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1. 发明专利

JP2013111717A Elastic membrane 有权
标题翻译：弹性膜
公开(公告)号：JP2013111717A
公开(公告)日：2013-06-10
申请号：JP2011261327
申请日：2011-11-30
申请人： Ebara Corp , 株式会社荏原製作所
发明人： YASUDA HOZUMI , WATANABE KAZUHIDE , NAMIKI KEISUKE , NABEYA OSAMU , FUKUSHIMA MAKOTO , YAMAKI AKIRA , TOGASHI SHINGO
IPC分类号： B24B37/30 , H01L21/304
CPC分类号： B32B3/08 , B24B37/30 , B32B3/18 , B32B27/12 , Y10T428/21 , Y10T428/24174 , Y10T428/24851
摘要： PROBLEM TO BE SOLVED: To uniformly prevent deformation (elongation) of a contact portion having a contact surface in contact with a substrate, along the contact surface, in substantially the entire area of the contact portion from the center to the outer periphery.SOLUTION: An elastic membrane 4 is used in a substrate holding device 1 for holding a substrate W with a retainer ring 3 situated at the outer peripheral portion of the substrate W and includes: a contact portion 42 having a contact surface 42a in contact with the substrate W; a first peripheral wall portion 44 connected to the outer peripheral end of the contact portion 42 and extending upward; and a second peripheral wall portion 46 connected to the contact portion 42 at the inside of the first peripheral wall portion 44, extending upward, and including a first pressure chamber 5 formed on the outside and a second pressure chamber 7 formed on the inside, respectively. The contact portion 42 is reinforced with a reinforcing member 50 having higher rigidity than the elastic membrane 4, throughout substantially the entire area of the same.
摘要翻译：要解决的问题：为了均匀地防止接触表面与基板接触的接触部分沿着接触表面在接触部分的大致整个区域中的中心到外周的变形（伸长）。解决方案：在基板保持装置1中使用弹性膜4，用于通过位于基板W的外周部分的保持环3来保持基板W，并且包括：接触部分42，其具有接触表面42a 与基板W接触; 连接到接触部分42的外周端并向上延伸的第一周壁部分44; 以及第二周壁部46，其连接到第一周壁部44的内侧的接触部42，向上延伸，并且包括形成在外侧的第一压力室5和分别形成在内部的第二压力室7 。接触部分42通过在弹簧膜4的整个大致整个区域具有比弹性膜4刚性更高的加强件50加强。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2012076157A Polishing device and method 有权
标题翻译：抛光装置和方法
公开(公告)号：JP2012076157A
公开(公告)日：2012-04-19
申请号：JP2010221265
申请日：2010-09-30
申请人： Ebara Corp , 株式会社荏原製作所
发明人： NABEYA OSAMU , WATANABE KAZUHIDE , YASUDA HOZUMI , FUKUSHIMA MAKOTO , NAMIKI KEISUKE
IPC分类号： B24B37/30 , B24B37/00 , B24B37/04 , B24B49/10 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing device and a method which can polish a substrate with optimum polishing conditions adjusted to properties of a membrane by inputting, into the device, the properties of the membrane for the purpose of pressurizing a substrate such as a semiconductor wafer to a polishing surface.SOLUTION: The polishing device has: a polishing table 101 having a polishing surface; a membrane 4 which is an elastic membrane forming pressure chambers 5, 6, 7 to which pressure fluids are supplied; and a top ring body 2 which holds the membrane 4. The polishing device includes: a top ring 1 pressurizes a substrate against the polishing surface by fluid pressure by supplying the pressure fluids to the pressure chambers 5, 6, 7; and a controller for controlling each equipment in the device. The controller changes the polishing conditions in accordance with the properties of the membrane 4 by inputting the preliminarily measured properties of the membrane 4.
摘要翻译：要解决的问题：提供一种抛光装置和方法，其可以通过将用于加压基材的膜的性质输入到装置中来调整至膜的性质的最佳抛光条件来抛光基材例如半导体晶片到抛光表面。抛光装置具有：具有研磨面的研磨台101，膜4，其是形成压力流体的压力室5,6,7的弹性膜; 以及保持膜4的顶环体2.抛光装置包括：顶环1，通过将压力流体供应到压力室5,6,7，通过流体压力将衬底抵靠抛光表面加压; 以及用于控制设备中的每个设备的控制器。控制器通过输入膜4的初步测量特性，根据膜4的性质改变抛光条件。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2014004675A Polishing device and polishing method 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：JP2014004675A
公开(公告)日：2014-01-16
申请号：JP2012279751
申请日：2012-12-21
申请人： Ebara Corp , 株式会社荏原製作所
发明人： FUKUSHIMA MAKOTO , YASUDA HOZUMI , NAMIKI KEISUKE , NABEYA OSAMU , TOGASHI SHINGO , YAMAKI AKIRA
IPC分类号： B24B37/32 , B24B37/30 , H01L21/304
CPC分类号： B24B37/005 , B24B7/228 , B24B37/042 , B24B37/07 , B24B37/32 , B24B49/16
摘要： PROBLEM TO BE SOLVED: To provide a polishing device and a polishing method which finely control a polishing profile of a wafer, in particular, a polishing profile of a wafer edge part.SOLUTION: A polishing device includes: a substrate holding device 1 including a substrate holding surface 45a which presses a substrate W to a polishing surface and a retainer ring 40 which is disposed so as to enclose the substrate W and contacts with the polishing surface; a rotation mechanism which rotates the substrate holding device 1 around a shaft center; and at least one local load providing mechanism 110 which provides a local load to a part of the retainer ring 40. The retainer ring 40 may tilt independently from the substrate holding surface 45a, and the local load providing mechanism 110 does not rotate integrally with the substrate holding device 1.
摘要翻译：要解决的问题：提供精细控制晶片的抛光轮廓，特别是晶片边缘部分的抛光轮廓的抛光装置和抛光方法。抛光装置包括：基板保持装置1，包括：将基板W压入研磨面的基板保持面45a和被设置为包围基板W并与抛光面接触的保持环40; 使基板保持装置1绕轴心旋转的旋转机构; 以及至少一个局部负载提供机构110，其向保持环40的一部分提供局部负载。保持环40可以独立于基板保持表面45a倾斜，并且局部负载提供机构110不与该保持环40一体地旋转。基板保持装置1。

4. 发明专利

JP2013111679A Elastic membrane and substrate holding device 审中-公开
标题翻译：弹性薄膜和基板保持装置
公开(公告)号：JP2013111679A
公开(公告)日：2013-06-10
申请号：JP2011258833
申请日：2011-11-28
申请人： Ebara Corp , 株式会社荏原製作所
发明人： FUKUSHIMA MAKOTO , WATANABE KAZUHIDE , YASUDA HOZUMI , NAMIKI KEISUKE , NABEYA OSAMU , TOGASHI SHINGO , YAMAKI AKIRA
IPC分类号： B24B37/30 , B24B37/005 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To effectively inhibit excessive polishing of a substrate end and accurately control a polishing rate at the substrate end.SOLUTION: An elastic membrane 4 used for a substrate holding device has an abutting part 400 to be abutted against the substrate to press the substrate toward a polishing pad. A lower surface of the abutting part 400 has a flat region A and a rise region B located on an outer peripheral part of the flat region and rising upward.
摘要翻译：要解决的问题：为了有效地抑制基板端部的过度抛光并且精确地控制基板端部的抛光速率。解决方案：用于基板保持装置的弹性膜4具有邻接基板的抵接部400，以将基板朝向抛光垫挤压。抵接部400的下表面具有平坦区域A和位于平坦区域的外周部分上升的上升区域B。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2010162688A Method and apparatus for dressing polishing pad, substrate polishing apparatus, and substrate polishing method 有权
标题翻译：用于磨光抛光垫，底板抛光装置和底板抛光方法的方法和装置
公开(公告)号：JP2010162688A
公开(公告)日：2010-07-29
申请号：JP2010106770
申请日：2010-05-06
申请人： Ebara Corp , 株式会社荏原製作所
发明人： NAMIKI KEISUKE , YAMAKI AKIRA , TOGAWA TETSUJI
IPC分类号： B24B53/00 , B24B37/20 , B24B49/10 , B24B53/017 , B24B53/095 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a method and apparatus for dressing a polishing pad, a substrate polishing apparatus, and a substrate polishing method capable of constantly keeping a cutting rate of the polishing pad at the replacement of a dresser, preventing variations of a polishing rate and a polishing profile by individual differences of dressers, and pre-conditioning the dresser without affecting the polishing pad. SOLUTION: The method for dressing the polishing pad abuts the dresser 3 against the polishing pad 4 on a polishing table 1 and dresses the polishing pad 4 according to predetermined dressing conditions, wherein the cutting rate of the polishing pad 4 by the dresser 3 is measured and fed back to the dressing conditions. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够持续保持抛光垫的切割速度保持更换磨砂机的抛光垫，基板抛光装置和基板研磨方法的修整方法和装置，从而防止变化的研磨速度和抛光轮廓由修整器的个体差异，并且预处理修整器而不影响抛光垫。＆lt; P＆gt;解决方案：修整抛光垫的方法抵靠研磨台1上的抛光垫4，并根据预定的修整条件装饰抛光垫4，其中抛光垫4由修整器 3被测量并反馈到敷料条件。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2008188767A Substrate holding apparatus 审中-公开
标题翻译：基板保持装置
公开(公告)号：JP2008188767A
公开(公告)日：2008-08-21
申请号：JP2008085984
申请日：2008-03-28
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TOGAWA TETSUJI , NOMICHI IKUTARO , NAMIKI KEISUKE , YASUDA HOZUMI , KOJIMA SHIYUNICHIROU , SAKURAI KUNIHIKO , TAKADA NOBUYUKI , NABEYA OSAMU , FUKUSHIMA MAKOTO , TAKAYANAGI HIDEKI
IPC分类号： B24B37/04 , B24B37/30 , B24B37/32 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To wash away, for example, a polishing liquid intruding into a gap formed between an outer peripheral surface of an elastic pad and a retainer ring to prevent deposits of the polishing liquid from being stuck in the gap. SOLUTION: The substrate holding apparatus 1 for holding a substrate W to be polished and pressing the substrate W against a polishing surface 101 comprises: a top ring body 2 for holding the substrate W; the retainer ring 3 fixed to or integrated in a lower end of a periphery of the top ring body 2; and an elastic pad 4 brought in contact with the substrate W; and support member 6 disposed in a space formed inside the retainer ring 3. The top ring body 2 is provided with a cleaning liquid passage 51 to supply a cleaning liquid into the gap G formed between the outer peripheral surface of the elastic pad 4 and the retainer ring 3, in which a through-hole 3a is provided in the retainer ring 3 to remove the cleaning liquid outward. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：例如，冲洗入到形成在弹性垫的外周表面和保持环之间的间隙中的抛光液体，以防止抛光液的沉积物粘附在间隙中。解决方案：用于保持要抛光的基板W并将基板W压靠在抛光表面101上的基板保持装置1包括：用于保持基板W的顶环体2; 固定环3固定到或整合在顶环主体2的周边的下端; 以及与基板W接触的弹性垫4; 以及设置在形成在保持环3内部的空间中的支撑构件6.顶环体2设置有清洁液通道51，以将清洁液体供应到形成在弹性垫4的外周表面之间的间隙G和保持环3，其中在保持环3中设置有通孔3a以将清洁液向外移除。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2004339579A Electrolytic treatment device and method 审中-公开
公开(公告)号：JP2004339579A
公开(公告)日：2004-12-02
申请号：JP2003138521
申请日：2003-05-16
申请人： Ebara Corp , 株式会社荏原製作所
发明人： MISHIMA KOJI , NAMIKI KEISUKE , HOUDAI MASAO , KUNISAWA JUNJI , MAKINO NATSUKI , FUKUNAGA YUKIO
IPC分类号： C25D7/12 , C25B9/00 , C25D17/00 , C25D17/02 , C25D19/00 , C25D21/00
CPC分类号： C25D17/00 , C25D17/02
摘要： PROBLEM TO BE SOLVED: To provide an electrolitic treatment device capable of producing products with various specifications in a state of the highest productivity while considering the quantity of the production, reducing production cost, and being applied even to the miniaturization of wirings flexibly.
SOLUTION: The electrolytic treatment device is equipped with: an electrolytic treatment unit 30 provided with a substrate holding part 40 of holding a substrate; and a counter plate 50 arranged at a position confronted with the substrate held by the substrate holding part 40; an elecyrolytic treatment unit 30 in which power is fed to the space between the substrate held by the substrate holding part 40 and the counter plate while an electrolytic solution is filled therein, and electrolytic treatment is performed; and a plurality of electrolytic solution feeding equipments 32a and 32b of feeding different kinds of electrolytic solutions. The electrolytic treatment unit 30 is constituted so as to alternatively be connected to one of the electrolytic solution feeding equipments 32a and 32b.
COPYRIGHT: (C)2005,JPO&NCIPI

8. 发明专利

JP2004263202A Plating method and plating apparatus 有权
公开(公告)号：JP2004263202A
公开(公告)日：2004-09-24
申请号：JP2003015236
申请日：2003-01-23
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KURASHINA KEIICHI , NAMIKI KEISUKE , NAKADA TSUTOMU , MISHIMA KOJI
IPC分类号： C25D7/12 , C25D13/22 , C25D17/14 , H01L21/288 , H01L21/3205
摘要： PROBLEM TO BE SOLVED: To provide a technology for selectively depositing a plating metal such as copper into a fine channel and/or a micropore having a circuit form by a mechanical or electrochemical means.
SOLUTION: The electroplating method comprises forming an electroconductive layer on a substrate having the fine channel and/or the micropore, supplying a plating solution onto the electroconductive layer through a porous contact body to plate the metal, and filling the fine channel and/or the micropore with the metal. The plating method comprises relating the change of the condition of applied voltage with the change of the pushing condition of the porous contact body. The plating apparatus therefor is disclosed.
COPYRIGHT: (C)2004,JPO&NCIPI

9. 发明专利

JP2014008570A Substrate holding device and polishing apparatus 有权
标题翻译：基板保持装置和抛光装置
公开(公告)号：JP2014008570A
公开(公告)日：2014-01-20
申请号：JP2012146627
申请日：2012-06-29
申请人： Ebara Corp , 株式会社荏原製作所
发明人： NAMIKI KEISUKE , YASUDA HOZUMI , NABEYA OSAMU , FUKUSHIMA MAKOTO
IPC分类号： B24B37/30 , H01L21/304
CPC分类号： B24B37/32 , B24B37/30
摘要： PROBLEM TO BE SOLVED: To provide a substrate holding device which can prevent a defect or damage of a substrate such as a semiconductor wafer or the like by suppressing deformation of the substrate and reducing stress applied on the substrate, and can safely release (detach) the substrate from a top ring, and to provide a polishing apparatus.SOLUTION: A substrate holding device includes: an elastic film 4; and a top ring main body 2 for holding the elastic film 4. Between the elastic film 4 and a lower surface of the top ring main body 2, multiple pressure chambers divided by partition walls 4a of the elastic film 4 are formed. There is provided a stopper 2S for, when pressure liquid is supplied to at least one pressure chamber, in a state where a substrate W is not in contact with a polishing surface 101a, abutting on a part of the partition wall 4a of the elastic film 4 or an extension member extending from a surface of the elastic film 4, on a backside of a surface to abut on the substrate, and restricting a bulge of the elastic film 4.
摘要翻译：要解决的问题：提供一种基板保持装置，其可以通过抑制基板的变形并降低施加在基板上的应力来防止诸如半导体晶片等的基板的缺陷或损坏，并且可以安全地释放（分离）来自顶环的基板，并且提供抛光装置。解决方案：基板保持装置包括：弹性膜4; 以及用于保持弹性膜4的顶环主体2.在弹性膜4和顶环主体2的下表面之间形成有由弹性膜4的隔壁4a分隔开的多个压力室。设置有止动件2S，在将基板W与研磨面101a不接触的状态下，在向至少一个压力室供给压力液体的状态下，抵接在弹性膜的隔壁4a的一部分上 4或从弹性膜4的表面延伸的延伸部件，在表面的背面上，以抵靠在基板上，并限制弹性膜4的凸起。

10. 发明专利

JP2013163262A Apparatus for dressing polishing pad and apparatus for polishing substrate 有权
标题翻译：用于抛光抛光垫的装置和抛光底板的装置
公开(公告)号：JP2013163262A
公开(公告)日：2013-08-22
申请号：JP2013109883
申请日：2013-05-24
申请人： Ebara Corp , 株式会社荏原製作所
发明人： NAMIKI KEISUKE , YAMAKI AKIRA , TOGAWA TETSUJI
IPC分类号： B24B37/00 , B24B37/20 , B24B53/017 , B24B53/02 , B24B53/12 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide an apparatus for dressing a polishing pad, capable of keeping a constant pad cutting rate of the polishing pad when a dresser is replaced to prevent variations in polishing rate and polishing profile caused by individual solid difference of the dresser and capable of performing preconditioning of the dresser without affecting the polishing pad, and to provide an apparatus for polishing a substrate.SOLUTION: A dresser 3 is configured to oscillate in a predetermined range including a polishing pad 4 upper surface, and is provided with a dresser-preconditioning device 20 performing preconditioning of the dresser 3 in the oscillation range other than the upper surface of the polishing pad 4. The dresser-preconditioning device is provided with a table member provided with a plate-shape dresser-preconditioning member on an upper surface, and performs the preconditioning of the dresser by relative movement between the dresser-preconditioning member and the dresser by bringing the dresser into abutment with the dresser-preconditioning member.
摘要翻译：要解决的问题：提供一种用于修整抛光垫的装置，能够在更换修整器时保持抛光垫的固定切割速度，以防止由修整器的各个固体差造成的抛光速率和抛光轮廓的变化，以及能够在不影响抛光垫的情况下执行修整器的预处理，并且提供用于抛光基板的装置。解决方案：修整器3构造成在包括抛光垫4上表面的预定范围内振荡，并且设置有修整器预处理装置20在除抛光垫4的上表面之外的振荡范围内进行修整器3的预处理。修整器预处理装置设置有在上表面上设置有板状修整器预处理构件的工作台构件，并通过修整器预处理构件和底盘之间的相对运动来执行修整器的预调节通过使修整器与修整器预处理构件邻接。

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