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    • 2. 发明授权
    • Method for manufacturing electronic component
    • 电子元件制造方法
    • US06681484B1
    • 2004-01-27
    • US09652953
    • 2000-08-31
    • Eiichi NagatsukaToshio KitagawaAkito AsakuraMasaki KitagawaAkihiko Ueyama
    • Eiichi NagatsukaToshio KitagawaAkito AsakuraMasaki KitagawaAkihiko Ueyama
    • H01R4302
    • H01R43/0214Y10T29/49117Y10T29/49179Y10T29/49213
    • The present invention provide a resistance welding method for solving the problem of breakage of the welded portion by corrosion of an iron-copper alloy layer having a poor corrosion resistance formed at the welding portion, when a first metallic member comprising an iron-based metal is joined to a second metallic member comprising a copper based metal, wherein the problem above is solved by forming a nickel film on at least one surface of the first metallic member comprising the iron-based metal and the second metallic member comprising the copper-based metal to be joined, and by applying resistance welding while the first metallic member is made to butt against the second metallic member, thereby forming the first alloy layer containing nickel, copper and iron at the side of the first metallic member, and the second alloy layer containing nickel and copper at the side of the second metallic member to allow the alloy layers to exhibit an excellent corrosion resistance.
    • 本发明提供了一种电阻焊接方法,当包含铁基金属的第一金属构件是包含铁基金属的第一金属构件时,通过在焊接部形成的耐腐蚀性差的铁 - 铜合金层的腐蚀来解决焊接部分断裂的问题 连接到包括铜基金属的第二金属构件,其中通过在包括铁基金属的第一金属构件的至少一个表面上形成镍膜并且包括铜基金属的第二金属构件来解决上述问题 并且通过在使第一金属构件对接第二金属构件的同时施加电阻焊接,从而在第一金属构件的侧面形成包含镍,铜和铁的第一合金层,并且第二合金层 在第二金属构件的侧面含有镍和铜,以使合金层具有优异的耐腐蚀性。