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1. 发明申请

WO2006061255A1 STAMP FOR PATTERNING, METHOD FOR MANUFACTURING SUCH STAMP AND METHOD FOR MANUFACTURING AN OBJECT USING THE STAMP 审中-公开
标题翻译：用于绘图的印章，制造这种印章的方法和使用印章制造对象的方法
公开(公告)号：WO2006061255A1
公开(公告)日：2006-06-15
申请号：PCT/EP2005/013529
申请日：2005-12-01
申请人： ESSILOR INTERNATIONAL (COMPAGNIE GENERALE D'OPTIQUE) , INTERNATIONAL BUSINESS MACHINES CORPORATION , SCHMID, Heinz , MICHEL, Bruno , KLOTER, Urs , KELLER, Gerhard , CANO, Jean-Paul
发明人： SCHMID, Heinz , MICHEL, Bruno , KLOTER, Urs , KELLER, Gerhard , CANO, Jean-Paul
IPC分类号： B41F17/00 , B41F17/30 , B29C39/02 , B29C33/42 , B29C33/30 , B29C39/10
CPC分类号： B41F17/001 , B29C43/003 , B29C43/021 , B29C43/12 , B29C2043/025 , B29C2043/3647 , B41F17/30 , B82Y10/00 , B82Y30/00 , B82Y40/00 , G03F7/0002
摘要： A stamp for patterning onto a receiving surface of an object (101) according to a defined pattern (P) comprises a stamping surface (21) of a resilient diaphragm (20). The stamping surface is planar at rest. The pattern is reproduced on the stamping surface and the diaphragm is affixed to a rigid body (13) along a peripheral edge, so that a middle part of the diaphragm can move along a direction perpendicular to the stamping surface. The diaphragm (20) is more flexible near the peripheral edge than in the middle part. Then, the pattern (P) printed on a pseudo-spherical receiving surface (103) using the stamp exhibits few distortion.
摘要翻译：用于根据限定图案（P）图案化到物体（101）的接收表面上的印模包括弹性隔膜（20）的冲压表面（21）。冲压表面是平面的静止。图案在冲压表面上再现，并且隔膜沿着周边边缘固定到刚体（13），使得隔膜的中间部分可以沿着垂直于冲压表面的方向移动。隔膜（20）在外围边缘处比在中间部分更加柔软。然后，使用印模印刷在伪球形接收表面（103）上的图案（P）显示出很小的变形。

2. 发明申请

WO2009031100A1 METHOD AND DEVICE FOR COOLING A HEAT GENERATING COMPONENT 审中-公开
标题翻译：用于冷却发热组件的方法和装置
公开(公告)号：WO2009031100A1
公开(公告)日：2009-03-12
申请号：PCT/IB2008/053547
申请日：2008-09-02
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , BRUNSCHWILER, Thomas, J. , KLOTER, Urs , LINDERMAN, Ryan, Joseph , MICHEL, Bruno , ROTHUIZEN, Hugo, E. , WAELCHLI, Reto
发明人： BRUNSCHWILER, Thomas, J. , KLOTER, Urs , LINDERMAN, Ryan, Joseph , MICHEL, Bruno , ROTHUIZEN, Hugo, E. , WAELCHLI, Reto
IPC分类号： H01L23/427 , H01L23/473 , G06F1/16
CPC分类号： H05K7/20281 , F28D1/0417 , G06F1/20 , G06F1/203 , G06F1/206 , H01L23/34 , H01L23/427 , H01L23/473 , H01L2924/0002 , H05K7/20254 , H05K7/20272 , H01L2924/00
摘要： The invention relates to a cooling arrangement comprising a heat spreader (2) comprising a first surface (5), a second surface (8), at least one heat absorption chamber (9) and at least one heat dissipation chamber (10), the at least one heat absorption chamber (9) being in thermal contact with the first surface (5) and the at least one heat dissipation chamber (10) being in thermal contact with the second surface (8) and hydraulically coupled to the at least one heat absorption chamber (9). A cooling fluid (13) can be driven from the heat absorption chamber (9) to the heat dissipation chamber (10) using a plurality of flow patterns for cooling the first surface (5).
摘要翻译：本发明涉及一种包括散热器（2）的冷却装置，散热器（2）包括第一表面（5），第二表面（8），至少一个吸热室（9）和至少一个散热室（10）至少一个热吸收室（9）与第一表面（5）热接触，并且至少一个散热室（10）与第二表面（8）热接触并且液压耦合到至少一个吸热室（9）。冷却流体（13）可以使用多个用于冷却第一表面（5）的流动图案从吸热室（9）驱动到散热室（10）。

3. 发明申请

WO2002093991A1 METHOD FOR ELECTROLESS DEPOSITION AND PATTERNING OF A METAL ON A SUBSTRATE 审中-公开
标题翻译：用于电镀沉积和在基材上形成金属的方法
公开(公告)号：WO2002093991A1
公开(公告)日：2002-11-21
申请号：PCT/IB2002/001225
申请日：2002-04-04
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , DELAMARCHE, Emmanuel , FLAKE, John, C. , GEISSLER, Matthias , GRAHAM, William, S. , MAGNUSON, Roy, H. , MICHEL, Bruno , SCHMID, Heinz
发明人： DELAMARCHE, Emmanuel , FLAKE, John, C. , GEISSLER, Matthias , GRAHAM, William, S. , MAGNUSON, Roy, H. , MICHEL, Bruno , SCHMID, Heinz
IPC分类号： H05K3/06
CPC分类号： B82Y30/00 , C23C18/1605 , C23C18/1607 , C23C18/1893 , C23F1/02 , C23F1/34 , H01L21/4846 , H05K3/0079 , H05K3/061 , H05K3/181 , H05K3/389 , H05K2203/0108 , H05K2203/0537 , H05K2203/0585 , H05K2203/1168
摘要： A method for manufacturing a patterned metal layer on a substrate is provided which comprises the step of electrolessly depositing a blanket metal film of a metal onto a substrate, followed by subsequently patterning said metal layer by means of microcontact printing. The deposited metal can be overplated with another metal, which can be microcontact printed to serve as an etch mask.
摘要翻译：提供了一种用于在基板上制造图案化金属层的方法，其包括将金属的覆盖金属膜无电沉积到基板上的步骤，随后通过微接触印刷对所述金属层进行图案化。沉积的金属可以用另一种金属进行过电镀，其可以被微接触印制以用作蚀刻掩模。

4. 发明申请

WO2004022338A2 PRINTING IN A MEDIUM 审中-公开
标题翻译：在中文打印
公开(公告)号：WO2004022338A2
公开(公告)日：2004-03-18
申请号：PCT/IB2003/003834
申请日：2003-08-28
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , BIETSCH, Alexander , DELAMARCHE, Emmanuel , MICHEL, Bruno , SCHMID, Heinz , WOLF, Heiko
发明人： BIETSCH, Alexander , DELAMARCHE, Emmanuel , MICHEL, Bruno , SCHMID, Heinz , WOLF, Heiko
IPC分类号： B41F
CPC分类号： B01J19/0093 , B01J2219/00382 , B01J2219/00527 , B01J2219/0072 , B01J2219/0074 , B01J2219/00745 , B01J2219/00747 , B01J2219/00783 , B01J2219/00833 , B01L3/0293 , B01L2300/0819 , B41K1/30 , B41M3/006 , C40B30/08 , C40B40/18 , C40B60/14 , G01N35/1002 , G01N2035/1034 , H05K3/12 , Y10S977/887
摘要： A method for transferring a pattern from an elastic stamp to a substrate in the presence of a third medium is described. A proximity contact is achieved between the stamp and the substrate. A layer of the third medium between the stamp and the substrate is controlled to a predetermined thickness. Stamps for carrying out this method are also described.
摘要翻译：描述了在存在第三介质的情况下将图案从弹性印模转移到基板的方法。在印模和基板之间实现接近接触。将印模和基板之间的第三介质层控制到预定厚度。还描述了用于执行该方法的邮票。

5. 发明申请

WO2004050246A1 METHOD AND DEVICE FOR FLOWING A LIQUID ON A SURFACE 审中-公开
标题翻译：用于流动表面上的液体的方法和装置
公开(公告)号：WO2004050246A1
公开(公告)日：2004-06-17
申请号：PCT/IB2003/005350
申请日：2003-11-13
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , DELAMARCHE, Emmanuel , JUNCKER, David , MICHEL, Bruno , SCHMID, Heinz
发明人： DELAMARCHE, Emmanuel , JUNCKER, David , MICHEL, Bruno , SCHMID, Heinz
IPC分类号： B01L3/00
CPC分类号： B01L3/0262 , B01J2219/00369 , B01J2219/0038 , B01J2219/0043 , B01L3/5027 , B01L2200/025 , B01L2300/0809 , B01L2300/089 , B01L2300/10 , B01L2400/022 , B01L2400/0403 , B01L2400/0406 , B01L2400/0415 , B01L2400/0487 , B05C5/02 , C40B60/14 , Y10T137/9682 , Y10T436/2575
摘要： A device for flowing a liquid on a surface comprises: a flow path (40). A first port (20) supplies the liquid to one end of the flow path and applies a fist port pressure for retaining the liquid when the flow path is remote from the surface (80). A second port (30) receives the liquid from the other end of the flow path (40) and applies a second port pressure such that the difference between the first and second negative port pressures is oriented to pormote flow of the liquid from the first port (20) to the second port (30) via the flow path (40) in response to the flow path (40) being located proximal to the surface (80) and the liquid in the device contacting the surface (80). The first and the second port pressures are such that the liquid is drawn towards at least the second port in response to withdrawal of the flow path from the surface. Such devices may employ microfluidic technology and find application in surface patterning.
摘要翻译：用于在表面上流动液体的装置包括：流路（40）。第一端口（20）将液体供应到流路的一端，并且当流动路径远离表面（80）时，施加用于保持液体的第一端口压力。第二端口（30）从流路（40）的另一端接收液体，并且施加第二端口压力，使得第一和第二负压力压力之间的差定向成从第一端口（40）位于所述表面（80）附近的位置以及与所述表面（80）接触的装置中的液体，经由流路（40）经由所述流动路径（40）到所述第二端口（30）。第一和第二端口压力使得液体响应于流动路径从表面的撤出而朝着至少第二端口被拉出。这样的装置可以采用微流控技术并在表面图案化中找到应用。

6. 发明申请

WO2012038843A1 ELECTROCHEMICALLY POWERED INTEGRATED CIRCUIT PACKAGE 审中-公开
标题翻译：电化学集成电路封装
公开(公告)号：WO2012038843A1
公开(公告)日：2012-03-29
申请号：PCT/IB2011/053477
申请日：2011-08-04
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , BRUNSCHWILER, Thomas, J. , MICHEL, Bruno , RUCH, Patrick
发明人： BRUNSCHWILER, Thomas, J. , MICHEL, Bruno , RUCH, Patrick
IPC分类号： H01L23/58
CPC分类号： H01L23/58 , H01L23/34 , H01L23/44 , H01L23/473 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01M8/04029 , H01M8/04276 , H01M8/1097 , H01M8/188 , Y02E60/528 , H01L2924/00
摘要： The invention is notably directed to an integrated circuit package (10c). Said package has a layer structure with ICs and electrodes (17) arranged in electrical connection with a layer (16) of the layer structure. The package further comprises one or more fluid circuit sections (19), each meant to receive a respective electrolyte solution (or two distinct solutions, see the dual flow redox mode described below). Each solution involved has soluble electroactive species. A fluid section is designed to receive and allow an electrolyte solution to contact corresponding electrodes, such as to supply power to the ICs, in operation. As electrodes are integrated to the package, electrical power can be supplied close to the ICs, thereby improving efficiency of the power supply. Finally, as a liquid is involved in-situ, suitable heat removal can be contemplated, it being noted that electrical power delivery and heat removal needs are congruent.
摘要翻译：本发明特别涉及一种集成电路封装（10c）。所述封装具有层状结构，其中IC和电极（17）布置成与层结构的层（16）电连接。包装还包括一个或多个流体回路段（19），每个流体回路段（19）各自意图接收相应的电解质溶液（或两个不同的溶液，参见下面描述的双流氧化还原模式）。涉及的每个溶液都具有可溶性电活性物质。流体部分设计成在操作中接收和允许电解质溶液接触相应的电极，例如为IC供电。当电极集成到封装中时，可以在IC附近提供电力，从而提高电源的效率。最后，当液体原位参与时，可以考虑合适的除热，应注意的是电力输送和散热需求是一致的。

7. 发明申请

WO2010086806A2 REFRIGERATION SYSTEM AND METHOD FOR CONTROLLING A REFRIGERATION SYSTEM 审中-公开
标题翻译：制冷系统和控制制冷系统的方法
公开(公告)号：WO2010086806A2
公开(公告)日：2010-08-05
申请号：PCT/IB2010/050371
申请日：2010-01-27
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , MICHEL, Bruno , SMITH, Brian
发明人： MICHEL, Bruno , SMITH, Brian
IPC分类号： F25B5/04 , F25B49/02
CPC分类号： F25B5/04 , F25B2600/21 , H05K7/20809 , H05K7/20836
摘要： A refrigeration system comprises a compressor (COMP), a condenser (COND) and at least one multi-stage evaporator (MSE) with at least one first evaporator (FBE) as a first stage and at least one expansion device evaporator (EDE) as at least one further stage downstream the corresponding first stage. Each first evaporator (FBE) is arranged at a respective first compo¬ nent (Cl) for absorbing heat dissipated by the respective first component (Cl). Each expan¬ sion device evaporator (EDE) is arranged at a respective at least one further component (FC) for absorbing heat dissipated by the respective further component (FC). A flow of a working fluid (WF) of the refrigeration system is controlled such that the working fluid (WF) is in a liquid state when entering the first stage and is in a vapor state when leaving a last stage of the respective multi-stage evaporator (MSE).
摘要翻译：制冷系统包括压缩机（COMP），冷凝器（COND）和至少一个多级蒸发器（MSE），其具有至少一个作为第一级的第一蒸发器（FBE）和至少一个膨胀装置蒸发器（EDE），作为在相应的第一阶段下游的至少一个另外的阶段。每个第一蒸发器（FBE）布置在相应的第一组分（Cl）处，用于吸收由相应的第一组分（C1）消散的热量。每个膨胀装置蒸发器（EDE）被布置在相应的至少一个另外的部件（FC）上，用于吸收由相应的另一部件（FC）消散的热量。控制制冷系统的工作流体（WF）的流动，使得工作流体（WF）在进入第一阶段时处于液体状态，并且当离开相应多级的最后阶段时处于蒸气状态蒸发器（MSE）。

8. 发明申请

WO2013001390A1 ADSORPTION HEAT EXCHANGER DEVICES 审中-公开
标题翻译：吸附式热交换器装置
公开(公告)号：WO2013001390A1
公开(公告)日：2013-01-03
申请号：PCT/IB2012/052900
申请日：2012-06-08
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , RUCH, Patrick , MICHEL, Bruno , GOICOCHEA, Javier V.
发明人： RUCH, Patrick , MICHEL, Bruno , GOICOCHEA, Javier V.
IPC分类号： F25B17/08 , F25B37/00
CPC分类号： F25B17/08 , B82Y30/00 , C01B32/158 , C01P2006/32 , F25B17/083 , F25B37/00 , F28F3/02 , Y02A30/276 , Y02A30/278 , Y02B30/64 , Y02P20/124 , Y10S977/742
摘要： Adsorption heat exchanger devices (11, 30) are provided for solid sorption refrigeration systems (1). Such a device includes a heat exchanger (12) having a plurality of projections (17) arranged for extending into an adsorbate of the system (1) in use. An adsorption structure (13, 31) is formed on the heat exchanger (12) for adsorption of said adsorbate. The adsorption structure (13, 31) comprises a plurality of elongate adsorption elements (20) extending outwardly from each of said projections (17) of the heat exchanger (12).
摘要翻译：为固体吸附制冷系统（1）提供吸附热交换器装置（11,30）。这种装置包括具有多个突起（17）的热交换器（12），其布置成在使用中延伸到系统（1）的吸附物中。在热交换器（12）上形成吸附结构（13,31），用于吸附所述被吸附物质。吸附结构（13,31）包括从热交换器（12）的每个所述突起（17）向外延伸的多个细长的吸附元件（20）。

9. 发明申请

WO2012055781A1 THERMAL POWER PLANE FOR INTEGRATED CIRCUITS 审中-公开
标题翻译：用于集成电路的热电源
公开(公告)号：WO2012055781A1
公开(公告)日：2012-05-03
申请号：PCT/EP2011/068426
申请日：2011-10-21
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , BAROWSKI, Dr., Harry , HUBER, Dr., Andreas , HARRER, Dr., Hubert , NIGGEMEIER, Tim , SUPPER, Jochen , MICHEL, Bruno , BRUNSCHWILER, Thomas , PAREDES, Stephan
发明人： BAROWSKI, Dr., Harry , HUBER, Dr., Andreas , HARRER, Dr., Hubert , NIGGEMEIER, Tim , SUPPER, Jochen , MICHEL, Bruno , BRUNSCHWILER, Thomas , PAREDES, Stephan
IPC分类号： H01L23/498 , H01L23/50 , H01L23/528
CPC分类号： H01L23/50 , H01L23/3677 , H01L23/38 , H01L23/473 , H01L23/481 , H01L23/49833 , H01L23/5286 , H01L25/18 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2225/06513 , H01L2225/06541 , H01L2225/06589 , H01L2924/09701 , Y10T29/49002 , Y10T29/49155 , H01L2924/014
摘要： A mechanism is provided for a thermal power plane that delivers power and constitutes minimal thermal resistance. The mechanism comprises a processor layer coupled, via a first set of coupling devices, to a signaling and input/output (I/O) layer and a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the mechanism, the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism. In the mechanism, the power delivery layer comprises a plurality of conductors, a plurality of insulating materials, one or more ground planes, and a plurality of through laminate vias. In the mechanism, the signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.
摘要翻译：提供了一种用于传递功率并构成最小热阻的火力发电平面的机构。该机构包括经由第一组耦合装置耦合到经由第二组耦合装置耦合到处理器层的信令和输入/输出（I / O）层和电力输送层的处理器层。在该机构中，功率传递层专用于仅传递功率，并且不向机构的元件提供数据通信信号。在该机构中，电力输送层包括多个导体，多个绝缘材料，一个或多个接地平面以及多个通过层压体的通孔。在该机制中，信令和输入/输出（I / O）层专用于仅向数据通信信号发送数据通信信号并从处理器层接收数据通信信号，并且不向处理器层的元件供电。

10. 发明申请

WO2012085716A1 SOLID SORPTION REFRIGERATION 审中-公开
标题翻译：固体制冷
公开(公告)号：WO2012085716A1
公开(公告)日：2012-06-28
申请号：PCT/IB2011/055370
申请日：2011-11-30
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , MICHEL, Bruno , RUCH, Patrick
发明人： MICHEL, Bruno , RUCH, Patrick
IPC分类号： F25B17/08 , F28F13/18 , F25B35/04
CPC分类号： B21D53/02 , F25B15/00 , F25B17/08 , F25B35/04 , F28F13/185 , Y02A30/276 , Y02A30/278 , Y02B30/64 , Y10T29/4935 , Y10T29/49359
摘要： Integrated adsorption and heat exchanger devices are provided for solid sorption refrigeration systems (1), together with methods for making such devices. An integrated adsorption and heat exchanger device (20, 30, 45, 52) comprises a solid material having formed therein both a porous adsorption structure (21, 31, 44, 53), which is pervious to an adsorbate of said system (1), and a heat exchanger structure (22, 32), which is impervious to said adsorbate, for heat exchange with the porous adsorption structure in operation of the system (1).
摘要翻译：为固体吸附制冷系统（1）提供集成吸附和热交换器装置，以及制造这种装置的方法。集成的吸附和热交换器装置（20,30,45,52）包括其中形成有可渗透所述系统（1）的被吸附物的多孔吸附结构（21,31,44,53）的固体材料，，以及在所述系统（1）的操作中不渗透所述被吸附物的热交换器结构（22,32），用于与所述多孔吸附结构进行热交换。

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