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1. 发明申请

WO2006062766A3 EFFICIENT MICRO-MACHINING APPARATUS AND METHOD EMPLOYING MULTIPLE LASER BEAMS 审中-公开
标题翻译：有效的微加工设备和使用多个激光束的方法
公开(公告)号：WO2006062766A3
公开(公告)日：2006-10-12
申请号：PCT/US2005043112
申请日：2005-11-29
申请人： ELECTRO SCIENT IND INC , CUTLER DONALD R , BAIRD BRIAN W , HARRIS RICHARD S , HEMENWAY DAVID M , LO HO WAI , NILSEN BRADY E , OSAKO YASU , SUN LEI , SUN YUNLONG , UNRATH MARK A
发明人： CUTLER DONALD R , BAIRD BRIAN W , HARRIS RICHARD S , HEMENWAY DAVID M , LO HO WAI , NILSEN BRADY E , OSAKO YASU , SUN LEI , SUN YUNLONG , UNRATH MARK A
IPC分类号： H01L21/26
CPC分类号： B23K26/0673 , B23K26/0622 , B23K26/067 , B23K26/082
摘要： A laser beam switching system (50) employs a laser (52) coupled to a beam switching device (58) that causes a laser beam to switch between first and second beam positioning heads such that while the first beam positioning head (60) is directing the laser beam to process a workpiece target location, the second beam positioning head (62) is moving to another target location and vice versa. A preferred beam switching device includes first and second AOMs. When RF is applied to the first AOM (72), the laser beam is diffracted toward the first beam positioning head, and when RF is applied to the second AOM (74), the laser beam is diffracted toward the second beam positioning head. A workpiece processing system (120) employs a common modular imaged optics assembly (122) and an optional variable beam expander (94) for optically processing multiple laser beams.
摘要翻译：激光束切换系统（50）采用耦合到光束切换装置（58）的激光器（52），其使激光束在第一和第二光束定位头之间切换，使得当第一光束定位头（60）指向激光束处理工件目标位置，第二光束定位头（62）移动到另一个目标位置，反之亦然。优选的光束切换装置包括第一和第二AOM。当RF施加到第一AOM（72）时，激光束朝向第一光束定位头衍射，并且当RF施加到第二AOM（74）时，激光束被朝向第二光束定位头衍射。工件处理系统（120）采用公共模块化成像光学组件（122）和用于光学处理多个激光束的可选可变光束扩展器（94）。

2. 发明申请

WO2005016586A3 METHODS OF LINK PROCESSING USING LASERS 审中-公开
标题翻译：使用激光的链接处理方法
公开(公告)号：WO2005016586A3
公开(公告)日：2006-02-23
申请号：PCT/US2004026977
申请日：2004-08-18
申请人： ELECTRO SCIENT IND INC , SUN YUNLONG , HARRIS RICHARD S , LO HO WAI , BAIRD BRIAN W , JOHNSON JAY CHRISTOPHER
发明人： SUN YUNLONG , HARRIS RICHARD S , LO HO WAI , BAIRD BRIAN W , JOHNSON JAY CHRISTOPHER
IPC分类号： B23K20060101 , B23K26/06 , B23K26/38 , H01S20060101 , H04J14/02 , B23K26/00
CPC分类号： H01L23/5258 , B23K26/0613 , B23K26/0622 , B23K2201/40 , H01L2924/0002 , H01L2924/00
摘要： A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links.
摘要翻译：具有特别定制的时间功率特性的激光脉冲，而不是传统的时间形状或基本上正方形的形状，切断了IC连接。特别定制的激光脉冲优选地在激光脉冲的开始处具有过冲，或者在激光脉冲的持续时间内具有尖峰。尖峰的定时优先设置在链路被大部分去除的时间之前。特别定制的激光脉冲功率轮廓允许使用更宽的激光脉冲能量范围和更短的激光波长（例如绿色和紫外线）来切断连接，而不会对基板和钝化结构材料的任何一侧和底层链接。

3. 发明申请

WO2006009818A3 SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LASER BEAM SPOTS 审中-公开
标题翻译：使用多个激光束的半导体结构处理
公开(公告)号：WO2006009818A3
公开(公告)日：2007-03-01
申请号：PCT/US2005021406
申请日：2005-06-16
申请人： ELECTRO SCIENT IND INC , BRULAND KELLY J , LO HO WAI , BAIRD BRIAN W , EVANS FRANK G , HARRIS RICHARD S , SUN YUNLONG , SWARINGEN STEPHEN N
发明人： BRULAND KELLY J , LO HO WAI , BAIRD BRIAN W , EVANS FRANK G , HARRIS RICHARD S , SUN YUNLONG , SWARINGEN STEPHEN N
IPC分类号： H01L21/26
CPC分类号： B23K26/067 , B23K26/0676 , B23K26/0853 , B23K2201/40 , G11C17/143 , G11C17/16 , G11C17/18 , G11C29/02 , G11C29/027 , H01L21/268 , H01L23/5258 , H01L2924/0002 , H01L2924/00
摘要： Methods and systems process electrically conductive links on or within a semiconductor substrate (740) using multiple laser beams. For example, a method utilizes N series of laser pulses to obtain a throughput benefit, wherein N = 2. The links are arranged in a plurality of substantially parallel rows extending in a generally lengthwise direction. The N series of laser pulses propagate along N respective beam axes until incident upon selected links. The pattern of resulting laser spots may be on links in N distinct rows, on distinct links in the same row, or on the same link, either partially or completely overlapping. The resulting laser spots may be offset from one another in the lengthwise direction of the rows or offset from one another in a direction perpendicular to the lengthwise direction of the rows, or both.
摘要翻译：方法和系统使用多个激光束在半导体衬底（740）上或内部处理导电链路。例如，一种利用N系列激光脉冲获得吞吐量优点的方法，其中N = 2。所述链路被布置成沿大致长度方向延伸的多个基本平行的行。 N系列激光脉冲沿着N个相应的波束轴传播，直到在所选择的链路上入射。所产生的激光斑点的图案可以是N个不同行中的链接，在相同行中的不同链接上，或者在同一链接上，部分地或完全重叠。所得到的激光点可以在行的长度方向上彼此偏移，或者在与行的长度方向垂直的方向上彼此偏移，或者两者偏离。

4. 发明申请

WO2008014331A3 TANDEM PHOTONIC AMPLIFIER 审中-公开
公开(公告)号：WO2008014331A3
公开(公告)日：2008-10-23
申请号：PCT/US2007074340
申请日：2007-07-25
申请人： ELECTRO SCIENT IND INC , BAIRD BRIAN W , HEMENWAY DAVID M , PENG XIOAYUAN , REN WENSHENG
发明人： BAIRD BRIAN W , HEMENWAY DAVID M , PENG XIOAYUAN , REN WENSHENG
IPC分类号： H04B10/17 , H01S4/00
CPC分类号： H01S3/2316 , B23K26/0622 , H01S3/0064 , H01S3/0085 , H01S3/06758 , H01S3/09408 , H01S3/0941 , H01S3/09415 , H01S3/10038 , H01S3/2333
摘要： Embodiments of laser systems advantageously use pulsed optical fiber-based laser source (12) output, the temporal pulse profile of which may be programmed to assume a range of pulse shapes. Pulsed fiber lasers are subject to peak power limits to prevent an onset of undesirable nonlinear effects; therefore, the laser output power of these devices is subsequently amplified in a diode-pumped solid state photonic power amplifier (DPSS-PA) (16). The DPSS PA provides for amplification of the desirable low peak power output of a pulsed fiber master oscillator power amplifier (14) to much higher peak power levels and thereby also effectively increases the available energy per pulse at a specified pulse repetition frequency. The combination of the pulsed fiber master oscillator power amplifier and the diode-pumped solid state power amplifier is referred to as a tandem solid state photonic amplifier (10).
摘要翻译：激光系统的实施例有利地使用基于脉冲光纤的激光源（12）输出，其时间脉冲分布可被编程为呈现一定范围的脉冲形状。脉冲光纤激光器受到峰值功率限制，以防止发生不期望的非线性效应; 因此，这些器件的激光输出功率随后在二极管泵浦固态光子功率放大器（DPSS-PA）（16）中放大。 DPSS PA提供将脉冲光纤主振荡器功率放大器（14）的期望的低峰值功率输出放大到更高的峰值功率电平，从而也可以在指定的脉冲重复频率下有效地增加每个脉冲的可用能量。脉冲光纤主振荡器功率放大器和二极管泵浦固态功率放大器的组合被称为串联固态光子放大器（10）。

5. 发明申请

WO2009120918A3 LASER MICROMACHINING USING PROGRAMMABLE PULSE SHAPES 审中-公开
标题翻译：使用可编程脉冲形状的激光微型计算机
公开(公告)号：WO2009120918A3
公开(公告)日：2009-12-23
申请号：PCT/US2009038489
申请日：2009-03-27
申请人： ELECTRO SCIENT IND INC , PENG XIAOYUAN , BAIRD BRIAN W , JORDENS WILLIAM J , HEMENWAY DAVID MARTIN
发明人： PENG XIAOYUAN , BAIRD BRIAN W , JORDENS WILLIAM J , HEMENWAY DAVID MARTIN
IPC分类号： H01S3/10 , H01S3/00
CPC分类号： H01S3/0057 , B23K26/0622 , G02F1/0327
摘要： Laser pulse shaping techniques produce tailored laser pulse spectral output (64, 66). The laser pulses can be programmed to have desired pulse widths and pulse shapes (such as sub-nanosecond to 10 ns 20 ns pulse widths with 1 ns to several nanoseconds leading edge rise times). Preferred embodiments are implemented with one or more electro-optical modulators (250, 254) receiving drive signals that selectively change the amount of incident pulsed laser emission (106, 112, 114) to form a tailored pulse output. Triggering the drive signal from the pulsed laser emission suppresses jitter associated with other stages of the link processing system and substantially removes jitter associated with pulsed laser emission build up time.
摘要翻译：激光脉冲整形技术产生定制的激光脉冲光谱输出（64,66）。激光脉冲可以被编程为具有期望的脉冲宽度和脉冲形状（例如亚纳秒到10ns的20ns脉冲宽度，1ns至几纳秒前沿上升时间）。优选实施例是用一个或多个电光调制器（250,254）来实现的，所述电光调制器（250,254）接收选择性地改变入射脉冲激光发射量（106,112,114）的驱动信号，以形成定制的脉冲输出。从脉冲激光发射触发驱动信号抑制与链路处理系统的其他级相关联的抖动，并且基本上消除与脉冲激光发射建立时间相关联的抖动。

6. 发明申请

WO2010033723A2 PHOTONIC MILLING USING DYNAMIC BEAM ARRAYS 审中-公开
标题翻译：用动态光束阵列进行光子铣削
公开(公告)号：WO2010033723A2
公开(公告)日：2010-03-25
申请号：PCT/US2009057346
申请日：2009-09-17
申请人： ELECTRO SCIENT IND INC , BAIRD BRIAN W , BRULAND KELLY J , HAINSEY ROBERT
发明人： BAIRD BRIAN W , BRULAND KELLY J , HAINSEY ROBERT
IPC分类号： H01L21/82 , H01L21/8242
CPC分类号： B23K26/03
摘要： A laser processing system includes a beam positioning system to align beam delivery coordinates relative to a workpiece. The beam positioning system generates position data corresponding to the alignment. The system also includes a pulsed laser source and a beamlet generation module to receive a laser pulse from the pulsed laser source. The beamlet generation module generates a beamlet array from the laser pulse. The beamlet array includes a plurality of beamlet pulses. The system further includes a beamlet modulator to selectively modulate the amplitude of each beamlet pulse in the beamlet array, and beamlet delivery optics to focus the modulated beamlet array onto one or more targets at locations on the workpiece corresponding to the position data.
摘要翻译：激光加工系统包括光束定位系统，以相对于工件对准光束输送坐标。光束定位系统产生对应的位置数据。该系统还包括脉冲激光源和小射束产生模块以接收来自脉冲激光源的激光脉冲。小束生成模块根据激光脉冲生成小束阵列。小束阵列包括多个小束脉冲。该系统还包括小波束调制器，以选择性地调制小射束阵列中的每个小射束脉冲的振幅，并且小射束传送光学器件将调制的小射束阵列聚焦到与位置数据对应的工件上的位置上的一个或多个目标上。

7. 发明公开

EP1365880A4 ULTRAVIOLET LASER ABLATIVE PATTERNING OF MICROSTRUCTURES IN SEMICONDUCTORS 审中-公开
标题翻译：微构造均与紫外激光，半导体生产模式
公开(公告)号：EP1365880A4
公开(公告)日：2008-04-16
申请号：EP02707453
申请日：2002-01-10
申请人： ELECTRO SCIENT IND INC
发明人： BAIRD BRIAN W , WOLFE MICHAEL J , HARRIS RICHARD J , FAHEY KEVIN P , ZOU LIAN-CHENG , MCNEIL THOMAS R
IPC分类号： B23K26/06 , B23K26/00 , B23K26/08 , B23K26/10 , B23K26/38 , B23K26/40 , B29C35/08 , B29C67/00 , H01L21/302
CPC分类号： B23K26/0626 , B23K26/0853 , B23K26/0884 , B23K26/40 , B23K2201/40 , B23K2203/52
摘要： Patterns with feature sizes of less than 50 microns are rapidly formed directly in semiconductors, particularly silicon, using ultraviolet laser ablation. These patterns include very high aspect ratio cylindrical through-hole openings for integrated circuit connections; singulation of processed die contained on semiconductor wafers; and microtab cutting to separate microcircuit workpieces from a parent semiconductor wafer. Laser output pulses (32) from a diode-pumped, Q-switched frequency-tripled Nd:YAG, Nd:YVO4, or Nd:YLF is directed to the workpiece (12) with high speed precision using a compound beam positioner. The optical system produces a Gaussian spot size, or top hat beam profile, of about 10 microns. The pulse energy used for high-speed ablative processing of silicon using this focused spot size is greater than 200 µJ per pulse at PRFs greater than 5 kHz and preferably above 15 kHz. The laser pulsewidth measured at the full width half-maximum points is preferably less than 80 ns.

8. 发明公开

EP2030224A4 LASER PROCESSING OF WORKPIECES CONTAINING LOW-K DIELECTRIC MATERIAL 审中-公开
标题翻译：具有低介电常数材料工件的激光加工
公开(公告)号：EP2030224A4
公开(公告)日：2011-10-19
申请号：EP07797657
申请日：2007-05-22
申请人： ELECTRO SCIENT IND INC
发明人： BAIRD BRIAN W
IPC分类号： H01L21/301 , H01L21/268 , H01L21/311 , H01L21/78
CPC分类号： H01L21/268 , B23K26/0624 , B23K26/083 , B23K26/0876 , B23K26/40 , B23K2203/172 , B23K2203/42 , B23K2203/50 , H01L21/31105 , H01L21/31127 , H01L21/481

9. 发明申请

WO2012032064A3 CHALCOPYRITE-TYPE SEMICONDUCTOR PHOTOVOLTAIC DEVICE 审中-公开
标题翻译： CHALCOPYRITE型半导体光电器件
公开(公告)号：WO2012032064A3
公开(公告)日：2012-06-28
申请号：PCT/EP2011065416
申请日：2011-09-06
申请人： FIANIUM LTD , BAIRD BRIAN W , GERKE TIMOTHY D
发明人： BAIRD BRIAN W , GERKE TIMOTHY D
IPC分类号： H01L27/142 , B23K26/06 , B23K26/073 , B23K26/36 , B23K26/40 , H01L31/0749
CPC分类号： H01L31/0236 , B23K26/0624 , B23K26/0732 , B23K26/364 , B23K26/40 , B23K2203/172 , H01L21/268 , H01L21/78 , H01L31/046 , H01L31/0463 , H01L31/073 , H01L31/0749 , H01L31/18 , Y02E10/543
摘要： A method comprising providing a layer structure for a photovoltaic device, the layer structure comprising an electrode, a light absorber comprising a layer of chalcopyrite-type semiconductor material, such as copper indium gallium diselenide, disposed on the electrode and a transparent electrode disposed on the light absorber. The method also comprises delivering a spatially-shaped picosecond pulsed laser beam so as to remove material from a region of the transparent electrode so as to expose at least a portion of the light absorber.
摘要翻译：一种方法，包括提供用于光伏器件的层结构，所述层结构包括电极，设置在电极上的黄铜矿型半导体材料如铜铟镓二硒化物层的光吸收体和设置在电极上的透明电极光吸收器。该方法还包括递送空间形状的皮秒脉冲激光束，以从透明电极的区域去除材料，以暴露光吸收体的至少一部分。

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