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    • 10. 发明授权
    • Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith
    • 含有具有特定骨架的添加剂化合物的铜电解液和由其制造的电解铜箔
    • US07824534B2
    • 2010-11-02
    • US10588686
    • 2005-12-09
    • Katsuyuki TsuchidaHironori KobayashiMasashi Kumagai
    • Katsuyuki TsuchidaHironori KobayashiMasashi Kumagai
    • C25D3/38
    • C25D1/04C25D3/38
    • The object of the present invention is to obtain a low profile electrolytic copper foil with a low surface roughness at the rough surface side (opposite side from the glossy side) in the electrolytic copper foil manufacture using a cathode drum and, particularly, to obtain an electrolytic copper foil with excellent elongation and tensile strength that permits fine patterning. Another object is to obtain a copper electrolytic solution that allows uniform copper plating without pinholes on a 2-layer flexible substrate. This copper electrolytic solution contains, as an additive, a compound having the specific skeleton represented by General Formula (1) below which is obtained by an addition reaction in which water is added to a compound having in a molecule one or more epoxy groups: wherein A is an epoxy compound residue and n is an integer of 1 or more.
    • 本发明的目的是在使用阴极鼓的电解铜箔制造中,在粗糙表面侧(与光面相反的一侧)获得具有低表面粗糙度的薄型电解铜箔,特别是获得 电解铜箔具有优异的伸长率和拉伸强度,可以进行精细图案化。 另一个目的是获得一种铜电解溶液,其允许在2层柔性基板上均匀镀铜而没有针孔。 该铜电解液含有作为添加剂的具有下述通式(1)表示的特定骨架的化合物,其通过加成反应获得,其中将水加入到分子中具有一个或多个环氧基的化合物:其中 A是环氧化合物残基,n是1以上的整数。