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    • 1. 发明授权
    • Chip coil
    • 芯片线圈
    • US07081804B2
    • 2006-07-25
    • US11010417
    • 2004-12-14
    • Masaki Kitagawa
    • Masaki Kitagawa
    • H01F5/00
    • H01F17/045H01F27/292
    • Electrodes of a chip coil are provided at no magnetic flux concentrated positions of a core of the chip coil. In other words, the chip coil has a configuration where: lead frames are provided at the center of the length of both brims of the core; conductive parts and the ends of a conductive wire are connected to internal electrodes, which are made of thin metal films and provided on both brims, respectively; and external electrodes are extended so as to protrude from the sides of a core drum. This reduces magnetic loss and prevents deterioration of characteristics and the Q value due to the electrodes.
    • 芯片线圈的电极不设置在芯片线圈的芯的磁通集中位置。 换句话说,芯片线圈具有以下结构:引线框设置在芯的两个边缘的长度的中心; 导电部分和导线的端部分别连接到由薄金属膜制成并分别设置在两个边缘上的内部电极; 并且外部电极被延伸以从芯鼓的侧面突出。 这减小了磁损耗并且防止由于电极导致的特性劣化和Q值的劣化。
    • 8. 发明申请
    • Chip coil and printed circuit board for the same
    • 芯片线圈和印刷电路板相同
    • US20050057334A1
    • 2005-03-17
    • US10923508
    • 2004-08-23
    • Masaki Kitagawa
    • Masaki Kitagawa
    • H01F17/04H01F27/06H01F27/29H05K1/18H05K3/34H01F27/02
    • H05K1/181H01F17/045H01F27/292H05K3/3442H05K2201/09781H05K2201/1003H05K2201/10636Y02P70/611
    • Electrodes and land patterns are provided at no magnetic flux concentrated positions or at positions that influence the magnetic fluxes issued from the core of a chip coil. In other words, the present invention has a configuration where a pair of electrodes 15 and 16 is formed at the center of a base 1 on which a core 2 of a chip coil 10 is mounted, lead frames 115 and 116 are provided at the center of the length of both brims 105 and 106 of a core 102, conductive parts 125a and 126a and the ends of a conductive wire are connected to internal electrodes 123 and 124 which are provided on both brims, respectively, and external electrodes 125b and the like are extended so as to protrude from the sides of a core drum 104. In addition, the signal patterns and the land patterns are arranged at the positions that do not allow overlapping with the brims 5 and 6 of the core of the chip coil. This allows implementation of a chip coil and a printed circuit board for the same that allow reduction in magnetic loss.
    • 在没有磁通集中位置或影响从芯片线圈的芯发出的磁通量的位置处提供电极和焊盘图案。 换句话说,本发明具有这样的结构,其中一对电极15和16形成在其上安装有芯片线圈10的芯2的基座1的中心处,引线框架115和116设置在中心 在芯102的两边缘105和106的长度上,导电部分125a和126a以及导线的端部分别连接到设置在两个边缘上的内部电极123和124以及外部电极125b等 被延伸以从芯鼓104的侧面突出。此外,信号图案和焊盘图案被布置在不允许与芯片线圈的芯的边缘5和6重叠的位置处。 这允许实现能够减少磁损耗的芯片线圈和印刷电路板。
    • 10. 发明授权
    • Method for manufacturing electronic component
    • 电子元件制造方法
    • US06681484B1
    • 2004-01-27
    • US09652953
    • 2000-08-31
    • Eiichi NagatsukaToshio KitagawaAkito AsakuraMasaki KitagawaAkihiko Ueyama
    • Eiichi NagatsukaToshio KitagawaAkito AsakuraMasaki KitagawaAkihiko Ueyama
    • H01R4302
    • H01R43/0214Y10T29/49117Y10T29/49179Y10T29/49213
    • The present invention provide a resistance welding method for solving the problem of breakage of the welded portion by corrosion of an iron-copper alloy layer having a poor corrosion resistance formed at the welding portion, when a first metallic member comprising an iron-based metal is joined to a second metallic member comprising a copper based metal, wherein the problem above is solved by forming a nickel film on at least one surface of the first metallic member comprising the iron-based metal and the second metallic member comprising the copper-based metal to be joined, and by applying resistance welding while the first metallic member is made to butt against the second metallic member, thereby forming the first alloy layer containing nickel, copper and iron at the side of the first metallic member, and the second alloy layer containing nickel and copper at the side of the second metallic member to allow the alloy layers to exhibit an excellent corrosion resistance.
    • 本发明提供了一种电阻焊接方法,当包含铁基金属的第一金属构件是包含铁基金属的第一金属构件时,通过在焊接部形成的耐腐蚀性差的铁 - 铜合金层的腐蚀来解决焊接部分断裂的问题 连接到包括铜基金属的第二金属构件,其中通过在包括铁基金属的第一金属构件的至少一个表面上形成镍膜并且包括铜基金属的第二金属构件来解决上述问题 并且通过在使第一金属构件对接第二金属构件的同时施加电阻焊接,从而在第一金属构件的侧面形成包含镍,铜和铁的第一合金层,并且第二合金层 在第二金属构件的侧面含有镍和铜,以使合金层具有优异的耐腐蚀性。