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1. 发明申请

WO2005033376A2 PLATING METHOD AND APPARATUS 审中-公开
标题翻译：电镀方法和装置
公开(公告)号：WO2005033376A2
公开(公告)日：2005-04-14
申请号：PCT/JP2004/014698
申请日：2004-09-29
申请人： EBARA CORPORATION , KURIYAMA, Fumio , KIUMI, Rei , SAITO, Nobutoshi , TAKEMURA, Takashi , KIMURA, Masaaki , TAKEDA, Sachiko , GUO, Yugang
发明人： KURIYAMA, Fumio , KIUMI, Rei , SAITO, Nobutoshi , TAKEMURA, Takashi , KIMURA, Masaaki , TAKEDA, Sachiko , GUO, Yugang
IPC分类号： C25D5/34
CPC分类号： C23C18/182 , B05B13/0228 , C23C18/1632 , C23C18/1689 , C23C18/18 , C23C18/1824 , C23C18/1837 , C25D5/34 , C25D5/48 , C25D7/123 , C25D17/001 , H01L21/288 , H05K3/241 , H05K3/244
摘要： A plating apparatus (1) has a steam treatment chamber (18) configured to perform a steam treatment using steam on a surface of a substrate (W), and a plating chamber (24) configured to plate the surface of the substrate subjected to the steam treatment. The plating apparatus also has an acid treatment chamber (20) configured to bring the surface of the substrate subjected to the steam treatment into contact with an acid liquid. The plating apparatus includes a frame (2) housing the steam treatment chamber (18), the acid treatment chamber (20), and the plating chamber (24).
摘要翻译：电镀装置（1）具有蒸汽处理室（18），其被配置为在基板（W）的表面上使用蒸汽进行蒸汽处理，以及电镀室（24），其被配置为对经受蒸汽处理。电镀装置还具有将处于蒸汽处理的基板的表面与酸性液体接触的酸处理室（20）。电镀装置包括容纳蒸汽处理室（18），酸处理室（20）和电镀室（24）的框架（2）。

2. 发明申请

WO2004081261A3 PLATING APPARATUS 审中-公开
公开(公告)号：WO2004081261A3
公开(公告)日：2004-09-23
申请号：PCT/JP2004/003040
申请日：2004-03-09
申请人： EBARA CORPORATION , KURIYAMA, Fumio , TAKEMURA, Takashi , SAITO, Nobutoshi , KIMURA, Masaaki, , KIUMI, Rei
发明人： KURIYAMA, Fumio , TAKEMURA, Takashi , SAITO, Nobutoshi , KIMURA, Masaaki, , KIUMI, Rei
IPC分类号： H01L21/288
摘要： The present invention is concerned with a plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connected to electrodes of a package, on a surface of a semiconductor wafer. The plating apparatus (170) has a plating tank (186) for holding a plating solution (188), a holder (160) for holding a workpiece (W) and bringing a surface to be plated of the workpiece into contact with the plating solution (188) in the plating tank (186). A ring-shaped nozzle pipe (220) having a plurality of plating solution injection nozzles (222) for injecting the plating solution (188) to the surface to be plated of the workpiece held by the holder (160) to supply the plating solution (188) into the plating tank (186), or a stirring mechanism having a stirring vane are disposed in the plating tank (186).

3. 发明申请

WO2004107422A2 PLATING APPARATUS AND PLATING METHOD 审中-公开
标题翻译：电镀设备和电镀方法
公开(公告)号：WO2004107422A2
公开(公告)日：2004-12-09
申请号：PCT/JP2004/007437
申请日：2004-05-25
申请人： EBARA CORPORATION , SEKIMOTO, Masahiko , ENDO, Yasuhiko , STRAUSSER, Stephen , TAKEMURA, Takashi , SAITO, Nobutoshi , KURIYAMA, Fumio , YOSHIOKA, Junichiro , HORIE, Kuniaki , MINAMI, Yoshio , KAMODA, Kenji
发明人： SEKIMOTO, Masahiko , ENDO, Yasuhiko , STRAUSSER, Stephen , TAKEMURA, Takashi , SAITO, Nobutoshi , KURIYAMA, Fumio , YOSHIOKA, Junichiro , HORIE, Kuniaki , MINAMI, Yoshio , KAMODA, Kenji
IPC分类号： H01L21/288
CPC分类号： C25D5/022 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/67173 , H01L21/6723 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/1147 , H01L2224/13099 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2224/05647 , H01L2924/00014
摘要： A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.
摘要翻译：电镀装置具有灰化单元（300），其被配置为对施加在形成在基板（W）上的籽晶层（500）的表面上的抗蚀剂（502）和预润湿部分（26）进行灰化处理，被配置为在灰化过程之后向基板的表面提供亲水性。电镀装置包括预浸渍部分（28），其被配置为使基材的表面与处理溶液接触以清洁或活化形成在基材上的种子层的表面。电镀装置还包括电镀单元（34），其被配置为在将抗蚀剂用作掩模的同时使基板的表面进入电镀槽中的镀液中，以在该表面上形成镀膜（504）种子层形成在基底上。

4. 发明公开

EP1524338A1 PLATING DEVICE 审中-公开
标题翻译： ABSCHEIDUNGSVERFAHREN
公开(公告)号：EP1524338A1
公开(公告)日：2005-04-20
申请号：EP03765327.6
申请日：2003-07-18
申请人： Ebara Corporation
发明人： YAJIMA, Toshikazu , TAKEMURA, Takashi , KIUMI, Rei , SAITO, Nobutoshi , KURIYAMA, Fumio , KIMURA, Masaaki
IPC分类号： C25D21/12
CPC分类号： C25D21/12 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/008
摘要： A plating apparatus according to the present invention has a plating tank (40) for holding a plating solution (10), an anode (56) disposed so as to be immersed in the plating solution (10) in the plating tank (40), a regulation plate (60) disposed between the anode (56) and a plating workpiece (W) disposed so as to face the anode (56), and a plating power supply (24) for supply a current between the anode (56) and the plating workpiece (W) to carry out plating. The regulation plate (60) is disposed so as to separate the plating solution (10) held in the plating tank (40) into a plating solution on the anode side and a plating solution on the plating workpiece side, and a through-hole group (68) having a large number of through-holes (66) is formed in the regulation plate (60).
摘要翻译：根据本发明的电镀装置具有用于保持电镀液（10）的电镀槽（40）和设置成浸在电镀槽（40）中的电镀液（10）中的阳极（56）设置在阳极（56）和与阳极（56）相对设置的电镀工件（W）之间的调节板（60），以及电镀电源（24），用于在阳极（56）和电镀工件（W）进行电镀。调整板60被配置为将保持在镀槽（40）中的电镀液（10）分离成在阳极侧的电镀液和电镀工件侧的电镀液，以及通孔组在所述调节板（60）中形成具有大量通孔（66）的多个（68）。

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