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1. 发明专利

JP2004197169A Method for forming copper electric wiring on substrate 有权
公开(公告)号：JP2004197169A
公开(公告)日：2004-07-15
申请号：JP2002367469
申请日：2002-12-19
申请人： Ebara Corp , Ebara Udylite Kk , Hidemi Nawafune , 株式会社荏原製作所 , 秀美縄舟 , 荏原ユージライト株式会社
发明人： FUKUNAGA AKIRA , ONO KANJI , KIMIZUKA RYOICHI , MATSUMOTO MORIHARU , NAWAFUNE HIDEMI
IPC分类号： C23C18/16 , C23C18/31 , C23C18/40 , H01L21/28 , H01L21/288 , H01L21/3205 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To provide a technology for forming a fine circuit wiring having a superior embedding property of copper and a high electrical reliability on a substrate provided with a fine circuit pattern for an electronic circuit such as a silicon wafer, without producing defects such as a seam void in a channel, by electroless copper plating.
SOLUTION: A method for forming the copper electric wiring on the substrate having the fine circuit pattern and a metal seed layer formed thereon for the electronic circuit, comprises immersing the substrate in a treatment liquid containing a polymer component, and subjecting it to electroless copper plating.
COPYRIGHT: (C)2004,JPO&NCIPI

2. 发明专利

JP2004197168A Method for forming metal-protecting film 审中-公开
公开(公告)号：JP2004197168A
公开(公告)日：2004-07-15
申请号：JP2002367468
申请日：2002-12-19
申请人： Ebara Corp , Ebara Udylite Kk , Hidemi Nawafune , 株式会社荏原製作所 , 秀美縄舟 , 荏原ユージライト株式会社
发明人： FUKUNAGA AKIRA , ONO KANJI , KIMIZUKA RYOICHI , MATSUMOTO MORIHARU , NAWAFUNE HIDEMI
IPC分类号： C23C18/34 , C23C18/31 , H01L21/288 , H01L21/3205
摘要： PROBLEM TO BE SOLVED: To provide a method for selectively forming a metal-protecting film by electroless plating on the surface of a copper electric wiring or a copper-alloy electric wiring formed on a substrate for an electronic circuit having an embedded electric wiring structure, without requiring catalyzing treatment with the use of palladium or the like.
SOLUTION: The method for selectively forming the metal-protecting film on the surface of the copper electric wiring or the copper alloy electric wiring formed on the substrate for the electronic circuit, is to perform electroless plating in two steps with the use of a plating bath containing transition metal ions, a compound including a refractory metal, a reducing agent and a complexing agent, wherein the condition in the first-step electroless plating is controlled so as to have a relatively higher reactivity than the condition in the second-step electroless plating.
COPYRIGHT: (C)2004,JPO&NCIPI

3. 发明专利

JP2003293193A Method for forming fine circuit wiring and apparatus used for the same 审中-公开
标题翻译：用于形成精细电路布线的方法和用于其的装置
公开(公告)号：JP2003293193A
公开(公告)日：2003-10-15
申请号：JP2002099970
申请日：2002-04-02
申请人： Ebara Corp , Ebara Udylite Kk , Nec Electronics Corp , Necエレクトロニクス株式会社 , 株式会社荏原製作所 , 荏原ユージライト株式会社
发明人： ITO NOBUKAZU , HONGO AKIHISA , FUKUNAGA AKIRA , NAGAI MIZUKI , KIMIZUKA RYOICHI , KOBAYASHI TAKESHI , SATO TAKURO
IPC分类号： C25D7/12 , C25D5/10 , C25D5/50 , C25D7/00 , H01L21/28 , H01L21/288 , H01L21/3205 , H01L21/768 , H01L23/52 , H01L23/532 , H05K3/10 , H05K3/18 , H05K3/22 , H05K3/24 , H05K3/38 , H05K3/42
CPC分类号： H01L21/76877 , H01L21/288 , H01L23/53228 , H01L2924/0002 , H05K3/107 , H05K3/244 , H05K3/38 , H05K3/388 , H05K3/423 , H05K2201/09036 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a means for preventing migration by lowering and suppressing the movement of copper atoms themselves in a copper wiring formed by copper plating. SOLUTION: A method for forming a fine circuit wiring is characterized by forming a first plated layer by copper alloy plating and a second plating layer by acidic copper plating on a substrate for an electronic circuit, on which a fine circuit pattern has been provided and a barrier layer and a seed layer as occasion demands have been formed. A fine circuit wiring-forming apparatus has a copper alloy plating means for forming the first plating layer, an acidic copper plating means for forming the second plating layer, a washing means for washing these plating layers, and a means for carrying in and out the substrate for the electronic circuit. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：通过降低和抑制铜原子本身在由铜电镀形成的铜布线中的移动来提供防止迁移的手段。＆lt; P＆gt;解决方案：一种精细电路布线的形成方法的特征在于，在电子电路用基板上通过铜合金电镀形成第一镀层，通过酸性镀铜形成第二镀层，并且形成了根据需要的阻挡层和种子层。精细电路布线形成装置具有用于形成第一镀层的铜合金电镀装置，用于形成第二镀层的酸性镀铜装置，用于洗涤这些镀层的清洗装置，以及用于进出基板用于电子电路。版权所有（C）2004，JPO

4. 发明专利

JP2003328184A Method for forming fine circuit wiring and apparatus used for the same 审中-公开
标题翻译：用于形成精细电路布线的方法和用于其的装置
公开(公告)号：JP2003328184A
公开(公告)日：2003-11-19
申请号：JP2002141230
申请日：2002-05-16
申请人： Ebara Corp , Ebara Udylite Kk , 株式会社荏原製作所 , 荏原ユージライト株式会社
发明人： HONGO AKIHISA , FUKUNAGA AKIRA , NAGAI MIZUKI , KIMIZUKA RYOICHI , KOBAYASHI TAKESHI , SATO TAKURO
IPC分类号： C25D7/12 , C25D5/10 , C25D7/00 , H01L21/288 , H01L21/3205 , H01L23/52 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide means for preventing migration by slowing down and suppressing the movement of the copper atoms themselves from fine copper wiring formed by copper plating.
SOLUTION: The method for forming fine circuit wiring comprises forming a first plating layer by plating including the metal diffusible into the copper (provided that alloy plating with the copper is precluded) and a second plating layer by copper plating on a substrate for electronic circuits which is provided with fine circuit patterns and is formed with a barrier layer and a seed layer at need.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：通过减缓和抑制铜原子本身与由铜电镀形成的细铜布线的移动来防止迁移的方法。＆lt; P＆gt;解决方案：用于形成精细电路布线的方法包括：通过电镀形成第一镀层，所述镀层包括可扩散到所述铜中的金属（条件是不排除铜的合金镀覆）和通过镀铜的第二镀层在基板上形成具有精细电路图案的电子电路，并且在需要时形成有阻挡层和种子层。版权所有（C）2004，JPO

5. 发明专利

JP2007126756A Electroless plating apparatus and electroless plating method 审中-公开
标题翻译：电沉积装置和电镀法
公开(公告)号：JP2007126756A
公开(公告)日：2007-05-24
申请号：JP2007028541
申请日：2007-02-07
申请人： Ebara Corp , 株式会社荏原製作所
发明人： O CHIKAAKI , TAKAGI DAISUKE , TASHIRO AKIHIKO , FUKUNAGA AKIRA , OWATARI AKIRA
IPC分类号： C23C18/31
摘要： PROBLEM TO BE SOLVED: To provide an electroless plating apparatus capable of reducing the initial cost and the running cost thereof, and efficiently forming a high-quality protective film on the surface of a metal region without needing a wide installation space.
SOLUTION: The electroless plating apparatus comprises: a pretreatment unit having a treatment unit; an electroless plating unit having a plating tank; and a postcleaning unit, and the pretreatment unit and the electroless plating unit have a common substrate holding head provided with an attraction head 234 and a substrate receiver 236 surrounding the attraction head. An attraction ring 250 with a recess 250a capable of evacuation extending along the circumferential direction is fitted to the attraction head. The substrate receiver has a seal ring 254a disposed on an inner circumferential end thereof and projecting inwardly, and the seal ring is pressed against the peripheral edge of the substrate by the attraction head to seal the peripheral edge of the substrate with the seal ring, so as to hold the substrate. Then, the recess of the attraction ring is evacuated, and, while sealing the peripheral edge of the substrate with the attraction ring, the substrate is attracted and held, so as to release the substrate from the substrate receiver.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种能够降低其初始成本和运行成本，并且在不需要较宽的安装空间的情况下有效地在金属区域的表面上形成高质量的保护膜的化学镀设备。解决方案：化学镀设备包括：具有处理单元的预处理单元; 具有镀槽的化学镀单元; 和后清洗单元，并且预处理单元和化学镀单元具有共同的基板保持头，该基板保持头设置有吸引头234和围绕吸引头的基板接收器236。具有能够沿圆周方向延伸的抽吸的凹部250a的吸引环250安装在吸引头上。衬底接收器具有设置在其内周端上并向内突出的密封环254a，并且通过吸引头将密封环压靠在衬底的周边边缘上，以用密封环密封衬底的周边边缘，因此以保持基板。然后，吸引环的凹部被抽真空，并且在用吸引环密封基板的周缘的同时，吸引并保持基板，以将基板从基板接收体释放。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2006041453A Method and apparatus for wiring formation 审中-公开
标题翻译：接线方法及装置
公开(公告)号：JP2006041453A
公开(公告)日：2006-02-09
申请号：JP2004261247
申请日：2004-09-08
申请人： Ebara Corp , 株式会社荏原製作所
发明人： FUKUNAGA AKIRA , TSUJIMURA MANABU , INOUE HIROAKI
IPC分类号： H01L21/3205 , C23C16/00 , C23C16/04 , C23C16/06 , C23C18/31 , H01L21/02 , H01L21/288 , H01L21/4763 , H01L21/768
CPC分类号： H01L21/76843 , C23C16/042 , C23C16/045 , C23C16/06 , H01L21/7684 , H01L21/76849
摘要： PROBLEM TO BE SOLVED: To selectively form a metallic film on a surface of wiring without varying process conditions depending on the difference in an insulation film material, and remove an unnecessary barrier film by a method with relatively less mechanical elements.
SOLUTION: The method includes steps of forming the barrier film 14 on the surface of a substrate having a wiring recess 12 formed in the insulation film 10, then preparing a substrate W with a film formed of a wiring material 16 in the recess 12 and on the substrate surface, removing the excess wiring material 16 formed on the substrate surface to form a wire 18 of the wiring material 16 buried in the recess 12, exposing the barrier film 14 in a region other than the wire formed part, and selectively forming the metallic film 20 on the surface of the wire 18.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：根据绝缘膜材料的差异，根据不同的工艺条件选择性地在布线表面上形成金属膜，并且通过相对较少的机械元素的方法去除不必要的阻挡膜。解决方案：该方法包括以下步骤：在具有形成在绝缘膜10中的布线凹部12的基板的表面上形成阻挡膜14，然后在由凹部中的布线材料16形成的膜上准备基板W 如图12所示，在基板表面上，去除形成在基板表面上的多余布线材料16，形成埋设在凹部12中的布线材料16的布线18，将阻挡膜14暴露在除了线形成部分以外的区域中，在导线18的表面上选择性地形成金属膜20.版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2004346399A Method and apparatus for treating substrate 审中-公开
公开(公告)号：JP2004346399A
公开(公告)日：2004-12-09
申请号：JP2003146867
申请日：2003-05-23
申请人： Ebara Corp , 株式会社荏原製作所
发明人： FUKUNAGA AKIRA , TAKAGI DAISUKE , MORIGAMI MASARU
IPC分类号： C23C18/16 , C23C18/18 , C23C18/31 , C23C18/32 , C23C18/50 , H01L21/28 , H01L21/288 , H01L21/3205 , H01L23/52
CPC分类号： C23C18/1608 , C23C18/1879 , C23C18/50
摘要： PROBLEM TO BE SOLVED: To reproducibly form a protective film of high quality without deteriorating particularly electrical characteristics of wiring. SOLUTION: A method for treating a substrate comprises pretreating the surface of a metallic part of the substrate, and selectively forming an alloy film by electroless plating on the surface of the metallic part after having been pretreated, rinsing the substrate having the alloy film formed thereon, and making it into a dry state. The alloy film is electroless plated at a film-forming rate of 10 to 200Å per minute while the fluctuation of the film-forming rate among the substrates is controlled within ±10%. COPYRIGHT: (C)2005,JPO&NCIPI

8. 发明专利

JP2013201418A Substrate processing method 审中-公开
标题翻译：基板处理方法
公开(公告)号：JP2013201418A
公开(公告)日：2013-10-03
申请号：JP2012267106
申请日：2012-12-06
申请人： Ebara Corp , 株式会社荏原製作所
发明人： FUKUDA AKIRA , FUKUNAGA AKIRA
IPC分类号： H01L21/304 , H01L21/027
CPC分类号： B08B3/04 , H01L21/6715
摘要： PROBLEM TO BE SOLVED: To make a surface of a hydrophobic substrate completely wet with a process liquid during liquid processing thereby inhibiting the occurence of water marks.SOLUTION: In a substrate process method, a process liquid is supplied to a substantially center part of a surface of a substrate rotating in a substantially horizontal manner to process the substrate. The rotation speed of the substrate and the supply flow rate of the process liquid supplied to the substrate surface are determined on the basis of a relation between the rotation sheed of the substrate and the supply flow rate of the process liquid, which corresponds to each contact angle of the process liquid, supplied to the substrate surface and retained thereon, relative to the surface and prevents the drainage or partial dry of the process liquid. The process liquid is supplied to the substantially center part of the substrate surface at the determined supply flow rate while the substrate is being rotated at the determined rotation speed.
摘要翻译：要解决的问题：在液体处理期间使疏水性基材的表面被处理液完全湿润，从而抑制水痕的发生。解决方案：在基板处理方法中，将处理液体供应到基板的表面以基本上水平的方式旋转以处理基板。基板的旋转速度和供给到基板表面的处理液的供给流量根据基板的旋转辊与处理液的供给流量之间的关系来确定，该对应于每个接触提供给基板表面并保持在其上的处理液的角度相对于表面，并防止处理液体的排出或部分干燥。当确定的旋转速度旋转基板时，以确定的供给流量将处理液体供给到基板表面的大致中心部分。

9. 发明专利

JP2006241580A Method and apparatus for treating substrate 审中-公开
标题翻译：用于处理基板的方法和装置
公开(公告)号：JP2006241580A
公开(公告)日：2006-09-14
申请号：JP2005062831
申请日：2005-03-07
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAKAGI DAISUKE , O CHIKAAKI , OWATARI AKIRA , ISHIZAKA MASANORI , FUKUNAGA AKIRA
IPC分类号： C23C18/18 , C23C18/31 , H01L21/28 , H01L21/288 , H01L21/3205
CPC分类号： C23C18/1844 , C23C18/1653 , C23C18/168 , H01L21/288 , H01L21/76849
摘要： PROBLEM TO BE SOLVED: To efficiently form a high-quality metal film (protection film), especially on the surface of wiring etc. without deteriorating the electric property of the wiring by subjecting a substrate to an activation treatment such as catalyst-imparting treatment using an optimized processing liquid.
SOLUTION: The metal film is formed on the surface of the substrate by contacting the surface of the substrate, preferably cooled to a prescribed temperature of ≤15°C, to the processing liquid whose temperature is adjusted to ≤15°C to activate the surface, and then contacting the activated surface of the substrate to a plating solution.
COPYRIGHT: (C)2006,JPO&NCIPI

10. 发明专利

JP2006216937A Substrate treatment method and device thereof 审中-公开
标题翻译：基板处理方法及其装置
公开(公告)号：JP2006216937A
公开(公告)日：2006-08-17
申请号：JP2005365536
申请日：2005-12-19
申请人： Ebara Corp , 株式会社荏原製作所
发明人： MINE JUNKO , SUZAKI AKIRA , O CHIKAAKI , FUKUNAGA AKIRA
IPC分类号： H01L21/3205 , G03F7/42 , H01L21/027 , H01L21/304 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To form wiring whereby a reliability as a wiring device is enhanced, by suppressing the occurrence of leakage currents between wiring portions and reducing damage to the wiring portions.
SOLUTION: A barrier layer is formed on the surface of a substrate formed with a recess for wiring in an insulating layer, a wiring material is formed on the surface of the barrier layer and prepares the substrate with the wiring material embedded in the recess for wiring, wiring is formed by the wiring material embedded in the recess for wiring by removing extra wiring material and a barrier layer formed on the surface of the substrate, and a contaminant substance on the substrate is removed by allowing it to react with carboxylic acid under heating in an atmosphere containing the carboxylic acid.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过抑制布线部分之间的漏电流的发生并减少对布线部分的损坏，形成布线，从而提高布线装置的可靠性。解决方案：在形成有绝缘层中的布线用凹部的基板的表面上形成阻挡层，在阻挡层的表面上形成布线材料，并且将布线材料嵌入到基板通过除去额外的布线材料和形成在基板表面上的阻挡层，通过嵌入在布线用凹部中的布线材料形成布线，通过使其与羧基反应来除去基板上的污染物质在含有羧酸的气氛中加热。版权所有（C）2006，JPO＆NCIPI

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