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    • 1. 发明申请
    • METHOD FOR DETERMINING IMAGE QUALITY
    • 用于确定图像质量的方法
    • WO2005114577A1
    • 2005-12-01
    • PCT/US2005/015541
    • 2005-05-02
    • EASTMAN KODAK COMPANYFEDOROVSKAYA, Elena A.
    • FEDOROVSKAYA, Elena A.
    • G06T7/00
    • G06T7/0002
    • A method and computer program product are provided for evaluating quality of an image. In accordance with the method a digital image is obtained and the digital image is analyzed using a first mental representation based upon a first level of human visual processing of an image to obtain a first perceptual image analysis measure. The digital image is also analyzed using a second mental representation based upon a second level of human visual processing of an image to obtain a second perceptual image analysis measure. An image quality evaluation measure is determined based upon the first perceptual image analysis measure and the second perceptual image analysis measure. The first and second mental representations are based upon different levels of human visual processing.
    • 提供了一种用于评估图像质量的方法和计算机程序产品。 根据该方法,获得数字图像,并且使用基于图像的人类视觉处理的第一级的第一精神表示来分析数字图像,以获得第一感知图像分析度量。 还使用基于图像的人类视觉处理的第二级别的第二心理表示来分析数字图像,以获得第二感知图像分析度量。 基于第一感知图像分析测量和第二感知图像分析测量来确定图像质量评估度量。 第一和第二个心理表征是基于不同级别的人类视觉处理。
    • 9. 发明公开
    • PROCESS FOR FORMING THIN FILM ENCAPSULATION LAYERS
    • 形成薄膜封装层的工艺
    • EP2193219A2
    • 2010-06-09
    • EP08832964.4
    • 2008-09-17
    • Eastman Kodak Company
    • FEDOROVSKAYA, Elena A.BOROSON, Michael LouisLEVY, David HowardAGOSTINELLI, John Alphonse
    • C23C16/40C23C16/455H01L51/52
    • B05D5/00C23C16/403C23C16/405C23C16/45551C23C16/45574H01L51/5253
    • A process is disclosed for making a thin film encapsulation package for an OLED device by depositing a thin film material on an OLED device to be encapsulated, comprising simultaneously directing a series of gas flows along substantially parallel elongated output openings, wherein the series of gas flows comprises, in order, at least a first reactive gaseous material, an inert purge gas, and a second reactive gaseous material, optionally repeated a plurality of times, wherein the first reactive gaseous material is capable of reacting with a substrate surface treated with the second reactive gaseous material to form an encapsulating thin film, wherein the first reactive gaseous material is a volatile organo-metal precursor compound. The process is carried out substantially at or above atmospheric pressure, and the temperature of the substrate during deposition is under 250°C.
    • 公开了一种用于通过在要被封装的OLED器件上沉积薄膜材料来制造用于OLED器件的薄膜封装封装的方法,该方法包括同时沿着基本上平行的细长输出开口引导一系列气流,其中所述一系列气流 依次包括至少第一反应性气态材料,惰性吹扫气体和第二反应性气态材料,可选地重复多次,其中第一反应性气态材料能够与用第二反应性气体材料处理的基板表面反应 以形成包封薄膜,其中所述第一反应性气态材料是挥发性有机金属前体化合物。 该过程基本上在大气压或高于大气压下进行,沉积过程中基材的温度低于250℃。