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1. 发明专利

JP2012209589A Substrate processing apparatus 审中-公开
标题翻译：基板加工设备
公开(公告)号：JP2012209589A
公开(公告)日：2012-10-25
申请号：JP2012158786
申请日：2012-07-17
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAKAHASHI NOBUYUKI , NISHIDA HIROAKI , TORII HIROOMI , ISOBE SOICHI , SONE CHUICHI , KOSUGE RYUICHI , KANEKO HIROYUKI , SOTOZAKI HIROSHI , MITSUKURA TAKAO , OGAWA TAKAHIRO , SUGITA KENICHI
IPC分类号： H01L21/677 , B24B37/005 , B24B37/34 , H01L21/304
CPC分类号： H01L21/67219 , B24B37/345 , H01L21/6719 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67751 , H01L21/67766 , H01L21/68707
摘要： PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which enables easy maintenance work.SOLUTION: A substrate processing apparatus has multiple processing parts performing predetermined processing on substrates. At least one of the multiple processing parts has a frame body 710, a fixed leg 712 fixing the frame body 710, a main roller 718 rolling in the drawing direction, and a length adjustable caster leg 714. The caster leg 714 is formed so as to be longer than the fixed leg 712, and the structure allows the caster leg 714 to support the frame body 710 when the frame body 710 is drawn.
摘要翻译：要解决的问题：提供一种能够容易地进行维护工作的基板处理装置。解决方案：基板处理装置具有对基板进行预定处理的多个处理部。多个处理部件中的至少一个具有框体710，固定框架体710的固定脚部712，沿着拉拔方向滚动的主辊718和长度可调节脚轮714.脚轮脚714形成为比固定腿部712长，并且当框架体710被拉动时，结构允许脚轮腿714支撑框架体710。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2011003843A Organic gas concentration detection method of organic gas supply apparatus, organic gas supply apparatus, and method of operating organic gas supply apparatus 有权
标题翻译：有机气体供应装置有机气体浓度检测方法，有机气体供应装置及有机气体供应装置的运行方法
公开(公告)号：JP2011003843A
公开(公告)日：2011-01-06
申请号：JP2009147795
申请日：2009-06-22
申请人： Ebara Corp , 株式会社荏原製作所
发明人： OGAWA TAKAHIRO , SUGITA KENICHI , KANEKO HIROYUKI , FUKAYA KOICHI , ISHIBASHI TOMOATSU
IPC分类号： H01L21/304 , G01N7/00
摘要： PROBLEM TO BE SOLVED: To provide an organic gas concentration detection method that can detect organic gas concentration in a gaseous mixture supplied from an organic gas supply apparatus, with simple constitution, and to provide the organic gas supply apparatus.SOLUTION: The organic gas supply apparatus stores an organic solvent such as IPA (Isopropyl Alcohol) into a bubbling tank 11 equipped with a gas introduction pipe 12 and a gas discharge pipe 13, passes an inert gas through the organic solvent 104 in the tank to vaporize the organic solvent, and discharges the gaseous mixture of the inert gas and an organic gas from the gas discharge pipe 13. In the organic gas supply apparatus, the gas introduction pipe 12 is provided with a first mass flow controller 15, and the gas discharge pipe 13 is provided with a mass flowmeter 16, so that the organic gas concentration in the gaseous mixture is detected using a gas flow rate-measured value from the first mass flow controller 15 and a gas flow rate-measured value from the mass flowmeter 16.
摘要翻译：要解决的问题：提供一种有机气体浓度检测方法，其能够以简单的结构检测从有机气体供给装置供给的气体混合物中的有机气体浓度，并提供有机气体供给装置。解决方案：有机气体供应装置将有机溶剂如IPA（异丙醇）储存在装有气体导入管12和气体排出管13的鼓泡罐11中，使惰性气体通过罐中的有机溶剂104，使有机溶剂汽化，从气体排出管13排出惰性气体和有机气体的气体混合物。在有机气体供给装置中，气体导入管12设置有第一质量流量控制器15，气体排出管13设置有质量流量计16，使得使用来自第一质量流量控制器15的气体流量测量值和气体的气体混合物中的有机气体浓度被检测来自质量流量计16的流量测量值。

3. 发明专利

JP2010149003A Liquid-scattering prevention cup of substrate processing apparatus, substrate processing apparatus and method for operating the apparatus 有权
标题翻译：基板加工装置的液体散射防护罩，基板加工装置和操作装置的方法
公开(公告)号：JP2010149003A
公开(公告)日：2010-07-08
申请号：JP2008327331
申请日：2008-12-24
申请人： Ebara Corp , 株式会社荏原製作所
发明人： OGAWA TAKAHIRO , MATSUDA NAOKI , FUKAYA KOICHI , KANEKO HIROYUKI
IPC分类号： B05C11/10 , H01L21/304
CPC分类号： B08B17/00 , B08B3/02 , B08B17/025 , H01L21/67051 , H01L21/6708
摘要： PROBLEM TO BE SOLVED: To provide a liquid-scattering prevention cup of a substrate processing apparatus for which a hydrophilic member such as a PVA sponge can be easily and efficiently mounted on the inner surface of a liquid-scattering prevention cup body, the substrate processing apparatus provided with the liquid-scattering prevention cup, and a method therefor. SOLUTION: For the liquid-scattering prevention cup of the substrate processing apparatus including a substrate rotating mechanism for holding and rotating a substrate and the liquid-scattering prevention cup disposed so as to surround the outer periphery of the substrate held by the substrate rotating mechanism for preventing the scattering of liquid separating from the rotated substrate, on the entire inner peripheral surface of the liquid-scattering prevention cup body 11 or on the prescribed part of the inner peripheral surface, a liquid-scattering prevention sheet 16a provided with a hydrophilic material layer 12 on the surface is mounted by a mounting means so that the hydrophilic material layer 12 is turned to the inner side of the cup. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题为了提供一种基板处理装置的液体散射防止杯，其中诸如PVA海绵的亲水构件可以容易且有效地安装在防止液体散射的杯体的内表面上，设置有液体散射防止杯的基板处理装置及其方法。解决方案：对于包括用于保持和旋转衬底的衬底旋转机构的衬底处理设备的液体散射防止杯和设置为围绕由衬底保持的衬底的外周设置的液体散射防止杯旋转机构，用于防止从旋转基板分离的液体的散射，在液体散射防止杯体11的整个内周面或内周面的规定部分上，设置有液体散射防止片16a，表面上的亲水性材料层12通过安装装置安装，使得亲水材料层12转向杯的内侧。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2017078339A 横軸ポンプ审中-公开
公开(公告)号：JP2017078339A
公开(公告)日：2017-04-27
申请号：JP2015205791
申请日：2015-10-19
申请人：株式会社荏原製作所 , Ebara Corp
发明人： KANEKO HIROYUKI , TOYODA KOJI , KOMIYA MAKOTO
IPC分类号： F04D29/046 , F04D11/00
摘要：【課題】主軸と水中軸受との間の処理液の流れを促進することのできる横軸ポンプを提供する。【解決手段】本発明によれば、横軸ポンプが提供される。この横軸ポンプは、回転軸と、前記回転軸を回転可能に支持する筒状の水中軸受と、前記水中軸受の外周面を保持する軸受ケーシングと、前記回転軸の外周面に固定される軸受カバーと、を有する。前記軸受カバーは、前記軸受ケーシングの端面と所定の隙間を有して前記回転軸に固定される。横軸ポンプは、前記回転軸の回転により前記軸受カバーが回転して、前記回転軸と前記水中軸受との間の液体及び固体を、前記回転軸と前記水中軸受との間から排出するように構成される。【選択図】図2

5. 发明专利

JP2014037807A Double suction volute pump, pump equipment 有权
标题翻译：双重抽吸泵，泵设备
公开(公告)号：JP2014037807A
公开(公告)日：2014-02-27
申请号：JP2012180988
申请日：2012-08-17
申请人： Ebara Corp , 株式会社荏原製作所
发明人： FUJII MUNETOSHI , KANEKO HIROYUKI , MIZUNUMA YORIHISA , CHIBA MAKOTO , TAKABE TETSUO , UCHIDA YOSHIHIRO
IPC分类号： F04D9/04 , F04D15/00
摘要： PROBLEM TO BE SOLVED: To provide a double suction volute pump for low-load starting that can start an electric motor by a reduced-voltage starting method.SOLUTION: A double suction volute pump for water comprises: an impeller rotating about an axis line; and a casing including a suction volute forming a suction passage of the water to the impeller and a discharge volute forming a discharge passage of the water from the impeller. In the suction volute, a suction port is formed so as to connect to a vacuum pump for sucking air from the casing to suck up the water from the upstream side of the double suction volute pump, and an electric motor is started in a non-high-water state.
摘要翻译：要解决的问题：提供一种用于低负载起动的双吸涡旋泵，其可以通过降压启动方法启动电动机。解决方案：用于水的双吸涡旋泵包括：绕轴线旋转的叶轮; 以及壳体，其包括形成水向叶轮的吸入通道的抽吸蜗壳和形成来自叶轮的水的排出通道的排出蜗壳。在吸入蜗壳中，形成吸入口，以连接到真空泵，用于从壳体抽吸空气，以从双吸涡旋泵的上游侧吸取水，高水状态。

6. 发明专利

JP2009200476A Method of operating substrate processing apparatus, and substrate processing apparatus 有权
标题翻译：基板加工装置的操作方法以及基板处理装置
公开(公告)号：JP2009200476A
公开(公告)日：2009-09-03
申请号：JP2009004315
申请日：2009-01-13
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TORII HIROOMI , NISHIDA HIROAKI , KANEKO HIROYUKI , DATE MISAO , MITSUYA TAKASHI , NAKAMURA TAKAMASA
IPC分类号： H01L21/02 , B24B37/04 , H01L21/304 , H01L21/677
CPC分类号： H01L21/67751 , B24B37/345
摘要： PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can reduce risk of disabled treatment of a substrate by continuously performing a part of processing for the substrate, cleaning and recovering the substrate, and easily ejecting the substrate from the apparatus to the outside, so far as it does not result in serious failure, when a trouble occurs in the substrate processing apparatus, without having to stop the system as a whole. SOLUTION: In the method for operating the substrate processing apparatus consisting of a polishing part 3, a cleaning part 4 and a transporting mechanisms 7, 22, when either the polishing part 3, the cleaning part 4 or the transporting mechanisms 7, 22 detects an abnormality, the apparatus sorts a substrate according to a location where the abnormality is detected and a position for the substrate in the substrate processing apparatus, and performs processes for the substrate after malfunction detection by changing at each sorted substrate. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种基板处理装置，其可以通过连续地进行基板的处理的一部分，清洗和回收基板，并且容易地将该基板从该装置喷射到基板上，从而降低基板的不能处理的风险只要不会导致严重故障，当基板处理装置发生故障时，无需停止整个系统。解决方案：在用于操作由研磨部3，清洁部4和输送机构7,22组成的基板处理装置的方法中，当抛光部3，清洁部4或输送机构7， 22检测异常，该装置根据检测到异常的位置和基板处理装置中的基板的位置对基板进行排序，并且通过在每个分选的基板上进行变换来对故障检测后的基板进行处理。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2007294920A Substrate holding/rotating mechanism, and substrate processor 有权
标题翻译：基板保持/旋转机构和基板处理器
公开(公告)号：JP2007294920A
公开(公告)日：2007-11-08
申请号：JP2007079171
申请日：2007-03-26
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KANEKO HIROYUKI , OGAWA TAKAHIRO , SUGITA KENICHI
IPC分类号： H01L21/683 , B08B11/02 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a substrate holding/rotating mechanism which equalizes a holding force with which a holding/rotating portion of each spindle holds the periphery of a substrate to stabilize the rotation of the substrate held with the spindles. SOLUTION: A plurality of spindles 50, which hold the periphery of the substrate W and rotate, are provided as spindle groups 53 and 54 each consisting of two spindles 50, and are arranged at both mutually opposite sides of a substrate holding position. Base members 17 and 25, on which the spindle groups 53 and 54 are fitted, are provided with a first moving mechanism 10 and a second moving mechanism 20 that linearly move the base members 17 and 25 at both sides of the substrate holding position, and the first moving mechanism 10 is provided with a rotating mechanism that enables the base member 17 to rotate freely in a horizontal plane. Thus, when the spindle groups 53 and 54 hold the substrate W, the rotating mechanism rotates the base member 17 to automatically adjust a holding force with which the spindles 50 and 50 on the base member 17 hold the periphery of the substrate W, thereby making the holding forces of the spindle groups 53 and 54 equal to each other. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种使每个轴的保持/旋转部分保持基板的周边的保持力相等的基板保持/旋转机构，以稳定保持有主轴的基板的旋转。解决方案：保持基板W的周边并旋转的多个主轴50设置为每个由两个主轴50组成的主轴组53和54，并且布置在基板保持位置的相互相对的两侧。配有主轴组53,54的基部构件17,25设置有第一移动机构10和第二移动机构20，其使基部构件17和25在基板保持位置的两侧直线移动，以及第一移动机构10设置有使得基部构件17能够在水平面中自由旋转的旋转机构。因此，当主轴组53和54握住基板W时，旋转机构使基部构件17旋转，以自动调节基部构件17上的主轴50和50保持基板W的周边的保持力，从而使主轴组53和54的保持力彼此相等。版权所有（C）2008，JPO＆INPIT

8. 发明公开

EP1136595A4 METHOD FOR MEASURING LEVELER CONCENTRATION OF PLATING SOLUTION, AND METHOD AND APPARATUS FOR CONTROLLING PLATING SOLUTION 审中-公开
标题翻译：方法适用于测量涂料解决方案和方法和设备的目标浓度用于控制涂层解决方案
公开(公告)号：EP1136595A4
公开(公告)日：2006-07-19
申请号：EP00956786
申请日：2000-08-30
申请人： EBARA CORP
发明人： ISAYAMA YASUSHI , UEYAMA HIROYUKI , KANEKO HIROYUKI , YAMAKAWA JUNITSU , HONGO AKIHISA , KIMIZUKA RYOICHI , MARUYAMA MEGUMI
IPC分类号： C25D21/14 , C25D21/12 , G01N27/42
CPC分类号： C25D21/18 , C25D21/12 , C25D21/14
摘要： A method for measuring the concentration of a leveler in a plating solution for a plating apparatus being used for filling a metal such as copper into a groove or hole formed for wiring in the surface of, for example, a semiconductor substrate or the like, characterized in that the leveler concentration is determined based on the peak area (Ar value) in a peeling region of the plating solution as measured by the CV method or CVS method.

9. 发明公开

EP1988568A4 SUBSTRATE TREATING DEVICE, SUBSTRATE CONVEY DEVICE, SUBSTRATE GRASPING DEVICE, AND CHEMICAL SOLUTION TREATING DEVICE 审中-公开
标题翻译：基板处理装置，基板运送装置，对于具有化学溶液处理基板器件扣押和设备
公开(公告)号：EP1988568A4
公开(公告)日：2011-10-26
申请号：EP07715034
申请日：2007-02-21
申请人： EBARA CORP
发明人： TAKAHASHI NOBUYUKI , NISHIDA HIROAKI , TORII HIROOMI , ISOBE SOICHI , SONE TADAKAZU , KOSUGE RYUICHI , KANEKO HIROYUKI , SOTOZAKI HIROSHI , MITSUKURA TAKAO , OGAWA TAKAHIRO , SUGITA KENICHI
IPC分类号： H01L21/687 , B24B37/34 , H01L21/677
CPC分类号： H01L21/67219 , B24B37/345 , H01L21/6719 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67751 , H01L21/67766 , H01L21/68707

10. 发明专利

JP2020091024A すべり軸受装置及びポンプ审中-公开
公开(公告)号：JP2020091024A
公开(公告)日：2020-06-11
申请号：JP2018229985
申请日：2018-12-07
申请人： EBARA CORP
发明人： KANEKO HIROYUKI , SUGIYAMA KENICHI , KIM SEONG-HA , KOMIYA MAKOTO , SUGIYAMA KAZUHIKO , ISHIMI MITSUTAKA
IPC分类号： F16C27/06 , F04D13/00 , F04D29/046 , F16C17/02 , F16C35/02 , F16F15/04
摘要：【課題】ドライ運転時にすべり軸受と回転軸との摺動による振動の吸収機能と、摩擦熱の放散機能を向上させるとともに、すべり軸受の軸芯の寸法精度を確保できるすべり軸受装置を提供する。【解決手段】すべり軸受を保持する軸受ケーシングと、軸受ケーシングを保持する支持部材と、軸受ケーシングと支持部材を締結する第1の締結部材と、第1の締結部材の位置決めを行う第1の位置決め部材と、第1の位置決め部材と軸受ケーシングとの間に配置された第1の防振部材と、を備えたすべり軸受装置が提供される。【選択図】図4

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