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    • 2. 发明授权
    • Supported plasma sputtering apparatus for high deposition rate over
large area
    • 用于大面积高沉积速率的支撑等离子体溅射装置
    • US4038171A
    • 1977-07-26
    • US672402
    • 1976-03-31
    • Ronald W. MossEdwin D. McClanahan, Jr.Nils Laegreid
    • Ronald W. MossEdwin D. McClanahan, Jr.Nils Laegreid
    • C23C14/34C23C15/00
    • C23C14/3478
    • A supported plasma sputtering apparatus is described having shaped electrical fields in the electron discharge region between the cathode and anode and the sputter region between the target and substrate while such regions are free of any externally applied magnetic field to provide a high deposition rate which is substantially uniform over a wide area. Plasma shaping electrodes separate from the anode and target shape the electrical fields in the electron discharge region and the sputter region to provide a high density plasma. The anode surrounds the target to cause substantially uniform sputtering over a large target area. In one embodiment the anode is in the form of an annular ring surrounding a flat target surface, such anode being provided with a ribbed upper surface which shields portions of the anode from exposure to sputtered material to maintain the electron discharge for a long stable operation. Several other embodiments accomplish the same result by using different anodes which either shield the anode from sputtered material, remove the sputtered coating on the anode by heating, or simultaneously mix sputtered metal from the auxiliary target with sputtered insulator from the main target so the resultant coating is conductive. A radio frequency potential alone or together with a D.C. potential, may be applied to the target for a greater sputtering rate.
    • 3. 发明授权
    • Deposited films with improved microstructures
    • 具有改进微结构的沉积膜
    • US4468437A
    • 1984-08-28
    • US350738
    • 1982-02-22
    • James W. PattenRonald W. MossEdwin D. McClanahan
    • James W. PattenRonald W. MossEdwin D. McClanahan
    • C23C14/00C23C14/22C23C14/50B22F7/08C23C13/00
    • C23C14/22C23C14/00C23C14/505Y10S428/938Y10T428/12063
    • Methods for improving microstructures of line-of-sight deposited films are described. Columnar growth defects ordinarily produced by geometrical shadowing during deposition of such films are eliminated without resorting to post-deposition thermal or mechanical treatments. The native, as-deposited coating qualities, including homogeneity, fine grain size, and high coating-to-substrate adherence, can thus be retained. The preferred method includes the steps of emitting material from a source toward a substrate to deposit a coating non-uniformly on the substrate surface, removing a portion of the coating uniformly over the surface, again depositing material onto the surface, but from a different direction, and repeating the foregoing steps. The quality of line-of-sight deposited films such as those produced by sputtering, progressively deteriorates as the angle of incidence between the flux and the surface becomes increasingly acute. Depositing non-uniformly, so that the coating becomes progressively thinner as quality deteriorates, followed by uniformly removing some of the coating, such as by resputtering, eliminates the poor quality portions, leaving only high quality portions of the coating. Subsequently sputtering from a different direction applies a high quality coating to other regions of the surface. Such steps can be performed either simultaneously or sequentially to apply coatings of a uniformly high quality, closed microstructure to three-dimensional or large planar surfaces.
    • 描述了改善视线沉积膜微观结构的方法。 通常在这样的膜沉积期间通常由几何阴影产生的柱状生长缺陷,而不需要采用后沉积热或机械处理。 因此,可以保留原始的,沉积的涂层质量,包括均匀性,细晶粒度和高涂层对基底的粘附。 优选的方法包括以下步骤:将材料从源极发射到衬底,以将衬底不均匀地沉积在衬底表面上,将涂层的一部分均匀地去除在表面上,再次将材料沉积到表面上,但是从不同的方向 ,并重复上述步骤。 像通过溅射制造的那样的视线沉积膜的质量随着焊剂与表面之间的入射角变得越来越尖锐而逐渐恶化。 沉积不均匀,使得随着质量恶化,涂层逐渐变薄,随后通过再溅射均匀地除去一些涂层,消除质量差的部分,仅留下涂层的高质量部分。 随后从不同方向进行溅射,将高质量涂层施加到表面的其它区域。 这种步骤可以同时或顺序地进行,以将均匀高质量的封闭微结构的涂层施加到三维或大的平面表面。
    • 4. 发明授权
    • Methods for making deposited films with improved microstructures
    • 制备具有改善微结构的沉积膜的方法
    • US4336118A
    • 1982-06-22
    • US131922
    • 1980-03-21
    • James W. PattenRonald W. MossEdwin D. McClanahan
    • James W. PattenRonald W. MossEdwin D. McClanahan
    • C23C14/00C23C14/22C23C14/34C23C14/42C23C14/50C23C15/00
    • C23C14/00C23C14/22C23C14/505
    • Methods for improving microstructures of line-of-sight deposited films are described. Columnar growth defects ordinarily produced by geometrical shadowing during deposition of such films are eliminated without resorting to post-deposition thermal or mechanical treatments. The native, as-deposited coating qualities, including homogeneity, fine grain size, and high coating-to-substrate adherence, can thus be retained. The preferred method includes the steps of emitting material from a source toward a substrate to deposit a coating non-uniformly on the substrate surface, removing a portion of the coating uniformly over the surface, again depositing material onto the surface, but from a different direction, and repeating the foregoing steps. The quality of line-of-sight deposited films such as those produced by sputtering, progressively deteriorates as the angle of incidence between the flux and the surface becomes increasingly acute. Depositing non-uniformly, so that the coating becomes progressively thinner as quality deteriorates, followed by uniformly removing some of the coating, such as by resputtering, eliminates the poor quality portions, leaving only high quality portions of the coating. Subsequently sputtering from a different direction applies a high quality coating to other regions of the surface. Such steps can be performed either simultaneously or sequentially to apply coatings of a uniformly high quality, closed microstructure to three-dimensional or larger planar surfaces.
    • 描述了改善视线沉积膜微观结构的方法。 通常在这样的膜沉积期间通常由几何阴影产生的柱状生长缺陷,而不需要采用后沉积热或机械处理。 因此,可以保留原始的,沉积的涂层质量,包括均匀性,细晶粒度和高涂层对基底的粘附。 优选的方法包括以下步骤:将材料从源极发射到衬底,以将衬底不均匀地沉积在衬底表面上,将涂层的一部分均匀地去除在表面上,再次将材料沉积到表面上,但是从不同的方向 ,并重复上述步骤。 像通过溅射制造的那样的视线沉积膜的质量随着焊剂与表面之间的入射角变得越来越尖锐而逐渐恶化。 沉积不均匀,使得随着质量恶化,涂层逐渐变薄,随后通过再溅射均匀地除去一些涂层,消除质量差的部分,仅留下涂层的高质量部分。 随后从不同方向进行溅射,将高质量涂层施加到表面的其它区域。 这种步骤可以同时或顺序地进行,以将均匀高质量的封闭微结构的涂层施加到三维或更大的平面表面。