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    • 5. 发明授权
    • Polymer dispersions as an additive in building materials
    • 聚合物分散体作为建筑材料中的添加剂
    • US06809148B1
    • 2004-10-26
    • US10383609
    • 2003-03-10
    • Markus KoppersJoachim PakuschHermann AndersMarco SchmidtHans-Jürgen Denu
    • Markus KoppersJoachim PakuschHermann AndersMarco SchmidtHans-Jürgen Denu
    • C08F22010
    • C04B24/2641C04B24/2647C04B24/2676C04B24/2688C04B28/02C04B2103/0057C04B2111/00586C04B2111/0075C08F212/04C08F236/10C08F290/062
    • Polymer dispersions comprise at least one copolymer which contains, as polymerized monomers, a) from 25 to 70% by weight of at least one conjugated aliphatic diene, b) from 25 to 70% by weight of at least one vinylaromatic monomer, c) from 2.5 to 15% by weight of at least one monoester of a C2-C10-alkanediol with acrylic acid or methacrylic acid or c′) from 0.1 to 10% by weight of at least one alkylpolyethylene glycol (meth)acrylate of the formula (I) where R1 is hydrogen or methyl, R2 is C1-C4-alkyl and n is an integer from 1 to 100, or c″) from 2 to 15% by weight of a mixture of the monoester c) and the alkylpolyethylene glycol (meth)acrylate c′), d) from 0 to 1.0% by weight of ethylenically unsaturated monomers which have at least one acid group, or salts thereof, e) from 0 to 5.0% by weight of ethylenically unsaturated nitriles and f) from 0 to 1.0% by weight of amides of &agr;,&bgr;-ethylenically unsaturated mono- and dicarboxylic acids. The polymer dispersions described are suitable, inter alia, as additives in building materials based on hydraulic binders.
    • 聚合物分散体包含至少一种共聚物,其包含作为聚合单体的a)25至70重量%的至少一种共轭脂族二烯,b)25至70重量%的至少一种乙烯基芳族单体,c) 2.5至15重量%的至少一种C2-C10-链烷二醇与丙烯酸或甲基丙烯酸orc'的单酯)0.1至10重量%的至少一种式(I)的烷基聚乙二醇(甲基)丙烯酸酯, 其中R 1是氢或甲基,R 2是C 1 -C 4 - 烷基,n是1至100的整数,orc“)2至15重量%的单酯c)和 烷基聚乙二醇(甲基)丙烯酸酯c'),d)0至1.0重量%的具有至少一个酸基的烯键式不饱和单体或其盐,e)0-5.0重量%的烯属不饱和腈和 )0至1.0重量%的α,β-烯键式不饱和单羧酸和二羧酸的酰胺。所述聚合物分散体是合适的,i 特别是作为基于水泥粘合剂的建筑材料中的添加剂。
    • 7. 发明授权
    • Thermoplastic molding composition comprising microencapsulated latent-heat-accumulator material
    • 包含微胶囊潜热蓄热材料的热塑性模塑组合物
    • US08957122B2
    • 2015-02-17
    • US13988419
    • 2011-11-21
    • Stephan AltmannDirk OpfermannTina Schroeder-GrimonpontMarco Schmidt
    • Stephan AltmannDirk OpfermannTina Schroeder-GrimonpontMarco Schmidt
    • C08J5/00C08J5/18C09K5/06C08L47/00C08L23/06C08L29/10
    • C08L47/00C08L23/06C08L29/10C08L2205/20C09K5/063Y10T428/2984Y10T428/2985Y10T428/2987Y10T428/2989
    • A thermoplastic molding composition is provided, which comprises A) from 30 to 90% by weight of at least one thermoplastic polymer, B) from 10 to 70% by weight of microcapsules with a capsule core made of latent-heat-accumulator material and a polymer as capsule wall, where the latent-heat-accumulator material has its solid/liquid phase transition in the temperature range from −20° C. to 120° C., and C) from 0 to 60% by weight of one or more further additive, where each of the percentages by weight is based on the total weight of components A) to C) and these give a total of 100% by weight, obtainable via mixing in the melt of components A), B), and optionally C) in a multiscrew extruder, where the multiscrew extruder comprises, along the direction of conveying, in this sequence, at least one feed zone, one plastifying zone, one homogenizing zone, and one discharge zone, and the feed of the microcapsules B) into the multiscrew extruder takes place at a site after—in the direction of conveying—the plastifying zone. And also a process for producing the composition and uses of the composition for producing fibers, foils, moldings, and foams are provided.
    • 提供一种热塑性模塑组合物,其包含A)30至90重量%的至少一种热塑性聚合物,B)10至70重量%的具有由潜热蓄热材料制成的胶囊芯的微胶囊,以及 聚合物作为胶囊壁,其中潜热蓄热材料在-20℃至120℃的温度范围内具有固/液相转变,C)0至60重量%的一种或多种 进一步的添加剂,其中每个重量百分比基于组分A)至C)的总重量,并且这些总重量通过在组分A),B)和任选地 C)在多螺旋挤出机中,其中多螺旋挤出机沿着输送方向按照该顺序包括至少一个进料区,一个增塑区,一个均化区和一个排出区,以及微胶囊B)的进料, 进入多螺旋挤压机是在一个现场进行的 的输送 - 增塑区。 还提供了用于生产纤维,箔,模制品和泡沫的组合物的组合物和用途的方法。
    • 8. 发明授权
    • Electronic power circuit of several power modules
    • 几个电源模块的电子电路
    • US06700191B2
    • 2004-03-02
    • US10102900
    • 2002-03-22
    • Ralf SchmidMarco SchmidtJohann SontheimHelmut Perkounigg
    • Ralf SchmidMarco SchmidtJohann SontheimHelmut Perkounigg
    • H01L2352
    • H05K7/1432H01L2924/0002H02M7/003H01L2924/00
    • An electronic power circuit includes several power modules (1) and is especially for controlling an electrical machine. Each power module (1) includes a plate-shaped integrated electronic circuit arrangement (2) having several electrical terminals. A perpendicular bent-over electrically conducting side leg (3) is arranged on each of two opposite-lying sides of the plate-shaped circuit arrangement (2). The side leg (3) forms an electrical contact and, in this way, the power module (1) has a U-shaped cross section. Each side leg (3) is provided with connecting elements via which two or several power modules (1) can be electrically and mechanically fixedly connected to each other while forming a mutual spacing between the plate-shaped circuit arrangement (2) via the side legs (3) for forming the electronic power circuit.
    • 电子电源电路包括数个电源模块(1),特别用于控制电机。 每个电源模块(1)包括具有多个电气端子的板状集成电子电路装置(2)。 在板状电路装置(2)的两个相对的侧面的每一个上布置有垂直弯曲的导电侧腿(3)。 侧腿(3)形成电接触,并且以这种方式,电源模块(1)具有U形横截面。 每个侧腿(3)设置有连接元件,通过该连接元件,两个或多个功率模块(1)可以彼此电气和机械地固定连接,同时通过侧腿形成板状电路装置(2)之间的相互间隔 (3),用于形成电子电路。