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1. 发明申请

WO2006071073A9 CUTTING SEGMENT OF CUTTING TOOL AND CUTTING TOOL 审中-公开
标题翻译：切割工具切割工具切割工具
公开(公告)号：WO2006071073A9
公开(公告)日：2010-03-04
申请号：PCT/KR2005004603
申请日：2005-12-28
申请人： EHWA DIAMOND IND CO LTD , GENERAL TOOL INC , KIM SOO-KWANG , CHANG JOON-HO , PARK HEE-DONG , KIM JONG-HO
发明人： KIM SOO-KWANG , CHANG JOON-HO , PARK HEE-DONG , KIM JONG-HO
IPC分类号： B23D61/02
CPC分类号： B24D5/14 , B23D61/18 , B24D5/123 , Y10T83/9481 , Y10T407/235
摘要： The invention provides a cutting segment of a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool. The cutting segment includes a cutting surface for cutting a work piece and a number of abrasive particles arranged in a plurality of rows. Each of the abrasive rows includes high-concentration parts and low concentration parts. The high-concentration parts are grouped together to form a high-concentration area on the cutting surface and the low-concentration parts are grouped together to form a low-concentration area on the cutting surface. The invention provides the cutting segment and the cutting tool capable of improving cutting rate and useful life.
摘要翻译：本发明提供一种用于切割或钻孔诸如石头，砖，混凝土和沥青的脆性工件的切割工具的切割部分和切割工具。切割部分包括用于切割工件的切割表面和以多行排列的多个磨料颗粒。每个磨料列包括高浓度部件和低浓度部件。将高浓度部件分组在一起，在切割面上形成高浓度区域，将低浓度部分分组在一起，在切割面上形成低浓度区域。本发明提供了能够提高切割速度和使用寿命的切割部分和切割工具。

2. 发明申请

WO2005014243A2 DIAMOND TOOL 审中-公开
标题翻译：金刚石工具
公开(公告)号：WO2005014243A2
公开(公告)日：2005-02-17
申请号：PCT/KR2004002004
申请日：2004-08-10
申请人： EHWA DIAMOND IND CO LTD , GENERAL TOOL INC , KIM SOO-KWANG , KIM JONG-HO , PARK HEE-DONG
发明人： KIM SOO-KWANG , KIM JONG-HO , PARK HEE-DONG
IPC分类号： B23D61/02 , B22F3/00 , B22F7/06 , B23D61/18 , B23D63/02 , B24D5/12 , B26D20060101 , B28D1/04 , B28D1/12 , C22C26/00 , B26D
CPC分类号： B22F7/06 , B22F2005/001 , B23D61/18 , B24D5/123 , B28D1/041 , B28D1/121 , C22C26/00
摘要： A segment type diamond tool has diamond particles appropriately distributed on segments of the diamond tool, thereby providing an excellent cutting rate and reducing fine debris generated during a cutting operation. The diamond tool comprises a plurality of segments, each of the segments having a single plate-shaped layer or a plurality of plate-shaped layers of diamond particles arranged thereon, and the layers of diamond particles being arranged on the segment such that cutting grooves formed on a workpiece by a trailing layer of diamond particles are arranged between cutting grooves formed thereon by a leading layer of diamond particles, respectively, during a cutting operation on the workpiece, wherein the diamond particles are arranged at a predetermined tilt angle to a line connecting upper vertices or a line connecting lower vertices of a cross section, cut parallel in a cutting direction and perpendicular to a cutting surface, so that the diamond particles are protruded and uniformly spaced from each other on the cutting surface of the segment during the cutting operation on the workpiece.
摘要翻译：分段式金刚石刀具具有适当地分布在金刚石刀具的区段上的金刚石颗粒，由此提供优异的切削速率并且减少在切削操作期间产生的微小碎屑。该金刚石工具包括多个节段，每个节段具有布置在其上的单个板状层或多个金刚石粒子的板状层，并且金刚石粒子层布置在节段上，使得形成切割槽在工件上的切割操作期间，通过金刚石颗粒的后层在工件上分别布置由金刚石颗粒的引导层形成在其上的切割凹槽，其中金刚石颗粒相对于连接线上部顶点或连接横截面的下部顶点的线，在切割方向上平行地切割并且垂直于切割表面，使得在切割操作期间金刚石颗粒在片段的切割表面上彼此突出且均匀地间隔开在工件上。

3. 发明申请

WO2012157936A3 CMP PAD CONDITIONER, AND METHOD FOR PRODUCING THE CMP PAD CONDITIONER 审中-公开
标题翻译： CMP抛光调节器及其制造方法
公开(公告)号：WO2012157936A3
公开(公告)日：2013-03-21
申请号：PCT/KR2012003788
申请日：2012-05-15
申请人： EHWA DIAMOND IND CO LTD , LEE SEH KWANG , KIM YOUN CHUL , LEE JOO HAN , CHOI JAE KWANG , BOO JAE PHIL
发明人： LEE SEH KWANG , KIM YOUN CHUL , LEE JOO HAN , CHOI JAE KWANG , BOO JAE PHIL
IPC分类号： H01L21/304
CPC分类号： B24B53/017 , B24D18/00
摘要： The present invention relates to a conditioner for a chemical-mechanical polishing (CMP) pad used in a CMP process that is a part of a process for manufacturing a semiconductor device. More particularly, the present invention relates to a CMP pad conditioner in which the structure of a cutting tip has an insignificant variation in the abrasion of a polishing pad even when the type of slurry and pressure of the conditioner vary. The present invention also relates to a method for producing the CMP pad conditioner.
摘要翻译：本发明涉及用作制造半导体器件的工艺的一部分的CMP工艺中使用的化学机械抛光（CMP）焊盘的调节器。更具体地说，本发明涉及一种CMP垫调节器，即使当浆料的种类和调节器的压力变化时，切削刀片的结构也具有抛光垫的磨损的微不足道的变化。本发明还涉及一种用于制造CMP垫调节剂的方法。

4. 发明申请

WO2012121563A3 METHOD FOR RECYCLING SPENT CMP PAD CONDITIONER AND CMP PAD RECYCLED THEREBY 审中-公开
标题翻译：回收废弃CMP垫调节剂和再循环CMP垫的方法
公开(公告)号：WO2012121563A3
公开(公告)日：2012-12-27
申请号：PCT/KR2012001731
申请日：2012-03-09
申请人： EHWA DIAMOND IND CO LTD , LEE SEH KWANG , KIM YOUN CHUL , LEE JOO HAN
发明人： LEE SEH KWANG , KIM YOUN CHUL , LEE JOO HAN
IPC分类号： H01L21/304
CPC分类号： B24B53/017 , B24B55/12
摘要： The present invention relates to a CMP pad conditioner, and more particularly, to a method for recycling a spent CMP pad conditioner and a CMP pad conditioner recycled by the method for recycling for saving resources by recycling the spent CMP pad conditioner, which becomes spent when a diamond layer, which is coated on the surface of a CMP pad conditioner substrate having a protruding pattern, is worn down.
摘要翻译：本发明涉及一种CMP垫修整器，更具体地涉及一种用于回收利用该方法回收的废CMP垫修整器和CMP修整器的方法，以便通过回收废弃的CMP修整器来节省资源，涂覆在具有突起图案的CMP垫修整器基底的表面上的金刚石层被磨损。

5. 发明申请

WO2009102144A2 GLASS COMPOSITION FOR POLISHING WHEEL, POLISHING WHEEL USING SAME AND MANUFACTURING METHOD FOR SAME 审中-公开
标题翻译：抛光轮用玻璃组合物，使用该抛光轮的抛光轮及其制造方法
公开(公告)号：WO2009102144A2
公开(公告)日：2009-08-20
申请号：PCT/KR2009000637
申请日：2009-02-11
申请人： EHWA DIAMOND IND CO LTD , LEE JAE-HEE , SON SEUNG-KOOK
发明人： LEE JAE-HEE , SON SEUNG-KOOK
IPC分类号： C03C3/076
CPC分类号： C03C3/091 , C03C11/00
摘要： The present invention relates to a glass composition for a polishing wheel for polishing semiconductor wafers and the like, to a polishing wheel using same, and a manufacturing method for same. An aim of the present invention is to provide a glass composition for producing a polishing wheel with an improved polishing capability, a long lifespan, and improved performance in that said composition generates no scratches even in a super-finishing process adopting a foam glass manufacturing method, a polishing wheel using the glass composition, and a manufacturing method for same. The glass composition for the polishing wheel of the present invention contains: SiO2: 55~70%, B2O3: 10~25%, Al2O3: 5~15%, Na2O: 1~5%, Li2O: 0.5~2.5%, CaO: 1~5%, MgO: 0~3%, and TiO2:0~5% by wt %. The polishing wheel manufactured from the glass composition of the present invention is provided with an improved polishing capability, a long lifespan, and improved performance in that said composition generates no scratches even in a super-finishing process adopting a foam glass manufacturing method.
摘要翻译：抛光轮用玻璃组合物及使用其的抛光轮及其制造方法技术领域本发明涉及用于抛光半导体晶片等的抛光轮用玻璃组合物及使用该抛光轮的抛光轮及其制造方法。本发明的目的是提供一种抛光轮用玻璃组合物，该抛光轮具有改进的抛光能力，长的使用寿命和改进的性能，因为即使在采用泡沫玻璃制造方法的超精加工工艺中，所述组合物也不产生划痕，使用该玻璃组合物的抛光轮及其制造方法。本发明的抛光轮用玻璃组合物含有SiO2：55〜70％，B2O3：10〜25％，Al2O3：5〜15％，Na2O：1〜5％，Li2O：0.5〜2.5％，CaO： 1〜5％，MgO：0〜3％，TiO 2：0〜5重量％。由本发明的玻璃组合物制造的抛光轮具有改进的抛光能力，长寿命和改进的性能，因为即使在采用泡沫玻璃制造方法的超精加工工艺中，所述组合物也不产生划痕。

6. 发明申请

WO2012121548A3 CONDITIONER FOR FRAGILE PAD AND METHOD FOR MANUFACTURING SAME 审中-公开
标题翻译：脆片的调节剂及其制造方法
公开(公告)号：WO2012121548A3
公开(公告)日：2012-12-27
申请号：PCT/KR2012001673
申请日：2012-03-07
申请人： EHWA DIAMOND IND CO LTD , LEE SEH KWANG , KIM YOUN CHUL , LEE JOO HAN , LEE JONG JAE
发明人： LEE SEH KWANG , KIM YOUN CHUL , LEE JOO HAN , LEE JONG JAE
IPC分类号： H01L21/304
CPC分类号： B24B53/017 , B24D18/00
摘要： The present invention relates to a conditioner for a chemical-mechanical planarization (CMP) pad, which is used in a CMP process that is a part of a semiconductor element manufacturing process, and more particularly, to a conditioner for a fragile pad and a method for manufacturing same, the conditioner which can be used in a CMP environment using a slurry having low polishing particle content and/or a porous pad having relatively low hardness and very high porosity.
摘要翻译：用于化学机械抛光垫（CMP）的调节器技术领域本发明涉及一种用于化学机械抛光垫（CMP）的调节器，其用于作为半导体元件制造工艺的一部分的CMP工艺中，并且更具体地涉及用于易碎垫的调节器和方法用于制造可使用具有低抛光颗粒含量的浆料和/或具有相对低硬度和非常高孔隙率的多孔垫的CMP环境中的调理剂。

7. 发明申请

WO2009126004A3 DRILL BIT 审中-公开
标题翻译：钻头
公开(公告)号：WO2009126004A3
公开(公告)日：2010-01-14
申请号：PCT/KR2009001867
申请日：2009-04-10
申请人： EHWA DIAMOND IND CO LTD , HONG JAE-HYUN , CHOI JONG-SUK , HONG DO-UI
发明人： HONG JAE-HYUN , CHOI JONG-SUK , HONG DO-UI
IPC分类号： B23B51/02
CPC分类号： B23B51/06 , B23B2226/18 , B23B2226/315 , B23B2250/12 , B28D1/041 , B28D1/146 , B28D7/02 , Y10T408/45 , Y10T408/455 , Y10T408/81 , Y10T408/895 , Y10T408/896 , Y10T408/907
摘要： There is provided a drill bit capable of performing a continuous drilling operation on a high-strength workpiece such as a tempered tile and the like. The drill bit comprises a bit body having a receptor portion formed therein, the receptor portion being filled with a cutting oil; a drilling portion extended from one end of the bit body and coupled to the receptor portion of the bit body to form a channel in which a capillary phenomenon occurs, and having an opening formed in one end thereof; and a cutting portion provided in the opening of the drilling portion to drill a workpiece. The drill bit thus configured may be useful to enable a continuous drilling operation on the high-strength workpiece, to enable the refilling of a cutting oil used to cool the high-strength workpiece, to shorten a time for the drilling operation on the high-strength workpiece, and to drill the high-strength workpiece to the maximum extent using the minimum number of drill bits.
摘要翻译：提供了一种能够对诸如回火砖等高强度工件进行连续钻孔操作的钻头。所述钻头包括具有形成在其中的受体部分的钻头体，所述受体部分填充有切削油; 钻头部分从钻头体的一端延伸并且联接到钻头体的接收器部分以形成毛细现象发生的通道，并且在其一端形成有开口; 以及设置在钻孔部分的开口中以切割工件的切割部分。如此构造的钻头可以用于在高强度工件上进行连续钻孔操作，以使得能够重新填充用于冷却高强度工件的切削油，以缩短在高强度工件上进行钻孔操作的时间。使用最少数量的钻头，最大限度地钻高强度工件。

8. 发明申请

WO2009126002A2 DRILL BIT 审中-公开
标题翻译：钻头
公开(公告)号：WO2009126002A2
公开(公告)日：2009-10-15
申请号：PCT/KR2009001864
申请日：2009-04-10
申请人： EHWA DIAMOND IND CO LTD , HONG JAE-HYUN , CHOI JONG-SUK , KIM IN-WOO
发明人： HONG JAE-HYUN , CHOI JONG-SUK , KIM IN-WOO
IPC分类号： B23B45/00
CPC分类号： B23B51/06 , B23B2226/18 , B23B2226/315 , B28D1/041 , B28D1/146 , B28D7/02
摘要： There is provided a drill bit capable of performing a continuous drilling operation on a high-strength workpiece such as a tempered tile and the like. The drill bit comprises a bit body having a receptor portion formed therein, the receptor portion being filled with a cutting oil; a drilling portion extended from one end of the bit body and having a channel formed therethrough and an opening formed in one end thereof, the channel being coupled with a receptor portion of the bit body; a cutting portion provided in the opening of the drilling portion to drill a workpiece; and a channel opening and closing portion disposed inside the receptor portion to open and close the channel, thereby feeding a cutting oil. The drill bit thus configured may be useful to enable a continuous drilling operation on the high-strength workpiece, to enable the refilling of a cutting oil used to cool the high-strength workpiece, to shorten a time for the drilling operation on the high-strength workpiece, and to drill the high-strength workpiece to the maximum extent using the minimum number of drill bits.
摘要翻译：提供了能够对诸如回火砖等的高强度工件进行连续钻孔操作的钻头。所述钻头包括具有形成在其中的接收部分的钻头体，所述受体部分填充有切削油; 钻头部分从所述钻头体的一端延伸并且具有穿过其形成的通道和在其一端形成的开口，所述通道与所述钻头体的受体部分联接; 切割部，设置在所述钻孔部的开口部中，以钻出工件; 以及设置在所述接收器部分内部以打开和关闭所述通道的通道打开和关闭部分，从而供给切割油。如此构造的钻头可以用于在高强度工件上进行连续钻孔操作，以便能够重新填充用于冷却高强度工件的切削油，以缩短在高强度工件上进行钻孔操作的时间。使用最少数量的钻头，最大限度地钻高强度工件。

9. 发明申请

WO2009091140A3 CONDITIONER FOR CHEMICAL MECHANICAL PLANARIZATION PAD 审中-公开
标题翻译：化学机械平面压力调节器
公开(公告)号：WO2009091140A3
公开(公告)日：2009-10-08
申请号：PCT/KR2008007788
申请日：2008-12-30
申请人： EHWA DIAMOND IND CO LTD , AN JUNG-SOO
发明人： AN JUNG-SOO
IPC分类号： B24B53/12
CPC分类号： B24B53/017
摘要： A CMP pad conditioner is used in global planar izat ion of wafers for high integration of semiconductor devices. The CMP pad conditioner includes a frame fixing abrasive particles to prevent the abrasive particles from being detached from the conditioner, the abrasive particles protruding from the fixing frame at a predetermined height, and a molding material fixing the fixing frame and the abrasive materials to each other. The abrasive particles are placed inside the through-holes, by one abrasive particle in one through-hole, and each of the abrasive particles is partially exposed from the underside surface of the fixing frame. The conditioner can ensure stability of prevent abrasive particles from being detached, realize uniform dressing, excellent dressing efficiency and excellent performance reproducibility, and remarkably remove the probability of scratches.
摘要翻译： CMP衬垫修整器用于晶圆的整体平面化，以实现半导体器件的高集成度。 CMP抛光垫修整器包括：框架，固定磨粒以防止磨粒从修整器脱落，磨粒从固定框架突出预定高度;以及成型材料，将固定框架和磨料彼此固定。磨粒通过一个通孔中的一个磨粒被放置在通孔内部，并且每个磨粒从固定框架的下表面部分地暴露。该调理剂可以确保防止研磨颗粒脱落的稳定性，实现均匀的修整，优异的修整效率和优异的性能再现性，并显着消除划痕的可能性。

10. 发明公开

KR20180042736A 화학적 기계적 연마 방법, 반도체 소자의 제조 방법, 및 반도체 제조 장치 审中-公开
公开(公告)号：KR20180042736A
公开(公告)日：2018-04-26
申请号：KR20160135263
申请日：2016-10-18
申请人： EHWA DIAMOND IND CO LTD , SAMSUNG ELECTRONICS CO LTD
发明人： HONG MYUNG KI , KIM YUNG JUN , PARK SUNG OH , LEE HYO SAN , LEE JOO HAN , OH KYU MIN , PARK SUN GYU , LEE SEH KWANG , YANG CHAN KI
IPC分类号： H01L21/304 , H01L21/306 , H01L21/56 , H01L21/66 , H01L21/78
CPC分类号： B24B53/017 , B24B37/005 , B24B37/042 , H01L21/3212 , H01L21/76802 , H01L21/7684 , H01L21/76843 , H01L21/76877 , H01L22/20
摘要： 본발명의기술적사상은연마패드를준비하는단계, 상기연마패드를컨디셔닝하는동안컨디셔닝디스크에인가될하중인제1 하중및 상기제1 하중이인가되었을때 상기컨디셔닝디스크의팁들이상기연마패드로절입되는깊이인제1 절입깊이를결정하는단계, 컨디셔닝디스크를준비하는단계, 및준비된상기컨디셔닝디스크를상기연마패드상에위치시키고, 상기컨디셔닝디스크에상기제1 하중을가하면서상기컨디셔닝디스크를이용하여상기연마패드의표면을컨디셔닝하는단계를포함하는화학적기계적연마방법을제공한다.

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