专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2006067028A3 CIRCUIT BOARD TO BE FITTED WITH ELECTRICAL AND/OR ELECTRONIC COMPONENTS 审中-公开
标题翻译：与至少一个侧METALLISIERTE开口于额叶和安排至少两个这样的电路板等电路板
公开(公告)号：WO2006067028A3
公开(公告)日：2006-08-31
申请号：PCT/EP2005056330
申请日：2005-11-29
申请人： ENDRESS & HAUSER GMBH & CO KG , BIRGEL DIETMAR , HAUPTVOGEL KARL-PETER , KRUEGER JUERGEN , BURGER PAUL
发明人： BIRGEL DIETMAR , HAUPTVOGEL KARL-PETER , KRUEGER JUERGEN , BURGER PAUL
IPC分类号： H05K1/11 , H01R12/55 , H05K1/14
CPC分类号： H05K1/148 , H01R4/027 , H01R12/523 , H05K3/3405 , H05K3/403 , H05K2201/09163 , H05K2201/0919 , H05K2201/09845 , H05K2201/10287 , H05K2201/1034 , H05K2201/10363
摘要： The invention relates to printed circuit boards which are interconnected by means of flexible strip conductors or jumpers. The aim of the invention is to solder the jumpers to the circuit boards in one step along with other SMD components and other components in a reflow soldering furnace. Said aim is achieved by mounting preferably metal-plated lateral openings (17) in the face (18) of the circuit board (10), which is usually provided with several inner layers (11) as well as inner strip conductors (12) and outer strip conductors (13). Terminal pins or connecting wires (16) of a jumper (15) that are plugged into said openings (17) can be soldered to the circuit board (10) together with other components in a reflow soldering furnace after introducing or applying solder paste.
摘要翻译：本发明涉及印刷电路板，其通过柔性导体或跳线互连。所希望的是焊接跳线在焊接工艺中，并且在步骤与其它SMD和在回流炉中的电路板的其它组件。为了这个目的，侧向开口（17），是在具有通常为多个内部层（11）和内部轨道（12）和在端面外导体（13）的本发明的电路板（10）（18）被安装，其优选被金属化。输入或跳线（15）的焊膏（16）的应用后，有可以与一起在电路板（10）其它部件设置在插入端子引脚或引线的回流炉进行焊接。

2. 发明申请

WO2004077901A2 PRINTED CIRCUIT BOARD AND METHOD FOR FIXING WIRED PARTS THERETO 审中-公开
标题翻译：电路板和方法用于固定引线元件在电路板上
公开(公告)号：WO2004077901A2
公开(公告)日：2004-09-10
申请号：PCT/EP2004001983
申请日：2004-02-27
申请人： ENDRESS & HAUSER GMBH & CO KG , BIRGEL DIETMAR , HAUPTVOGEL KARL-PETER
发明人： BIRGEL DIETMAR , HAUPTVOGEL KARL-PETER
IPC分类号： H05K1/11 , H05K3/34 , H05K1/18
CPC分类号： H05K1/116 , H05K3/3447 , H05K3/3484 , H05K2201/09845 , H05K2203/1446
摘要： Wired parts often cause a problem during overhead transport of a fitted printed circuit board, being able to fall out of the through bores because said wired parts are not glued or fastened to the printed board by means of retaining clips or snap-in devices. The invention solves said problem by means of a printed circuit board and a method for fixing wired parts thereto. The inventive printed circuit board (10) comprises a recess (24, 24') in a peripheral area of each through bore (20). Bent loose ends (22) of the connecting pins or connecting wires (18) of the wired part (16) are placed in said recesses (24; 24''). The quality of the soldered joint is improved especially during overhead soldering in a reflow soldering furnace as the solder (32) flows into the recesses (24 or 24') and the through bores (20) during the overhead soldering process in the reflow furnace. The length of the connecting wires (18) effectively wetted by the solder (32) is greater than during conventional soldering, making the soldered joint more secure.
摘要翻译：有线组件提供在组装的印刷电路板的高架运输常见的是一个问题。如果它们不胶合或通过支架或闭锁板上的设备附接，它们可以通过孔掉出的。本发明解决了由一个电路板的问题，并用于在电路板固定引脚元件的方法。所述电路板（10）具有用于此目的的的周边区域的通孔（20）分别具有一个凹口（24，24'）在所述电路板（10），其中，凹部（24; 24“）弯曲的端子销的自由端部（22）或有线部件（16）的连接线（18）被放置。特别是当在回流焊接开销焊接炉钎焊的质量得到了改善，因为焊料在凹部24和24在焊接工艺过程中的开销“和在通孔20流向32 在回流炉。这有效地通过引线的焊料32长度18比传统的焊接时，铜焊本身润湿因此更安全。

3. 发明申请

WO2007023030A3 METHOD FOR SOLDERING SMD COMPONENTS, PRINTED CIRCUIT BOARD AND REFLOW SOLDERING FURNACE THEREFOR 审中-公开
标题翻译：焊接SMD元件，PCB和REF低焊接管的方法
公开(公告)号：WO2007023030A3
公开(公告)日：2007-06-07
申请号：PCT/EP2006064215
申请日：2006-07-13
申请人： ENDRESS & HAUSER GMBH & CO KG , BIRGEL DIETMAR , HAUPTVOGEL KARL-PETER
发明人： BIRGEL DIETMAR , HAUPTVOGEL KARL-PETER
IPC分类号： H05K3/34
CPC分类号： H05K3/3494 , B23K1/0016 , B23K1/008 , B23K2201/42 , H05K3/3415 , H05K2203/1563 , H05K2203/1572 , H05K2203/1581
摘要： The invention enables lead-free soldering, in a reflow soldering furnace, of thermally critical, surface-mounted components together with thermally uncritical SMD components, on one side of a printed circuit board. Thermally critical and uncritical components (20, 22) are inserted into the soldering paste on the printed circuit board (10). According to the invention, said printed circuit board (10) is transported with other printed circuit boards (10), with the equipped first side facing upwards, through the reflow soldering furnace (30), and soldered in a soldering chamber (42). Thermal energy acting on the printed circuit board (10) in the lower region (46) thereof is adjusted in the soldering chamber (42) in such a way that the temperature on the lower side of the printed circuit board (10) is higher than that on the equipped upper side of the printed circuit board (10). The soldering paste on the upper side of the printed circuit board (10) is reliably melted by said indirect heating, and the temperature of the thermally critical components on the upper side of the printed circuit board (10) is maintained below the critical temperature.
摘要翻译：本发明允许在回流焊接烘箱中无铅焊接热临界表面安装部件以及电路板一侧上的不热临界SMD部件。在电路板（10）上，在焊膏中使用热临界和非关键部件（20,22）。根据本发明，该电路基板（10）被运送与其他印刷电路板（10）与组装的第一侧向上通过回流焊接炉（30）和焊接在焊接室（42），为此目的，在钎焊室（42）具有其中一个底区域（46）上的印刷电路板（10）作用的热能被调整，使得在印刷电路板（10）的下方侧是更高的温度比在组装电路板（10）的上侧。通过这种间接加热，印刷电路板（10）上侧的焊膏可靠地熔化; 印刷电路板（10）上侧的热关键部件处的温度保持在临界温度以下。

4. 发明申请

WO2011117014A3 PRESSURE SENSOR 审中-公开
标题翻译：压力传感器
公开(公告)号：WO2011117014A3
公开(公告)日：2011-11-17
申请号：PCT/EP2011051740
申请日：2011-02-07
申请人： ENDRESS & HAUSER GMBH & CO KG , HAUPTVOGEL KARL-PETER , SCHMIDT ELKE , ROSBERG ANDREAS , DREWES ULFERT
发明人： HAUPTVOGEL KARL-PETER , SCHMIDT ELKE , ROSBERG ANDREAS , DREWES ULFERT
IPC分类号： G01L9/00
CPC分类号： G01L9/0075 , G01L19/0084
摘要： The invention relates to a pressure sensor (1) comprising a main body (2) and at least one measuring membrane (3), which is connected to the main body in a pressure-tight manner, forming a measuring chamber, by means of a first joint (4) comprising a first active hard solder, and a transducer (5, 6a, 6b) for converting a pressure-dependent deformation of the measuring membrane into an electric primary signal, and a primary signal path that extends from the transducer through at least one bore (8a, 8b) through the main body, wherein the primary signal path comprises at least one electrically conductive coating (7a, 7b) that extends along the wall of the bore (8a, 8b) without closing the bore. According to the invention the bore (8a, 8b) is closed by means of a second joint (10a, 10b) using a second active hard solder, wherein the second active hard solder closes the bore in a self-supporting manner and wherein the second active hard solder has a surface capable of being soft-soldered.
摘要翻译：的压力传感器（1）包括基体（2）和至少一个测量膜片（3），其通过第一接头的装置形成与所述基体的测量室（4）具有第一活性钎焊，是压力密封地连接，并且换能器（5 ，6A，6B），用于将所述测量膜片的压力相关的变形转换为电主信号包括通过至少一个孔图8a延伸的主信号路径（从换能器，图8b）延伸穿过基体，其中，所述主信号路径中的至少一个导电涂层（7a中，7b）的沿所述孔的壁（8A，8B）延伸，而不通过第二关节8b）的封闭的孔中，其特征在于，根据本发明的孔（8a中，（10A，10B）被关闭与第二活性钎焊，其中所述第二活性钎焊封闭孔自支撑的，且其中所述第二活性钎焊包括weichlotfähige表面。

5. 发明申请

WO02099904A3 ELECTROMECHANICAL CONVERTER COMPRISING AT LEAST ONE PIEZOELECTRIC ELEMENT 审中-公开
标题翻译：与至少一个压电元件机电转换器
公开(公告)号：WO02099904A3
公开(公告)日：2003-10-09
申请号：PCT/EP0205277
申请日：2002-05-14
申请人： ENDRESS & HAUSER GMBH & CO KG , LOPATIN SERGEJ , BIRGEL DIETMAR , HAUPTVOGEL KARL-PETER
发明人： LOPATIN SERGEJ , BIRGEL DIETMAR , HAUPTVOGEL KARL-PETER
IPC分类号： H01L41/047 , H01L41/083 , H02N2/04 , H04R17/00
CPC分类号： H01L41/0474 , H01L41/0831 , H01L41/0833 , H04R17/00
摘要： The invention relates to an electromechanical converter comprising at least one piezoelectric element (1, 13, 33) having a first surface carrying a first electrode (3, 15, 17), and at least one contact lug (5, 29, 31) by which means the piezoelectric element (1, 13, 33) is electrically connected. According to the invention, the electrical connection of the piezoelectric element (1, 13, 33) has very high contact stability, as the contact lug (5, 29, 31) is directly adjacent to the first electrode (3, 15, 17) and comprises at least one recess (7, 25, 27, 39) in which an adhesive (9) is placed, said adhesive connecting the contact lug (5, 29, 31) to the electrodes (3, 15, 17).
摘要翻译：它是设置有在被施加到第一表面上的第一电极（3，15，17）的至少一个压电元件（1，13，33），以及至少一个接触片（5，29，31）的机电转换器压电元件（1，13，33）电连接，其中，所述的压电元件（1，13，33）的电连接是本与由所述接触片具有非常高的接触可靠性（5，29，31）是直接第一至电极（3，15，17），并且在至少一个凹部（7，25，27，39），在其中的粘合剂（9）是由所述接触片（5，29，31）引入（与电极是3，15，17）。

6. 发明专利

DE502006008143D1 VERFAHREN ZUM LÖTEN VON SMD-BAUTEILEN AUF EINER LEITERPLATTE UND REFLOW-LÖTOFEN DAZU 未知
公开(公告)号：DE502006008143D1
公开(公告)日：2010-12-02
申请号：DE502006008143
申请日：2006-07-13
申请人： ENDRESS & HAUSER GMBH & CO KG
发明人： BIRGEL DIETMAR , HAUPTVOGEL KARL-PETER
IPC分类号： H05K3/34

7. 发明专利

DE102005043279B4 未知
公开(公告)号：DE102005043279B4
公开(公告)日：2009-03-26
申请号：DE102005043279
申请日：2005-09-09
申请人： ENDRESS & HAUSER GMBH & CO KG
发明人： BIRGEL DIETMAR , HAUPTVOGEL KARL-PETER
IPC分类号： H05K3/34

8. 发明专利

DE50211674D1 未知
公开(公告)号：DE50211674D1
公开(公告)日：2008-03-27
申请号：DE50211674
申请日：2002-05-14
申请人： ENDRESS & HAUSER GMBH & CO KG
发明人： LOPATIN SERGEJ , BIRGEL DIETMAR , HAUPTVOGEL KARL-PETER
IPC分类号： H01L41/047 , H01L41/083 , H02N2/04 , H04R17/00
摘要： An electromechanical transducer with at least one piezoelectric element with a first surface on which a first electrode is applied, and at least one contact flag, through which the piezoelectric element is electrically connected. The electrical connection of the piezoelectric element is of very high contact reliability, in that the contact flag directly contacts the first electrode and exhibits at least one depression, into which an adhesive is placed, by which the contact flag is connected with the electrode.

9. 发明专利

DE102004020897A1 Circuit board arrangement with connection entrance and electronic component e.g. for transformers, has connection wire deformed during insertion into connection entrance for testable fixture 未知
公开(公告)号：DE102004020897A1
公开(公告)日：2005-12-01
申请号：DE102004020897
申请日：2004-04-28
申请人： ENDRESS & HAUSER GMBH & CO KG
发明人： BIRGEL DIETMAR , HAUPTVOGEL KARL-PETER
IPC分类号： H05K1/02 , H05K1/11 , H05K1/18 , H05K3/30 , H05K3/32 , H05K3/34 , H05K3/40 , H05K3/42
摘要： An arrangement consists of a circuit board (12) with at least one connection entrance (14) formed form two blind hole borings (16,18) running in opposite directions, and having a constriction (20) and a connection wire/pin (22,26) of an electronic component (28) plugged into the connection entrance (14). The connection wire/pin (22,26) is deformed after being plugged through the connection entrance (14) so it is firmly clamped in the connection entrance (14). An independent claim is included for a method for fixing a terminal wire/pin.

10. 发明专利

DE10349956A1 Printed circuit board (PCB) for electronic components has a drilled hole, a location on the PCB with no drilled hole and an electronic component 未知
公开(公告)号：DE10349956A1
公开(公告)日：2005-06-09
申请号：DE10349956
申请日：2003-10-24
申请人： ENDRESS & HAUSER GMBH & CO KG
发明人： BIRGEL DIETMAR , HAUPTVOGEL KARL-PETER
IPC分类号： H05K1/18 , H05K3/34 , H05K3/32
摘要： An electronic component (15) has first (15.1) and second (15.2) contacts. The first contact fits in a drilled hole (10) and the second contact on a location (11) with no drilled hole on a printed circuit board (1). With a mechanical link to a printed circuit board (PCB), the first and second contacts link to the PCB by means of a soldered joint (16.1) and an adhesive (16.2) respectively. Independent claims are also included for the following: (A) An electronic component with first and second contacts; (B) and for a method for fitting out a printed circuit board.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式