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    • 1. 发明申请
    • PLATING DEVICE
    • 电镀装置
    • WO0003074A8
    • 2000-05-04
    • PCT/JP9903729
    • 1999-07-09
    • EBARA CORPHONGO AKIHISASUZUKI KENICHICHONO ATSUSHITADA MITSUOOGATA AKIRASENDAI SATOSHIMISHIMA KOJI
    • HONGO AKIHISASUZUKI KENICHICHONO ATSUSHITADA MITSUOOGATA AKIRASENDAI SATOSHIMISHIMA KOJI
    • C25D21/12G01R31/02
    • C25D21/12G01R31/026
    • A conduction condition detecting means which can detect a conduction condition (contact condition) of a plurality of feeding contacts in contact with the conduction portion of a substrate to be plated, and a plating device which can form a plating film with a uniform film thickness by uniformizing plating currents flowing through individual feeding contacts. A plating device which plates a substrate to be plated (12), wherein an electrode (13) and a substrate to be plated (12) mounted to a plating jig (11) are arranged opposite to each other in a plating tank (10), the plating jig (11) is provided with a plurality of feeding contact (15) to come into contact with the conduction portion provided on the surface of the substrate to be plated (12), and a specified voltage is applied between the feeding contacts (15) and the electrode (13) to supply a plating current through the feeding contacts (15), the plating device being provided with a conduction condition detecting means (22) for detecting a conduction condition between individual feeding contacts (15) of the plating jig (11) and the conduction portion of the substrate to be plated (12).
    • 导电条件检测装置,其能够检测与待镀基板的导电部分接触的多个馈电触点的导电状态(接触状况);以及电镀装置,其能够通过以下步骤形成具有均匀膜厚度的电镀膜: 使流过各个馈电触点的电镀电流均匀化。 本发明提供一种电镀装置,该电镀装置在镀槽(10)中对置配置电镀基板(12)的电极(13)和被镀基板(12) ,电镀夹具(11)设置有多个馈电触点(15),以与设置在待电镀基板(12)的表面上的导电部分接触,并且在馈电触点 (15)与电极(13)之间的导电状态检测装置(22),用于通过馈电触点(15)提供电镀电流,所述电镀装置设置有用于检测 电镀夹具(11)和待镀基板(12)的导电部分。
    • 10. 发明专利
    • DRAWER WORK STAND
    • JP2001000247A
    • 2001-01-09
    • JP20966399
    • 1999-06-18
    • SUZUKI KENICHI
    • SUZUKI KENICHI
    • A47B3/06A47B96/18
    • PROBLEM TO BE SOLVED: To arrange a drawer work stand without an obstacle in a drawer by means of distributing a weight to be added on a top plate by arranging planar support boards to be a U shape in specified parts. SOLUTION: The support boards 2 are adhered in three parts at the inner side of the wall surface of the drawer 1 and the top plate 3 is placed with the support boards 2 as a supporter. The width of the top plate 3 is made to be the same dimension as the inner side width of the left and right wall of the drawer 1 and the depth of the top plate 3 is made to be about a half of the depth of the drawer 1 so that the drawer 1 can be deviated in a depth direction or drawn-up when an object is put in/out. The support boards 2 support the weight to be added on the top plate 3 by distribution and are positioned at three places, that is, each left and right positions where the boards are brought into contact with this side wall on the left and right wall inner side surfaces of the drawer 1 and one place at the center of a this side wall inner side surface in order to secure a strength. The height of the boards 2 is within a range by which the placed top plate 3 is not in conflict with the rear surface of a desk top plate 4 and also by which the top plate 3 is projected from the upper surface of the drawer 1 for a hold when the top plate 3 is deviated in the depth direction.