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    • 2. 发明申请
    • CUTTING SEGMENT FOR CUTTING TOOL AND CUTTING TOOLS
    • 切割工具切割工具切割工具
    • WO2006112654A9
    • 2012-12-27
    • PCT/KR2006001442
    • 2006-04-19
    • EHWA DIAMOND IND CO LTDGENERAL TOOL INCKIM SOO-KWANGPARK HEE-DONGCHANG JOON-HOKIM JONG-HO
    • KIM SOO-KWANGPARK HEE-DONGCHANG JOON-HOKIM JONG-HO
    • B23D61/02
    • B23D61/18B24D5/123B24D99/005B28D1/121
    • The invention provides a cutting segment for a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool having the cutting segment. The cutting segment includes a cutting surface for cutting a work piece and a plurality of abrasive particle layers. The abrasive particle layers are disposed perpendicular to a cutting direction. Each of the abrasive layers has a plurality of abrasive particle rows in a width direction of the cutting segment. Each of the abrasive rows has a plurality of abrasive particles arranged in a line. Further, the abrasive layers have a plurality of blank sections therebetween. In the blanks sections, abrasive particles are absent or have a concentration of 70% or less with respect to those in the abrasive rows. In addition, the blank sections include relatively thick blank sections and relatively thin blank sections.
    • 本发明提供了一种用于切割或钻削诸如石头,砖,混凝土和沥青的脆性工件的切割工具的切割部分和具有切割部分的切割工具。 切割段包括用于切割工件和多个磨料颗粒层的切割表面。 研磨颗粒层垂直于切割方向设置。 每个研磨层在切割段的宽度方向上具有多个研磨颗粒行。 每个磨料列具有排列成一行的多个磨料颗粒。 此外,磨料层之间具有多个坯料部分。 在坯料部分中,磨料颗粒不存在或者相对于磨料行的浓度为70%以下。 另外,空白部分包括相对较厚的空白部分和相对较薄的空白部分。