion of the copper film is flattened.
摘要翻译：一种生产方法和抛光半导体器件和抛光装置的方法，其能够容易地平坦化金属膜的初始不均匀性，除去过量金属膜的效率优异，并且能够抑制对层间绝缘膜的损伤在通过抛光使金属膜平坦化时，金属膜下方的抛光方法包括以下步骤：在阴极构件和铜膜之间插入包含螯合剂的电解液，在用作阴极的阴极构件和铜膜用作氧化铜膜的表面并形成氧化铜的螯合膜，选择性地除去与铜膜形状相对应的螯合膜的突出部分，以暴露铜膜的突出部分并重复上述螯合膜形成步骤和上述螯合膜去除步骤，直到突出使铜膜变平。

8. 发明申请

US20060127904A1 Hybridization sensing part, sensor chip, and hybridization method 审中-公开
标题翻译：杂交感测部分，传感器芯片和杂交方法
公开(公告)号：US20060127904A1
公开(公告)日：2006-06-15
申请号：US10525714
申请日：2003-08-20
申请人： Yuji Segawa , Takayoshi Mamine , Yasuhiro Sakamoto , Akira Yoshio , Takuro Yamamoto
发明人： Yuji Segawa , Takayoshi Mamine , Yasuhiro Sakamoto , Akira Yoshio , Takuro Yamamoto
IPC分类号： C12Q1/68 , C12M1/34
CPC分类号： B01J19/0046 , B01J2219/00436 , B01J2219/00529 , B01J2219/00576 , B01J2219/00596 , B01J2219/00608 , B01J2219/0061 , B01J2219/00612 , B01J2219/0063 , B01J2219/00653 , B01J2219/00713 , B01J2219/00722 , B01L3/502761 , B01L2200/0663 , B01L2300/0819 , B01L2400/0424 , B03C5/005 , B03C5/026 , G01N33/54373
摘要： The present invention provides a hybridization detector (1a) and the like that are improved in the hybridization efficiency by arraying nucleotide probes in a stretched form, a sensor chip including the hybridization detector (1a) or the like, and a method of hybridization using these detectors or the chip. The hybridization detector (la) and the like include a reaction region (R) for hybridization between the nucleotide probes (X) and target nucleotide sequences (Y) having a base sequence complementary to the nucleotide probes (X). The reaction region (R) has a configuration for stretching the nucleotide probes (X) by an electric field and immobilizing the nucleotide probes (X) on ends (E) of scanning electrodes (C) by dielectrophoresis.
摘要翻译：本发明提供了通过以拉伸形式排列核苷酸探针而提高杂交效率的杂交检测器（1a）等，包括杂交检测器（1a）的传感器芯片等，以及杂交方法使用这些探测器或芯片。杂交检测器（1a）等包括核苷酸探针（X）和碱基序列与核苷酸探针（X）互补的靶核苷酸序列（Y）之间进行杂交的反应区域（R）。反应区域（R）具有通过电场拉伸核苷酸探针（X）的构造，并且通过介电电泳将扫描电极（C）的端部（E）固定在核苷酸探针（X）上。

9. 发明授权

US06534117B1 Electroless plating method and electroless plating solution 失效
标题翻译：化学镀方法和化学镀溶液
公开(公告)号：US06534117B1
公开(公告)日：2003-03-18
申请号：US09607934
申请日：2000-06-30
申请人： Akira Yoshio , Yuji Segawa , Naoki Komai
发明人： Akira Yoshio , Yuji Segawa , Naoki Komai
IPC分类号： B05D722
CPC分类号： C23C18/40 , H05K3/422
摘要： When a barrier layer formed on a surface of a contact hole is subjected to electroless plating of copper, a salt of a metal such as gold, nickel, palladium, cobalt or platinum is added as a plating accelerator in an amount of 1 mol % or less based on a copper salt in a composition of an electroless plating solution, whereby the metal having the higher catalytic activity than copper is precipitated before precipitation of copper, and copper can then be precipitated as a good-quality plated film.
摘要翻译：当形成在接触孔表面上的阻挡层进行铜的无电镀时，加入金，镍，钯，钴或铂等金属的盐作为电镀促进剂，其量为1摩尔％或更少的是基于化学镀溶液组成中的铜盐，由此在铜沉淀之前沉积具有比铜更高的催化活性的金属，然后可以将铜沉淀为优质的镀膜。

10. 发明授权

US06855634B2 Polishing method and polishing apparatus 失效
标题翻译：抛光方法和抛光装置
公开(公告)号：US06855634B2
公开(公告)日：2005-02-15
申请号：US09963966
申请日：2001-09-26
申请人： Shuzo Sato , Yuji Segawa , Akira Yoshio , Takeshi Nogami
发明人： Shuzo Sato , Yuji Segawa , Akira Yoshio , Takeshi Nogami
IPC分类号： B23H5/08 , B24B37/04 , H01L21/304 , H01L21/321 , H01L21/768 , H01L21/302
CPC分类号： H01L21/3212 , B24B37/042 , H01L21/76807
摘要： A polishing method able to easily flatten unevenness formed on the surface of a film to be polished and able to efficiently polish the film flat while suppressing damage to an interlayer insulating film below the film, comprising, when polishing an object having a film such as an interconnection layer formed burying interconnection grooves formed in an insulating film of a substrate, supplying a polishing solution over the surface to be polished at least substantially parallel to the surface to preferentially remove by polishing the projecting portions of the film and flatten the surface by the shear stress of the processing solution or arranging a cathode member facing the surface and supplying an electrolytic solution containing a chelating agent between the surface and cathode member while supplying voltage between the film and the cathode member to preferentially remove by polishing the projecting portions of the film and flatten the surface by the shear stress of the electrolytic solution, and a polishing apparatus using the same.
摘要翻译：一种抛光方法，其能够容易地使形成在待研磨的膜的表面上的凹凸变平，并且能够有效地抛光该薄膜，同时抑制薄膜下面的层间绝缘膜的损坏，其特征在于，当研磨具有诸如互连层形成在衬底的绝缘膜中形成的互连槽，将至少基本上平行于表面的待抛光表面上的抛光溶液提供给抛光层，以优先通过抛光膜的突出部分并通过剪切使表面变平处理溶液的应力或者配置面向表面的阴极部件，并在表面和阴极部件之间提供含有螯合剂的电解液，同时在膜和阴极部件之间提供电压，以通过抛光膜的突出部分优先除去，通过电解质的剪切应力使表面变平溶液和使用其的抛光装置。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式